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Monday 29th January 2007
Magma Design Automation Inc. announced expanding operations in India and the United States.
Friday 26th January 2007
Polymer Vision has announced its cooperation with Innos (UK) to establish a production facility for organic semiconductor based rollable displays.
Friday 26th January 2007
IBM and Dassault Systèmes (DS) have announced a significant expansion of their 25-year partnership.
Friday 26th January 2007
The semiconductor lithography market reached $6.7 billion in 2006, finally eclipsing the $6.0 billion market reached back in 2000, according to the report "Sub-100nm Lithography: Market Analysis and Strategic Issues," recently published by The Information Network
Friday 26th January 2007
IBM and Ricoh have announced the formation of a joint venture company based on IBM's Printing Systems Division.
Friday 26th January 2007
SEMATECH and Tokyo Electron Limited (TEL) have launched a multi-year joint development program aimed at improving the prospects for using 3D interconnect technology and high mobility channel materials in advanced semiconductor manufacturing.
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Friday 26th January 2007
Management Dynamics, Inc has announced an expansion of its operations in Asia Pacific.
Friday 26th January 2007
Mayfield Fund has announced the closing of a $200 million fund, dedicated to investing in China.
Wednesday 24th January 2007
Texas Instruments (TI) has reported recorded record revenues and increased profits but express fears of weaker demand leading to a reduction of 500 staff by closing an older fab in their home Dallas base with a suggestion that development will move to Asia to be closer to foundry partners.
Wednesday 24th January 2007
The MEMS Industry Group (MIG), a trade association representing the microelectromechanical systems (MEMS) and microstructures industries, has released an annual industry report.
Wednesday 24th January 2007
Silicon Valley Solar announced that they have finalized an agreement with GSS (Gebäude-Solarsysteme) to produce Sol-XTM Flat-Plate Concentrator Modules at their Fully Certified Facility in Eastern Germany.
Wednesday 24th January 2007
Oki Electric Industry Co., Ltd. and ZyCube Co., Ltd. have announced an agreement to cooperate in commercializing ZyCSP, an image sensor LSI with buried interconnects (also called TSV (Through Silicon Via)) that is equivalent in size to a wafer level chip size package(CSP).
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Wednesday 24th January 2007
PMC-Sierra, Inc. has announced it is increasing its presence in Greater China with the opening of a new sales and design centre in Shanghai, China.
Wednesday 24th January 2007
Solido Design Automation have announced a strategic business partnership with Aisys Corporation in Japan.
Tuesday 23rd January 2007
Sun Microsystems, Inc. and Intel Corporation have announced a broad strategic alliance centred on Intel's endorsement of the Solaris* Operating System (OS) and Sun's commitment to deliver a comprehensive family of enterprise and telecommunications servers and workstations based on Intel Xeon processors.
Tuesday 23rd January 2007
Renesas Technology Corp. has announced an agreement to invest in Key Stream Corporation, a provider of wireless LAN chipsets, and to collaborate in the field of wireless LAN solutions.
Tuesday 23rd January 2007
Hertzler Systems Inc., and TechMax have announced an agreement to jointly deliver real-time data systems to the Chinese market.
Tuesday 23rd January 2007
Blaze DFM has been chosen by the Semiconductor Technology Academic Research Centre (STARC) to provide leakage power optimization software that will be integrated into the STARCAD-CEL (Certified Engineering Linkage, one step ahead of DFM) reference design methodology.
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Tuesday 23rd January 2007
Veeco Instruments Inc. has announced that the European Patent Office in Munich, Germany has ruled in its favour and has dismissed the opposition filed by Asylum Research Inc. against Veeco's European Patent No. 839,312 (the '312 patent).
Monday 22nd January 2007
Berkeley Design Automation Inc has announced it has established a wholly-owned subsidiary, Berkeley Design Automation KK (BDA KK), in Japan. BDA KK will provide direct sales and technical support to better serve the company's rapidly expanding Japanese customer base.
Monday 22nd January 2007
Blaze DFM, Inc has announced the opening of a development and support centre in San Diego, California.
Monday 22nd January 2007
Hoku Materials, a division of Hoku Scientific, Inc. has announced the signing of a definitive contract with Sanyo Electric Company, Ltd., for the sale and delivery of polysilicon to SANYO over a seven-year period beginning in January 2009.
Monday 22nd January 2007
The Open NAND Flash Interface (ONFI) Working Group, an organization dedicated to simplifying integration of NAND Flash memory into consumer electronics (CE) devices, computing platforms and industrial systems, has announced the availability of the ONFI 1.0 specification. The chip-level standard interface simplifies Flash controller design, which facilitates the integration of a wide range of NAND Flash components into diverse end-use applications.

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