Paul Springthorpe has joined Ionpure Technologies as European Technical Manager. He takes responsibility for all areas of technical support and training for Ionpure electro deionisation (EDI)-based products throughout Europe.
Intel Corporation announced it has reached an important milestone in the development of 45 nanometer (nm) logic technology. Intel has produced what are believed to be the first fully functional SRAM (Static Random Access Memory) chips using 45nm process technology, its next– generation, high–volume semiconductor manufacturing process.
ApNano Materials, Inc, announced that the European Union Commission has approved a grant of ¤11.6 million to develop new composite coatings and lubricants based on ApNano Materials' nanoparticles – the inorganic fullerenes (IF) – which have unique friction and wear reducing properties.
The global market for MEMS devices and production equipment was worth an estimated $5 billion in 2005. Forecasts predict an increase to $12.5 billion through 2010, an average annual growth rate (AAGR) of more than 20% According to the technical market research report, RGB-270R MEMS: A Roadmap to Technologies and Applications from Business Communications Co., Inc.
Cathode ray tubing has been a standard of display technology for many years. As display technology becomes more progressive, these displays are gradually being replaced with models that are more compact and consume less power. As displays become more and more advanced there are fewer reasons to continue to invest in cathode ray tube (CRT) displays.
DEK has set out a vision for the future that demands wafer level accuracy, six-sigma repeatability and first time print as fundamental capabilities for next generation screen printing in SMT and semiconductor assembly.
Applied Materials, Inc. and IMEC have announced a significant joint effort to develop 32nm and 22nm-node copper/low k interconnect processing technologies using a suite of Applied Materials' most advanced systems. The goal of the joint program is to address critical manufacturing challenges that chipmakers may face as they make the transition to future device generations, helping them to bring new products to market more rapidly while minimising risk
IBM, Sony Corporation and Toshiba have announced the commencement of a new, five-year phase of their joint technology development alliance. As part of this broad semiconductor research and development collaboration, the three companies will work together on fundamental research, related to advanced process technologies at 32 nanometers and beyond. The agreement will help enable the three companies to more rapidly investigate, identify and commercialise new technologies for consumer and other applications.
A company developing biotechnologies for coatings and artificial cells that may treat many health conditions is locating a laboratory at Central Michigan University.
Initially, two researchers from Connecticut-based Artificial Cell Technologies Inc. will be located in CMU's Dow Science Complex. One ACT staff person has been at CMU since last summer.
The Royal Society report, The long-term management of radioactive waste: the work of the Committee on Radioactive Waste Management, recommends that scientific and technical organisations should be involved with the exercise to assess the "weight" that should be given to different criteria being applied to CoRWM's short list of options for the disposal of radioactive waste
The Project on Emerging Nanotechnologies at the Woodrow Wilson International Centre for Scholars announced the release of a report by one of the country’s foremost authorities on environmental research and policy. Examining the strengths and weaknesses of the current regulatory framework for nanotechnology calling for a new approach to nanotechnology oversight.
Macrotron Scientific Engineering GmbH (MSE) announced the expansion of its Frontend division by offering thermal processing systems. MSE expand its Frontend division for semiconductor manufacturing and now offers a solution for rapid thermal processing (RTP) to the semiconductor industry.
Sense Holdings, Inca developer of next-generation biometric and explosive detection security technologies for government and commercial security markets, announced an important recent progress report under a research and development project with the U.S. government's Oak Ridge National Laboratory to develop a new line of handheld multipurpose explosive and chemical detection device products for the global homeland security marketplace.
Texas Instruments (TI) Incorporated announced it has finalised its previously announced acquisition of Chipcon, a leading company in the design of short-range, low-power wireless RF (radio frequency) transceiver devices. This acquisition will expand TI's high-performance analogue portfolio and will enable TI to provide customers with industry-leading ZigBee compliant solutions and a broad range of proprietary radio frequency integrated circuits that enable innovative low-power wireless applications.
Following a flat 2005, VLSI Research predicts a positive outlook for the semiconductor industry in 2006. IC revenues are expected to increase 8%, while equipment for ICs and flat-panel displays should grow 6% over 2005.