The embedded control market – made up of devices comprising standard off the shelf microprocessors (MPUs) and microcontrollers (MCUs) - continues to outpace the overall semiconductor market, according to Semico Research.
US equipment behemoth Applied Materials has acquired single-wafer immersion technology and clean/dry intellectual property from SCP Global Technology. The technology provides Applied with an expanded range of advanced cleaning solutions.
European Semiconductor has an excellent track record of success with the companies that have received the annual European Semiconductor/Siltronic Start Up Award. In an industry with a fast turnover of companies, every winner has gone on to further success.
The Semiconductor Equipment Consortium for Advanced Packaging (SECAP) has announced that they will disband now that the consortium has successfully established 300 mm Wafer Level Packaging as a functional technology and full-volume production on the first installed wafer-bumping line is underway.
Just one year after the inauguration of the Nanotec 300 research platform for the 45 and 32 nanometer microelectronics nodes, CEA Leti announced the successful completion of its first High K metal gate transistors on 300mm wafers.
SEMI has released a report that shows the Chinese semiconductor market is increasing faster than the rest of the world with 300mm wafers already being tested well before predictions based on external restrictions placed upon the country's technological growth.
Semiconductor research centre ATDF has been selected by Acorn Technologies to fabricate its proprietary, patented metal insulator source/drain transistor technology, called XMOS, for advanced integrated circuits.
Applied Materials continued to strengthen its dominance of the semiconductor equipment market by increasing market share in 11 business sectors in 2004, according to market analyst The Information Network (TIN).
Discrete products are projected to grow by 0.5 percent to $15.8 billion in 2005 and to $19.8 billion in 2008, a CAGR of 5.8 percent. Discrete components include power transistors and radio frequency (RF) transistors that are found in wireless consumer products.