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Thursday 9th November 2006
Picogiga International, a division of the Soitec Group (Euronext, Paris) and the leader of the European HYPHEN project, has announced excellent initial material characterization results surrounding gallium nitride (GaN) on compound engineered substrates, which should enable a new range of reasonably priced, high-performance radio-frequency (RF) applications.
Thursday 9th November 2006
IPextreme Inc., and Cypress Semiconductor Corp. have signed an agreement where IPextreme will sell and support Cypress' well-proven USB 2.0 high speed hub intellectual property (IP) into third-party system chips.
Thursday 9th November 2006
Inovys Corporation, provider of Design For Test (DFT) solutions for the semiconductor industry, and ISE Labs, a subsidiary of ASE Test Limited have announced that they are partnering to provide advanced test equipment and services to their fabless customers.
Thursday 9th November 2006
Luxtera Inc., announced it has been awarded the Defense Advanced Research Projects Agency (DARPA) Electronic and Photonic Integrated Circuits (EPIC) Phase II contract.
Thursday 9th November 2006
UMC semiconductor foundry announced that it has delivered 65nm FPGAs to Xilinx.
Wednesday 8th November 2006
CORWIL Technology Corporation announced the addition of new services for its SIP (System in Package) and MCP (Multi-Component Packaging) Module customers.
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Wednesday 8th November 2006
PLDA, European distributors of specialized semiconductor products, has announced a distribution agreement for the pan-European region.
Wednesday 8th November 2006
Keithley Instruments, Inc. announced it has partnered with Mesatronic Group to develop advanced probe cards for semiconductor parametric testers used in RF and low current DC applications.
Wednesday 8th November 2006
Tegal Corporation announced that it had received an order for an Endeavor AT PVD cluster tool from the global leader in power conversion device manufacturing.
Wednesday 8th November 2006
MunEDA a vendor for DFM-DFY design solutions and Grand Technology Inc., an EDA distributor in Taiwan have closed an exclusive distribution agreement for sales and support of MunEDA tools and solutions in the Taiwan market.
Wednesday 8th November 2006
STMicroelectronics has announced the release of a new module that is manufactured in ST's advanced 0.15-micron CMOS EEPROM process technology.
Tuesday 7th November 2006
QinetiQ, acting as the prime and in partnership with 21 other organisations from industry, academia and the UK defence supply chain, has formed the MEMs Applications for Defence (MEAD) consortium.
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Tuesday 7th November 2006
The MicroNanoWorld key application program, at Electronica 2006 consisting of a dedicated exhibition area and the World of MEMS User Forum has been announced as finalized. Nanotechnology is one of four key applications areas that will highlight electronica 2006.
Tuesday 7th November 2006
SUSS MicroTec has announced the completion of another equipment purchase agreement with XinTec Inc., Taiwan, a manufacturing service provider of advanced Wafer-Level Chip Size Packaging (CSP) technology and IC Packaging to the global semiconductor market.
Monday 6th November 2006
IMEC has announced, plans to expand its R&D collaborations with Indian semiconductor companies and institutes.
Monday 6th November 2006
Applied Materials, Inc. has announced that it has agreed to purchase the assets of Brooks Software, a division of Brooks Automation, Inc., for $125 million in cash.
Monday 6th November 2006
IMEC has announced plans to expand its R&D collaborations with Indian semiconductor companies and institutes.
Monday 6th November 2006
Intel Corporation and Micron Technology, Inc., have announced they are ahead of schedule on their development of the NAND flash memory joint venture, IM Flash Technologies.
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Monday 6th November 2006
Kulicke & Soffa Industries, Inc. have closed the previously announced purchase of Alphasem from Dover Technologies International, Inc., a subsidiary of Dover Corporation.
Monday 6th November 2006
Infineon has announced the introduction of a method that can avoid one of the most common causes of defects in the production of highly integrated semiconductor circuits:
Friday 3rd November 2006
Corning Incorporated announced that its wholly owned subsidiary in the People's Republic of China hosted a groundbreaking ceremony for a new liquid crystal display (LCD) glass substrate finishing facility.
Friday 3rd November 2006
Cymer, Inc. announced the 3000th installation of a Cymer excimer laser light source at a chipmaker.
Friday 3rd November 2006
Freescale Semiconductor has shipped more than $1 billion in flash-based, 32-bit automotive microcontrollers (MCUs) built on Power Architecture technology.
Friday 3rd November 2006
"Worldwide sales of semiconductors in September once again achieved a new high as electronic equipment manufacturers geared up for the fourth-quarter holiday season," said George Scalise, president of the Semiconductor Industry Association (SIA).

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