Carl Zeiss SMT and Intellection Pty have announced a long-term strategic agreement reinforcing the successful co-operation between the two companies. The agreement defines the relationship for the development and supply of Carl Zeiss SMT's Scanning Electron Microscope (SEM) for use in the Intellection's QEMSCAN automated quantitative mineralogy system.
Twenty years after two IBM scientists won the Nobel Prize in Physics for their design of the Scanning Tunnelling Microscope (STM), which opened the world to individual atoms for the first time, scientists and engineers from IBM Research continue to break new ground in so-called nanotechnology.
IBM Corp. and Infineon Technologies have announced an agreement in principle to divest their shares in Altis Semiconductor with its manufacturing site in Corbeil-Essonnes, France, via a sale to Advanced Electronic Systems (AES).
DEK has announced a new strategic partnership with BTU International, an alliance which will see the two technology companies deliver complete in-line metallisation process solutions for solar cell manufacturers.
LSI Corporation has announced that it has joined The Green Grid, a non-profit consortium of information technology companies and professionals seeking to lower the overall consumption of power in data centres around the globe.
Mentor Graphics Corporation has announced an agreement with the College of Automotive Engineering of Tongji University, China to set up a Joint Lab and Technical Training Centre for Auto Electronic System Design in Shanghai.
Showcasing embedded design innovation among engineering students in China, Freescale Semiconductor has staged the finals of the Freescale Cup National Smart Car University Design Competition at Shanghai Jiaotong University.
The Advanced Technologies and Ventures Business for Dow Corning Corporation has been awarded a U.S. patent on a new method for making low dielectric constant (low-k) silicon carbide (SiC) and hydrogenated silicon oxycarbide (H:SiOC) thin films.
Eyelit, Inc. has announced that a Photovoltaic (PV) Solar Cell producer has selected Eyelit's Enterprise Manufacturing Execution Suite to support manufacturing of Copper Indium Gallium Selenide (CIGS) Solar Panel Production.
In the recent 7 years of semiconductor manufacturing the industry went through a significant technology node. An increase in size of the silicon wafer, to 300 mm, was adopted to increment productivity.
German engineering conglomerate Siemens has said that its Power Transmission & Distribution unit plans to create a joint venture with Infineon Technologies for the development and production of power semi-conductors.