Picogiga International, a division of the Soitec Group (Euronext, Paris) and the leader of the European HYPHEN project, has announced excellent initial material characterization results surrounding gallium nitride (GaN) on compound engineered substrates, which should enable a new range of reasonably priced, high-performance radio-frequency (RF) applications.
IPextreme Inc., and Cypress Semiconductor Corp. have signed an agreement where IPextreme will sell and support Cypress' well-proven USB 2.0 high speed hub intellectual property (IP) into third-party system chips.
Inovys Corporation, provider of Design For Test (DFT) solutions for the semiconductor industry, and ISE Labs, a subsidiary of ASE Test Limited have announced that they are partnering to provide advanced test equipment and services to their fabless customers.
MunEDA a vendor for DFM-DFY design solutions and Grand Technology Inc., an EDA distributor in Taiwan have closed an exclusive distribution agreement for sales and support of MunEDA tools and solutions in the Taiwan market.
The MicroNanoWorld key application program, at Electronica 2006 consisting of a dedicated exhibition area and the World of MEMS User Forum has been announced as finalized. Nanotechnology is one of four key applications areas that will highlight electronica 2006.
SUSS MicroTec has announced the completion of another equipment purchase agreement with XinTec Inc., Taiwan, a manufacturing service provider of advanced Wafer-Level Chip Size Packaging (CSP) technology and IC Packaging to the global semiconductor market.
Corning Incorporated announced that its wholly owned subsidiary in the People's Republic of China hosted a groundbreaking ceremony for a new liquid crystal display (LCD) glass substrate finishing facility.
"Worldwide sales of semiconductors in September once again achieved a new high as electronic equipment manufacturers geared up for the fourth-quarter holiday season," said George Scalise, president of the Semiconductor Industry Association (SIA).