Advancing its 32-bit technology in the automotive and embedded markets, Freescale Semiconductor has introduced a highly integrated system-on-chip (SoC) processor optimised for high-performance, power-sensitive applications requiring complex graphics, multimedia and real-time audio processing.
Applied Photonics, Inc. (AP) has announced that it has installed its LaserMagic TFT-LCD glass cutting equipment at one of world's largest TFT panel suppliers in Taiwan and that the system has been used successfully in production for over six months.
United States Export-Import Bank (Ex-Im Bank) has guaranteed a $610 million loan approved by the Bank's board of directors which will finance U.S. exports of wafer fabrication equipment to expand Chartered Semiconductor Mfg.'s Fab 7 facility in Singapore.
AmberWave Systems has joined three other New Hampshire-based organizations, as well as more than 100 additional signatories, including universities, venture capital firms, small and large technology businesses, and research parks across the U.S. to voice their concern with certain provisions of patent reform legislation currently under consideration by Congress.
Anchor Semiconductor and Semiconductor Manufacturing International Corporation (SMIC) have jointly announced the expanded applications and commitment of Anchor's NanoScope Platform solutions in SMIC's advanced manufacturing flows at 65nm node and beyond.
Mentor Graphics Corporation has announced that UMC has expanded its support for the Calibre nm Platform with Calibre YieldAnalyser for all major design flows for its 90 nanometre (nm) and 65nm processes.
Extreme DA and Semiconductor Technology Academic Research Centre (STARC) are collaborating to jointly develop and validate a variability-aware timing analysis flow for integrated circuits (ICs) manufactured in 65- and 45-nanometer (nm) processes.
Members of the International SEMATECH Manufacturing Initiative (ISMI) have agreed to draft a "green fab standard" aimed at building semiconductor factories that will use less energy and water, minimise waste and air pollution, and ultimately save money for chip-makers.
STATS ChipPAC has announced plans to establish a new research and development (R&D) facility located in Singapore which will be dedicated to developing next generation technology including through silicon via (TSV) and microbump bonding for three dimensional (3D) die, silicon substrate based packaging solutions, and embedded active die technology.
FSI International has announced that the U.S. Patent and Trademark;Office has awarded the company a patent for a method which produces ultra-uniform etch results in combination with a rinse/dry step in a single immersion tank for front-end-of-line (FEOL) critical cleans