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Tuesday 29th May 2007
Sierra Design Automation has launched several new variations to its place and route (P&R) platform addressing critical 45nm design challenges.
Tuesday 29th May 2007
Brion Technologies has announced the availability of Tachyon Lithography Aware Design (LAD), an extension of the company's Tachyon suite for optical proximity correction (OPC) verification and OPC application.
Tuesday 29th May 2007
Oki Electric Industry Co. has announced it has succeeded in developing what is thought to be the world’s first ultra small DSRC (Dedicated Short Range Communication)(1) wireless module for embedding in mobile phones to be used for DSRC inter-vehicle communication systems.
Tuesday 29th May 2007
DAFCA Incorporated has announced that Infineon Technologies has successfully employed their ClearBlue Silicon Validation Suite (SVS) in the implementation of a new high-speed serial ATA platform chip.
Tuesday 29th May 2007
Sonics has announced a working partnership with JEDA Technologies to deliver validated SystemC models of Sonics SMART Interconnect solutions.
Tuesday 29th May 2007
KLA-Tencor Corporation has announced it has completed its acquisition of Therma-Wave.
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Saturday 26th May 2007
Allectra is a vacuum components manufacturer and distributor offering a range of components for high vacuum and UHV including Feedthroughs, Wires and Cables, Viewports, Fibre Optics for Vacuum, Motors, Vacuum Chambers, Flanges and Fittings. Additionally Allectra offers explosion bonded Aluminium to Stainless Steel transitions now in use on several synchrotrons. Allectra's product range spans more than 1000 products for use on vacuum systems of all types.
Saturday 26th May 2007
Oerlikon Leybold Vacuum offers a broad range of advanced vacuum solutions for use in manufacturing and analytical processes, as well as for research purposes. The Segment’s core capabilities centre on the development of application- and customer-specific systems for the creation of vacuums and extraction of processing gases. Areas of application are to be found in the coating of microchips, CDs and DVDs during production, as well as in the manufacturing of optical glass that can only be coated in a vacuum.
Friday 25th May 2007
WJ Communications, Inc. has announced that it has sold its wafer manufacturing equipment and entered into a technology license and foundry agreement with AmpTech, Inc.
Friday 25th May 2007
Fujitsu Limited (Fujitsu), Fujitsu Microelectronics of America, Inc. (FMA), and Jazz Semiconductor, Inc. (Jazz announced that they will work together to manufacture System-on-Chip (SoC) products for RFCMOS devices.
Friday 25th May 2007
Sequence Design has announced a collaborative effort with Mentor Graphics that has resulted in an integrated electronic system level (ESL) power exploration flow.
Thursday 24th May 2007
Brion Technologies in collaboration with Japan's Semiconductor Technology Academic Research Centre (STARC) will work to develop and test a complete design-for-manufacturing (DFM) workflow.
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Thursday 24th May 2007
Dialog Semiconductor Plc and E Ink Corporation have both announced the launch of new products resulting from a strategic partnership that will open up new markets for electronic paper displays (EPD). ;;
Thursday 24th May 2007
Hynix Semiconductor Inc. (Hynix) has entered into a strategic partnership with IMEC to perform research and development for the (sub)-32nm memory process generations.
Thursday 24th May 2007
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Thursday 24th May 2007
Akustica, Inc. and DALSA Corporation's have announced the formation of a strategic silicon foundry relationship.
Thursday 24th May 2007
EV Group (EVG) has successfully installed an EVG620 mask aligner at Danchip.
Wednesday 23rd May 2007
TechnoConcepts has announced an important milestone in the implementation of reconfigurable radio for high volume commercial markets.
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Wednesday 23rd May 2007
Intel Corporation has announced that its future processors, beginning with its entire family of 45 nanometre (nm) high-k metal gate (Hi-k) processors, are going 100 percent lead-free.
Wednesday 23rd May 2007
AMD and Taiwan Semiconductor Manufacturing Company, have announced AMD has selected TSMC's 65nm process for a broad segment of its graphics processing unit (GPU) product lineup.
Wednesday 23rd May 2007
Nanoident Technologies has announced that it has delivered what is thought to be the world's largest printed semiconductor-based photodetector array on a flexible PET foil substrate.
Wednesday 23rd May 2007
In a move that signals a firm and ongoing commitment to future technology development, IBM and its joint-development alliance partners Infineon Technologies and Freescale Semiconductor along with its Common Platform technology partners Chartered Semiconductor Manufacturing and Samsung Electronics, have signed a series of semiconductor process development and manufacturing agreements.
Wednesday 23rd May 2007
Inficon has been awarded an order of USD 2.3 million from a major memory chip manufacturer in Taiwan for multiple in situ metrology sensors, FabGuard advanced process software, and high performance leak detectors.
Wednesday 23rd May 2007
Oki Electric Industry Co and Takasago Thermal Engineering Co. have announced their agreement to form an alliance in information and telecommunication equipment.

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