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Thursday 3rd August 2006
Micron Technology, Inc. applauded the Federal Trade Commission's decision that Rambus, Inc., unlawfully monopolized the markets for four computer memory technologies incorporated into industry standards for memory computer chips.
Thursday 3rd August 2006
MoSys, Inc. announced that it has completed the basic research and development work for porting MoSys' 1T-SRAM embedded memory technology to the advanced 65nm semiconductor technology node and has initiated macro design work in order to move these designs into high volume consumer SoC's.
Thursday 3rd August 2006
Carl Zeiss SMT´s Nano Technology Systems division (Carl Zeiss NTS) and SII NanoTechnology Inc. (SIINT) jointly introduce the NVision 40, the latest member of the industry proven CrossBeam family of combined scanning electron and focused ion beam workstations. The NVision 40 is designed to meet even most ambitious demands in semiconductor, materials and life science applications. By combining the outstanding core technologies of GEMINI electron beam technology, focused ion beam (FIB) and gas injection system (GIS) technology of both market leaders, NVision 40 offers unprecedented product capabilities for cutting-edge nanoscopic imaging, structuring and analysis.
Thursday 3rd August 2006
The European semiconductor market ends the second quarter up 1.4% compared to the same quarter of 2005. This result has been mainly driven by the solid growth for Flash memory products, particularly at the end of last year, and partly by a rebound in DRAM sales.
Thursday 3rd August 2006
Carl Zeiss SMT´s Semiconductor Metrology Systems Division (SMS), Jena, Germany, announced that the Advanced Mask Technology Centre (AMTC) in Dresden, Germany, has successfully finalized the installation of the new Carl Zeiss SMT multi-generation E-beam mask repair system MeRiT MG. The system, which has been developed within the BMBF* funded project ABBILD, will now be used for the repair of advanced photomasks at AMTC´s facility in Dresden, Germany. AMTC is a Joint Venture of AMD Inc., Infineon Technologies AG and Toppan Photomasks Inc.
Wednesday 2nd August 2006
AMI Semiconductor, Inc., subsidiary of AMIS Holdings, Inc. announced that it entered into an agreement to acquire the Ultra Low Power (ULP) six-transistor (6T) SRAM and medical System-on-Chip (SOC) ASIC businesses of NanoAmp Solutions Inc. for approximately $21 million in cash, plus an adjustment for closing inventory of the business.
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Wednesday 2nd August 2006
35 new wafer fabs will begin to ramp the industry's monthly capacity to a new high next year forecasts Strategic Marketing Associates (SMA) in a quaterly published fab report. As most of the new fabs that began construction about two years continue to come online in 2007, they will be joined by 8 of the 11 fabs that just began construction in the June quarter.
Wednesday 2nd August 2006
Soitec has announced that it has finalised the acquisition of 100% of the total registered share capital of TraciT Technologies.
Wednesday 2nd August 2006
Germany announces that the Advanced Mask Technology Centre (AMTC) in Dresden, Germany has successfully finalised the installation of the new Carl Zeiss SMT multi-generation E-beam mask repair system MeRiT MG.
Friday 28th July 2006
ICOS Vision Systems Corporation and IMEC, research centre in nanoelectronics and nanotechnology, have agreed to work together under a two-year Joint Exploration and Development Program (JEDP), in the field of inspection and metrology for three dimensional (3D) packaging. According to market analysts, the market for 3D packaging will grow rapidly over the next years, driven by the quest for smaller and higher performance Integrated Circuits (IC's).
Friday 28th July 2006
NEC Corporation ("NEC"), NEC Electronics Corporation ("NEC Electronics"), Matsushita Electric Industrial Co. Ltd. ("Matsushita"), Panasonic Mobile Communications Co. Ltd. ("Panasonic Mobile") and Texas Instruments Incorporated ("Texas Instruments") announced that the five companies have signed an agreement to establish a new joint venture company. The company will conduct global development, design, and technology licensing for a hardware and software communications platform (*1) to manage the core communications functions for mobile handsets for the third generation (3G/3.5G) and beyond.
Friday 28th July 2006
PFC will handle a $100M devices market in 2012. Hybrid cars, solar & wind power and industry will then sustain the growth according to the report, PowerSiC - Status & Forecasts Silicon Carbide Devices for Power Electronics Market by Research and Markets,
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Friday 28th July 2006
Photronics, Inc. announced that Dr. Sang Soo (SS) Choi has been appointed to the position of Chief Technology Officer-Asia. He will report directly to Dr. Christopher Progler, Photronics' corporate Chief Technology Officer.
Friday 28th July 2006
MEMC Electronic Materials, Inc. announced that MEMC and Suntech Power Holdings Co., Ltd. have executed the binding definitive agreement for the supply of solar grade silicon wafers.
Thursday 27th July 2006
Micron Technology, Inc., and Intel Corporation announced they are sampling NAND flash memory built on industry-leading 50 nanometer (nm) process technology. The samples were manufactured through IM Flash Technologies, a joint development and manufacturing venture from Micron and Intel.
Thursday 27th July 2006
Nu Horizons Electronics Corp. announced a North American partnership agreement with AU Optronics Corp.
Thursday 27th July 2006
Bede X-ray Metrology is pleased to announce that it has entered into a collaboration with IMEC, Belgium, to investigate the use of X-ray metrology in the process control of new semiconductor materials used at the 45 nm technology node and below.
Thursday 27th July 2006
Trio-Tech International announced that it is expanding its facility in Suzhou, China to provide specialized testing and burn-in services and manufacture burn-in equipment to serve China's expanding semiconductor, communications and consumer electronics markets.
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Wednesday 26th July 2006
Micron Technology, Inc., and Intel Corporation announced they are sampling NAND flash memory built on industry-leading 50 nanometer (nm) process technology. The samples were manufactured through IM Flash Technologies, a joint development and manufacturing venture from Micron and Intel. Both companies are sampling 4 gigabit (Gb) devices now, with plans to mass produce a range of densities on the 50nm node in 2007.
Wednesday 26th July 2006
Freescale Semiconductor unveiled yet another innovation that could replace BGA and flip chip as the dominant packaging and assembly approach for advanced, highly integrated semiconductors. ;Redistributed Chip Packaging (RCP) technology from Freescale offers unmatched flexibility and integration density -- characteristics that help deliver 30 percent smaller packaged semiconductor solutions versus traditional BGA technology. ;
Wednesday 26th July 2006
UCLT Ltd., is to be renamed Pixer Technology Ltd. (Pixer).;;
Wednesday 26th July 2006
Oki Electric Industry Co., Ltd and OKI Printing Solutions, a subsidiary of Oki Electric Industry Co., Ltd have expanded their Asian operations with the launch of a sales office in Beijing. The new office, Oki Trading (Beijing) Co., Ltd., has already begun operations to meet growing demand in the printer market, and has been earmarked to provide a wider range of Oki products in the future.
Wednesday 26th July 2006
Tegal Corporation announced that Crocus Technology SA, a startup company specializing in magnetic random access memory (MRAM), has placed an order for a Tegal 6500 series critical plasma etch system outfitted with Spectra process modules. Crocus Technology SA of Grenoble, France recently received $17M in funding to commercialize MRAM technology and is in the process of starting a prototype and pilot plant for MRAM production.
Wednesday 26th July 2006
Mentor Graphics Corporation announced that Taiwan Semiconductor Manufacturing Company (TSMC) has qualified Calibre nmDRC for TSMC's 65 nanometer (nm) technology.

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