German firm SUSS MicroTec has introduced the world's first and only non-contact probe system. Using a patented technique, the probe acquires signals from the smallest features without loading the circuit under test. The SUSS system does not rely on optical emissions for acquisition and supplies both voltage and timing information.
Magma Design Automation Inc announced that the Semiconductor Technology Academic Research Centre (STARC) of Japan has chosen Magma's Quartz SSTA statistical static timing analysis and optimization software for its process-friendly design flow methodology project for 65- and 45-nanometer (nm) and smaller geometries. Quartz SSTA is part of the variation-aware design methodology that's currently under development and slated for early 2007 release. After a detailed investigation, STARC has chosen Magma software for their evaluation project because of its comprehensive approach to statistical static timing analysis and optimization, demonstrated accuracy and fast turnaround time.
Eurosemi is proud to announce the winners of the Eurosemi IC Industry Awards 2005. This industry-wide event has been a huge success in 2005 with over 4,500 votes recorded in the ten categories that were decided by the readers of Eurosemi.
Copper resistivity will remain a challenge for the semiconductor industry, but chip designers are likely to use hierarchical design workarounds to modify the metal for linewidths at the 45nm technology node, according to attendees at a recent industry workshop sponsored by Sematech and Novellus Systems.
The embedded control market – made up of devices comprising standard off the shelf microprocessors (MPUs) and microcontrollers (MCUs) - continues to outpace the overall semiconductor market, according to Semico Research.
US equipment behemoth Applied Materials has acquired single-wafer immersion technology and clean/dry intellectual property from SCP Global Technology. The technology provides Applied with an expanded range of advanced cleaning solutions.
European Semiconductor has an excellent track record of success with the companies that have received the annual European Semiconductor/Siltronic Start Up Award. In an industry with a fast turnover of companies, every winner has gone on to further success.
The Semiconductor Equipment Consortium for Advanced Packaging (SECAP) has announced that they will disband now that the consortium has successfully established 300 mm Wafer Level Packaging as a functional technology and full-volume production on the first installed wafer-bumping line is underway.
Just one year after the inauguration of the Nanotec 300 research platform for the 45 and 32 nanometer microelectronics nodes, CEA Leti announced the successful completion of its first High K metal gate transistors on 300mm wafers.