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Monday 4th June 2007
GenISys has announced that it has formed a technology development partnership with JEOL, and Cornell University’s Nanoscale Science and Technology Facility.
Monday 4th June 2007
German company Rena has announced plans to take over Hollmuller Maschinenbau (Hollmuller) also a German company.
Monday 4th June 2007
The global semiconductor market is expected to grow 2.3 percent on an annualised basis to $253.5 billion in 2007, according to the spring 2007 forecast of the World Semiconductor Trade Statistics (WSTS).
Friday 1st June 2007
INFICON has acquired the assets of Maxtek Inc.
Friday 1st June 2007
Chad Industries Inc has announced that it has been qualified by Applied Precision as their recommended EFEM (Equipment Front-End Module) supplier for their waferWoRx300 probing process analysis system.
Friday 1st June 2007
Using hydrogen as a vector of energy is a promising alternative fuel solution for motor vehicles.
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Friday 1st June 2007
Air Liquide has announced that, with effective from the end of May 2007, the business activities of Linde Gas UK have been transferred to the Air Liquide Group.
Friday 1st June 2007
CCMP Capital has announce the completion of its acquisition of BOC Edwards
Friday 1st June 2007
Berkeley Design Automation, Inc has announced that Newport Media has adopted the company's Analogue FastSPICE circuit simulator.
Friday 1st June 2007
Concept Engineering has announced that DAFCA, Inc has selected Concept Engineering's Nlview visualization engine to build a graphical debugging cockpit for its ClearBlue Silicon Validation Platform.
Friday 1st June 2007
Broad adoption of NAND flash memory technology in the PC platform received a boost with the formation of the Non-Volatile Memory Host Controller Interface (NVMHCI) Working Group.
Thursday 31st May 2007
Berkeley Design Automation, Inc has announced that Luminary Micro has chosen the company's Analog FastSPICE circuit simulator for full-circuit verification as well as to verify complex blocks 5x-10x faster – both with full SPICE accuracy.
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Thursday 31st May 2007
The Fab Owners Association (FOA has announced the addition of three new device maker members: austriamicrosystems, Avago Technologies and X-FAB.
Thursday 31st May 2007
SVTC Technologies has announced a strategic technology incubation program with Taiwan Semiconductor Manufacturing Company (TSMC)
Thursday 31st May 2007
Obducat have recently announced the winning nominations for its annually awarded competition to honour innovative developments in industrial applications based on Nano Imprint Lithography.
Thursday 31st May 2007
ASML Holding (ASML) has announced that it will further optimize its capital structure through a return of approximately EUR 960 million to shareholders in combination with a reverse stock split.
Thursday 31st May 2007
Aviza Technology, Inc. has announced it received a multiple system order for its Omega i2L etch system a major Taiwan semiconductor packaging and test company.
Wednesday 30th May 2007
OneSpin Solutions has announced that it has accepted an invitation from standards body Accellera to become a member and serve on the Unified Coverage Interoperability Standard (UCIS) Technical Subcommittee.
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Wednesday 30th May 2007
Praxair (China) Investment Co. has started up a new 400-tons-per-day air separation plant for LianZhong (GZ) Stainless Steel Corp (LianZhong) in Guangzhou, South China.
Wednesday 30th May 2007
MainConcept has announced that it has signed a partnership agreement with InterQoS, a semiconductor company based in Hong Kong, to jointly develop and market a complete embedded solution capable of addressing the needs of mobile video gadgets.
Wednesday 30th May 2007
Samsung Electronics Co. has announced that it has developed a four gigabyte (GB) MCP (multi-chip package) for mobile phones, an industry first, forgoing the need for an external memory card slot and also eliminating the need to develop interface software for all types of NAND memory.
Wednesday 30th May 2007
Reported in the new Strategy Analytics study, "Automotive Semiconductor Vendor 2006 Market Shares" the automotive electronics industry saw an increase of $1.12 billion in chip vendor revenues in 2006 in compared to 2005.
Wednesday 30th May 2007
Tegal Corporation has announced that a major European integrated device manufacturer had placed an order with the Company for three additional new 6540 advanced plasma etch systems.
Wednesday 30th May 2007
Vivace Semiconductor has announced it has signed an agreement with the IGRS Engineering Lab, to jointly develop reference designs based on Vivace's chips that can be used to develop products that are compliant with the new home networking standard.

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