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Tuesday 12th June 2007
Electronic component orders took a small dip in May, according to the four-to-five week average index compiled by the Electronic Components, Assemblies & Materials Association (ECA).
Monday 11th June 2007
Tronics Microsystems and Alcatel Micro Machining Systems have announced a joint development project (JDP) on DRIE for extreme-performance MEMS.
Monday 11th June 2007
In a move that will greatly broaden global access to its water jet-guided laser technology, Synova has revealed it has entered into a partnership with Disco Hi-Tec Europe. ;;
Monday 11th June 2007
Mentor Graphics Corporation has announced it has acquired Sierra Design Automation.
Friday 8th June 2007
Nanometrics Incorporated has announced that the company has completed the divestiture of its DiVA and Yosemite product lines.
Friday 8th June 2007
Signet Solar has announced plans to establish significant thin-film solar module manufacturing capabilities in India.
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Friday 8th June 2007
Tegal Corporation has announced it had received an order for an Endeavor AT PVD cluster tool from a top-tier MEMS foundry located in Europe.
Thursday 7th June 2007
After posting two consecutive years of strong growth, the semiconductor photomask market slowed in 2006, according to the report: Mask Making, Inspection, and Repair: Market Analysis and Strategic Issues, recently published by The Information Network.
Thursday 7th June 2007
Advanced Photonix, Inc has announced the completion of the company's new multi-million dollar, 5,000 square foot microfabrication facility for R&D and manufacturing of optoelectronic semiconductors.
Thursday 7th June 2007
Williams Advanced Materials (WAM) has announced expansion of its operations into Europe with the opening of a new precision cleaning and reconditioning services facility in the Czech Republic.
Thursday 7th June 2007
Tensilica, Inc., has announced that two Korean universities have licensed its Xtensa configurable processor.
Thursday 7th June 2007
UMC and ARM announced that a test chip built with ARM SOI (Silicon On Insulator) libraries was taped-out successfully on UMC's 65-nanometer (nm) SOI process.
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Wednesday 6th June 2007
IBM has announced new semiconductor products that leverage several IBM-generated chip technology breakthroughs.
Wednesday 6th June 2007
Air Liquide has just signed two agreements with major Russian semiconductor manufacturing company, Mikron. ;;
Wednesday 6th June 2007
Castle & Cooke, Inc. has announced that it has signed a contract through its subsidiary, Lana`i Sustainability Research, LLC, to build the largest solar photovoltaic farm in Hawai`i and the fourth largest in the United States.
Wednesday 6th June 2007
Point 35 Microstructures, a European company has announced that it has received significant initial equity funding from Close Ventures.
Wednesday 6th June 2007
Macy's has announced it will install solar power systems and significantly reduce energy consumption in 26 stores throughout California in partnership with SunPower Corporation.;;
Wednesday 6th June 2007
Integrated Dynamics Engineering (IDE), Inc., has agreed to sell its well-established end user line of wafer packers and wafer sorters to Austrian company, Ricmar Technology.
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Wednesday 6th June 2007
Mentor Graphics Corporation and Taiwan Semiconductor Manufacturing Company, have announced that Mentor's design-for-manufacturing (DFM) and design-for-test (DFT) tools have been incorporated into TSMC Reference Flow 8.0.
Wednesday 6th June 2007
Rohm and Haas Electronic Materials celebrated the official opening of its new five-story Chonan R&D Centre in, May. Local customers and government officials were among the guests.
Tuesday 5th June 2007
The European semiconductor market declined 2.3% in April, compared to March, on a 3 month rolling average, in line with the worldwide trend. Data suggest negative developments in the average selling prices for some of the major product categories, such as DRAMS, microprocessors and logic chips.
Tuesday 5th June 2007
Air Liquide has announced the inauguration of the Group's new US Research and Technology Centre located in Delaware.
Tuesday 5th June 2007
NXP has announced collaboration with Taiwan-based design house, Afa Technologies to develop ultra-low power DVB-T front-end solutions for portable devices.
Tuesday 5th June 2007
FormFactor Inc has announced a major milestone for its Takumi parametric wafer probe card, which has now been adopted by 20 leading device manufacturers worldwide.

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