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Thursday 8th February 2007
Corning Incorporated announced that its board of directors has approved a capital expenditure plan of $160 million to further expand its capacity to manufacture large size glass substrates for active matrix liquid crystal displays (LCD) at its facility in Shizuoka, Japan.
Thursday 8th February 2007
Semiconductor Research Corporation (SRC has announced that Tokyo Electron Limited (TELhas joined the consortium's community of 23 companies and partners plus 100 universities worldwide.
Thursday 8th February 2007
Axcelis Technologies, Inc. has received a significant follow-on order for over 10 RadiantStrip 320 photoresist dry strip systems from a major memory device manufacturer.
Thursday 8th February 2007
Rim Semiconductor Company has completed a representative agreement with Axellence, launching sales and marketing programs in Austria, Belgium, Germany, Greece, Italy, Netherlands, Slovenia, and Switzerland.
Thursday 8th February 2007
NEC Corporation and Ubiquisys Ltd have announced a strategic collaboration to deliver femtocell solutions worldwide.
Wednesday 7th February 2007
Asyst Technologies, Inc. has announced several organizational changes to unify the company under a single global structure.
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Wednesday 7th February 2007
EV Group (EVG) announced it has formed a collaborative product development partnership with GenISys for the development and marketing of a simulation platform for advanced mask aligner lithography processes.
Wednesday 7th February 2007
Micralyne Inc has broken ground on a facility expansion that will increase its manufacturing capacity to accommodate its growing customer base.
Tuesday 6th February 2007
Front-end engineers at SEMATECH will combine planar CMOS approaches with new channel materials to develop effective transistors for the 22 nm half-pitch technology generation – but will continue to investigate FinFET devices as an alternative approach.
Tuesday 6th February 2007
Wind River Systems, Inc. has announced a new collaboration with Texas Instruments Incorporated (TI) to enable Wind River’s Linux-based device software platform and Wind River Workbench development tools, including Wind River Workbench On-chip Debugging tools, on TI’s OMAP2430 applications processor for handsets and personal digital assistants (PDAs).
Tuesday 6th February 2007
ClearSpeed Technology has announced that the company is part of a $1.4 million contract to provide the first national supercomputer to South Africa's Centre for High Performance Computing (CHPC).
Tuesday 6th February 2007
Forza Silicon and Tower Semiconductor have announced that they are expanding their relationship to design and produce mixed signal and image sensor chips utilizing Tower's process and design technology capabilities.
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Tuesday 6th February 2007
Seiko Epson Corp. ("Epson has purchased an MA200Compact Mask Aligner from SUSS MicroTec to support their Wafer Level Chip Scale Packaging (W-CSP) production.
Monday 5th February 2007
A future marred by stronger storms, rising sea levels and a dramatic increase in global temperatures unless stronger efforts are made to reduce carbon emissions is depicted in the new report by the U.N. Intergovernmental Panel on Climate Change. But with today's business models generating tremendous strain on the environment, how can free-market capitalism be reconciled with the need for more sustainable business practices?
Monday 5th February 2007
Taiwan Semiconductor Manufacturing Company, Inc. announced that it has opened an office in Bangalore, India.
Monday 5th February 2007
Spansion Inc has announced its Submicron Development Centre (SDC), the R&D headquarters for Spansion and the nucleus of the advanced manufacturing process for all Spansion Flash products lines, has successfully completed its transition from 200mm to 300mm.
Monday 5th February 2007
Spansion Inc has announced its Submicron Development Centre (SDC), the R&D headquarters for Spansion and the nucleus of the advanced manufacturing process for all Spansion Flash products lines, has successfully completed its transition from 200mm to 300mm.
Monday 5th February 2007
AMIS Holdings, Inc has announced a restructuring plan to reduce costs through a consolidation of design centres and a workforce reduction.
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Friday 2nd February 2007
Synova has announced tool orders from a Korean organic light-emitting diode (OLED) manufacturer and U.S.-based semiconductor manufacturer's Korean facility.
Friday 2nd February 2007
The SEZ Group has announced that a major Korean semiconductor manufacturer has placed a multiple-system order for SEZ's Da Vinci family of tools after successful beta test results revealed increased productivity, performance and cost-savings advantages.
Friday 2nd February 2007
FormFactor announced that Hynix Semiconductor has placed a multi-million-dollar order for FormFactor's Harmony OneTouch probe cards for Flash memory production.
Friday 2nd February 2007
As a key part of its new 150mm MEMS foundry, Semefab has selected memsstar systems as the preferred solution for advanced release etching.
Friday 2nd February 2007
The Semiconductor Industry Association (SIA) has reported that global sales of semiconductors reached a record $247.7 billion in 2006.
Friday 2nd February 2007
NXP Semiconductors, formerly Philips Semiconductors, and Advanced Semiconductor Engineering, Inc. have announced the signing of a Memorandum of Understanding to form a joint venture (JV) in Suzhou, China focused on semiconductor testing and packaging.

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