SEMATECH and Tokyo Electron Limited (TEL) have launched a multi-year joint development program aimed at improving the prospects for using 3D interconnect technology and high mobility channel materials in advanced semiconductor manufacturing.
Texas Instruments (TI) has reported recorded record revenues and increased profits but express fears of weaker demand leading to a reduction of 500 staff by closing an older fab in their home Dallas base with a suggestion that development will move to Asia to be closer to foundry partners.
Silicon Valley Solar announced that they have finalized an agreement with GSS (Gebäude-Solarsysteme) to produce Sol-XTM Flat-Plate Concentrator Modules at their Fully Certified Facility in Eastern Germany.
Oki Electric Industry Co., Ltd. and ZyCube Co., Ltd. have announced an agreement to cooperate in commercializing ZyCSP, an image sensor LSI with buried interconnects (also called TSV (Through Silicon Via)) that is equivalent in size to a wafer level chip size package(CSP).
Sun Microsystems, Inc. and Intel Corporation have announced a broad strategic alliance centred on Intel's endorsement of the Solaris* Operating System (OS) and Sun's commitment to deliver a comprehensive family of enterprise and telecommunications servers and workstations based on Intel Xeon processors.
Blaze DFM has been chosen by the Semiconductor Technology Academic Research Centre (STARC) to provide leakage power optimization software that will be integrated into the STARCAD-CEL (Certified Engineering Linkage, one step ahead of DFM) reference design methodology.
Veeco Instruments Inc. has announced that the European Patent Office in Munich, Germany has ruled in its favour and has dismissed the opposition filed by Asylum Research Inc. against Veeco's European Patent No. 839,312 (the '312 patent).
Berkeley Design Automation Inc has announced it has established a wholly-owned subsidiary, Berkeley Design Automation KK (BDA KK), in Japan. BDA KK will provide direct sales and technical support to better serve the company's rapidly expanding Japanese customer base.
Hoku Materials, a division of Hoku Scientific, Inc. has announced the signing of a definitive contract with Sanyo Electric Company, Ltd., for the sale and delivery of polysilicon to SANYO over a seven-year period beginning in January 2009.
The Open NAND Flash Interface (ONFI) Working Group, an organization dedicated to simplifying integration of NAND Flash memory into consumer electronics (CE) devices, computing platforms and industrial systems, has announced the availability of the ONFI 1.0 specification. The chip-level standard interface simplifies Flash controller design, which facilitates the integration of a wide range of NAND Flash components into diverse end-use applications.
SoftJin and Cswitch Corporation announced the companies are setting up of an Off-Shore Development Centre (ODC) in India to focus on developing customized EDA tools for customers and for in-house use of Cswitch.
Cabot Microelectronics Corporation announced that it filed a legal action against DuPont Air Products NanoMaterials LLC (DA Nano) for DA Nano's manufacture and marketing of certain CMP slurries that infringe patents owned by Cabot Microelectronics.
According to data in IC Insights¹ 2007 edition of The McClean Report, A Complete Analysis and Forecast of the Integrated Circuit Industry, fabless IC suppliers secured 20% of worldwide IC sales in 2006, an increase from just under 10% of the total IC market in 2000.