SRS Labs, Inc. announced it has completed restructuring its business by finalizing the sale of its semiconductor subsidiary, Valence Technology Limited ("Valence"), to Noblehigh Enterprises Inc. ("Noblehigh").
Hakuto represents NexTech’s products throughout the Asia Pacific Rim countries of Japan, Korea, Taiwan, China, Singapore and Malaysia.
The NexTStar G4 NanoScan is equipped with both brightfield and darkfield illumination and is designed to inspect unpatterned glass or patterned thin films on glass substrates of dimensions 920mm X 740mm in size. The NexTStar NanoScan will provide sub-micron inspection capability for FPD/TFT panels on patterned glass for defects 300 nanometers (0.3µ) or larger in size.
The NexTStar NanoScan G4 AOI system is scheduled to be delivered to Hakuto, Japan in the late 4th Qtr. of 2006.
NexTech’s CEO, Mr. Tony Di Napoli, states, “We are especially excited about our product line-up in the FPD market. This is a 70+ billion dollar market that has been growing at a double-digit rate year-to-year. The technology advantage that we enjoy with our inspection products allows us to compete aggressively in this market as these tools play an integral role in increasing customer yields and overall manufacturing excellence.”
European semiconductor sales showed a positive development in August over July. Shipments of Microprocessors, under the spotlight in the previous months, reported a good result, in Europe as well as across other Regions.
Worldwide sales of semiconductors reached an all-time monthly record of $20.5 billion in August, an increase of 10.5 percent from the $18.6 billion reported in August 2005, the Semiconductor Industry Association (SIA) reported.
Cypress Semiconductor Corp. launched a $160,000 global design competition that enables students who design with Cypress technology to compete regionally for Cypress innovation awards of up to $20,000 in cash and ultimately win the T.J. Rodgers Trophy, named after Cypress's president and CEO.
IMEC, Europe's leading independent nanoelectronics and nanotechnology research institute, will present together with its core partners 17 papers at the IEEE International Electron Devices Meeting this December. This is a record in number of papers at the IEDM and will, showcase the success of IMEC's global R&D efforts to create solutions for (sub-)32nm scaling.
In a speech today at the Intel Developer Forum, Intel Senior Fellow and Chief Technology Officer Justin Rattner said that during the next decade online software services, hosted by mega data centers with more than a million servers, will allow people to access personal data, media and applications from any high-performance device to play photo-realistic games, share real-time video and do multimedia data mining. This new usage model will challenge the industry to deliver the one trillion floating-point operations-per-second (teraFLOPs) of performance and terabytes of bandwidth.
The ability of radio frequency identification (RFID) technology to make the tracking and managing of assets more efficient and make inventory more visible offers an ideal solution for companies seeking to improve their manufacturing performance. At the same time, as companies strive to tighten their brand security and protect their products from counterfeiting, RFID is emerging as the optimal solution to safeguard valuable products throughout the supply chain.
European company POWERLASE, manufacturer of powerful nanosecond Q-switched, diode-pumped solid state (DPSS) lasers, has announced the purchase of its innovative Starlase lasers by the Extreme Ultraviolet Lithography System Development Association (EUVA). The lasers will be used to further the research and development specialist's findings in the field of extreme ultraviolet (EUV) sources.
Samsung announced this week that it has completed the first working prototype of a Phase-change Random Access Memory (PRAM) that Samsung believes will replace high density NOR flash within the next decade.
Magma Design Automation Inc announced it has donated specifications for its low-power technology to Accellera, an EDA industry standards organization, as part of Accellera's low-power standardization effort.
Synopsys, Inc. and Nikon Corporation announced that they are collaborating on the development and delivery of advanced lithography software models and DFM enabled lithography manufacturing solutions for 45 nm and below.
Ponte Solutions, Inc. announced a technology partnership with leading global semiconductor manufacturer UMC to establish design-stage yield analysis that enables pre-tapeout yield enhancement for 90nm and below technologies.
According to a report by the Information Network that although there are several potential lithography techniques at the 32nm node, it is becoming increasing clear that 193nm immersion will be the most likely candidate for manufacturing IC devices at the 32nm node. The report suggests Nikon will take over leadership in this arena despite current figures.
AMD has been revealing details of its technology roadmap, specifically what lies ahead with quad-core computing.
Scheduled to appear in the first half of 2007 - first for servers, but then rolled out across AMD desktop and laptop offerings - this will be the next step for AMD multi-core processing.
BASF has announced that it is going to expand its annual capacity for manufacturing the special amines aminodiglycol (ADG) and morpholine, from the current 20,000 metric tons to 30,000 metric tons, at its German ;Verbund site in Ludwigshafen