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Wednesday 12th January 2005
South Korean chaebol Samsung Electronics has announced that it has developed the world's first eight-die multi-chip package (MCP) technology, designed for use in high-capacity mobile devices such as 3G handsets.
Wednesday 12th January 2005
Geneva-based chip maker STMicroelectronics and Atlanta-based set-top box company Scientific-Atlanta have announced that they are in full production with a jointly developed integrated cable set-top box chip.
Wednesday 12th January 2005
The semiconductor equipment industry had its best year since 2000 in 2004, sales leaping by 52.5% to US$51 billion, according to new figures from market analyst VLSI Research.
Wednesday 12th January 2005
California-based system-on-chip interconnect supplier Sonics Inc has opened an engineering design centre in Armenia as part of ambitious plans to grow the company.
Wednesday 12th January 2005
Varian Semiconductor Equipment has completed the installation of a third single wafer high current ion implanter at foundry giant UMC's 300mm fab in Tainan, Taiwan.
Wednesday 12th January 2005
European semiconductor giant STMicroelectronics has lowered its expectations for fourth quarter (ending December 31 2004) gross margins to 36.6% from its previous guidance of 38% to 39%.
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Wednesday 12th January 2005
Dutch lithography company ASML and US semiconductor equipment behemoth Applied Materials have joined forces to speed up the development of 65nm and below process equipment technology.
Wednesday 12th January 2005
German chipmaker Infineon Technologies is part of an IBM-led consortium of semiconductor giants that have pledged to invest US$2.5 billion in an advanced semiconductor plant and research centre in New York.
Wednesday 12th January 2005
Semiconductor company Atmel Corporation has announced that a finger sensor security chip it has developed has been incorporated into a Hewlett Packard pocket PC.
Tuesday 11th January 2005
German chip maker Infineon has cancelled the sale of its fibre optics business to US company Finisar Corp citing "circumstances beyond the company's control".
Tuesday 11th January 2005
European semiconductor giant STMicroelectronics has lowered its expectations for fourth quarter (ending December 31 2004) gross margins to 36.6% from its previous guidance of 38% to 39%.
Monday 10th January 2005
South Korean chaebol Samsung Electronics has announced that it has developed the world's first eight-die multi-chip package (MCP) technology, designed for use in high-capacity mobile devices such as 3G handsets.
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Friday 7th January 2005
California-based system-on-chip interconnect supplier Sonics Inc has opened an engineering design centre in Armenia as part of ambitious plans to grow the company.
Friday 7th January 2005
The semiconductor equipment industry had its best year since 2000 in 2004, sales leaping by 52.5% to US$51 billion, according to new figures from market analyst VLSI Research.
Thursday 6th January 2005
German chipmaker Infineon Technologies is part of an IBM-led consortium of semiconductor giants that have pledged to invest US$2.5 billion in an advanced semiconductor plant and research centre in New York.
Thursday 6th January 2005
Dutch lithography company ASML and US semiconductor equipment behemoth Applied Materials have joined forces to speed up the development of 65nm and below process equipment technology.
Thursday 6th January 2005
European Semiconductor Industry Association figures paint a positive picture of the industry.
Thursday 6th January 2005
The Semiconductor industry will "enter another slump" in 2005 following record revenues in 2004 , wa rns market analyst In-Stat in its annual Semiconductor Product Market Forecast report.
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Thursday 6th January 2005
Worldwide sales of semiconductors grew to US$19.02 billion in November, according to new figures released by the Semiconductor Industry Association (SIA).
Thursday 6th January 2005
Chipmaking giant Infineon and interconnect manufacturer Parlex Corporation have announced plans to set up a joint venture to produce advanced substrates for secure mobile electronic identification products.
Thursday 6th January 2005
Former Philips Semiconductor boss Scott McGregor has joined communications chip giant Broadcom as president and chief executive officer.
Thursday 6th January 2005
Taiwan Semiconductor Manufacturing Company (TSMC) has announced that the production volume of its 90nm process – known as Nexsys – will "accelerate dramatically" throughout 2005.
Thursday 6th January 2005
California-based plasma etch and deposition system maker Tegal Corporation has relocated its European headquarters to Thiendorf, near Dresden, from Munich, Germany.
Thursday 6th January 2005
Freescale Semiconductor has elected Antonio Perez,president and chief operating officer of Eastman Kodak Company, to its board of directors, effective immediately.

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