Royal Philips Electronics and Taiwan Semiconductor Manufacturing Company Ltd have jointly announced that the companies have agreed to a multi-phased plan to facilitate an orderly exit by Philips from its current shareholding in TSMC.
The future of 193 nm immersion (193i) lithography will be driven by the demonstration of a high-index lens material, invention of a third generation immersion fluid, and development of a high-index photoresist, SEMATECH-sponsored scientists reported at last week's SPIE Advanced Lithography Symposium.
With the joint support of National Basic Research Program (973 Program), the National Natural Science Foundation of China, and CAS Knowledge Innovation Program between 04/2002 and 09/2006, a research team led by Prof. HAN Xiufeng from the CAS Institute of Physics has recently developed a demo device for a new type of MRAM.
Silicon Valley Technology Centre (SVTC) announced that it is now an independent company, having closed its previously announced purchase by two private equity firms. SVTC, formerly a business unit of Cypress Semiconductor Corp. was sold to Oak Hill Capital Partners and Tallwood Venture Capital.
Freescale Semiconductor is setting up a pilot production line at its facility in Tempe, Ariz. for its recently announced Redistributed Chip Packaging (RCP) technology in preparation for volume manufacturing.