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Wednesday 10th November 2004
AMD and Fujitsu's joint Spansion Flash memory subsidiary has presented a three-year vision and strategic road map, outlining plans to scale its MirrorBit technology to 8Gbit densities on 65nm lithography to meet the demands of the entire Flash market - from wireless handsets and embedded systems to detachable cards and USB drives.
Wednesday 10th November 2004
IC packaging services supplier STATS ChipPAC has expanded its die stacking technology to include two leadframe based performance packages - an Exposed Pad Thin QFP (TQFP-ep) and a Quad Flat No Lead (QFN) format.
Wednesday 10th November 2004
eMagin has been granted a US patent covering invention of an innovative gray-scale pixel driver for electronic displays (No.6,809,710).
Wednesday 10th November 2004
OSRAM Opto Semiconductors has developed new packaging technology for use in its infrared (IR) emitter diodes and detectors.
Wednesday 10th November 2004
The VSI Alliance (VSIA) released a Virtual Component Identification Soft IP Tagging standard v1.0" (IPP 4 1.0) to its general membership.
Wednesday 10th November 2004
Toshiba has filed suit against Hynix Semiconductor in Japan and the USA for infringement of semiconductor memory patents.
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Wednesday 10th November 2004
Infineon Technologies reports FQ4 sales at EUR1.99bn, resulting in net income of EUR44mn.
Tuesday 9th November 2004
European company IQE announced it has secured a major outsourcing contract to supply a leading North American RF Component Manufacturer with epitaxial materials for its RF based components used in mobile handsets. The agreement, which is effective from 1st November 2004 and is for a minimum term of two years 's was awarded to IQE's North American subsidiary.
Friday 5th November 2004
Only 69% of contract electronics manufacturers believe they will be fully compliant with European Union (EU) environmental legislation by the July 2006 deadline prescribed by the Restriction of Hazardous Substances (RoHS) directives, according to research by Technology Forecasters (TFI) and components distributor Avnet Electronics Marketing.
Friday 5th November 2004
A team of scientists from Philips and the Kavli Institute of Nanoscience Delft claims the world first growth of III-V semiconductor nanowires on germanium and silicon substrates (Nature Materials, November 2004). The scientists believe that this is an important step towards the integration of the superior high frequency and optoelectronic properties of III-V semiconductors with the huge silicon technology base of the semiconductor industry.
Wednesday 3rd November 2004
Infineon Technologies is using an innovative "chip-sandwich" technique that involves face-to-face interconnection to design chip card ICs for use in mobile communications. One aim is to offer more than 100 times the memory capacity of today's chip cards, while just doubling the chip's area. The new chip card ICs will not only deliver significant performance boosts, the company says, but will enable new applications for mobile phones and smart cards.
Wednesday 3rd November 2004
Infineon Technologies is using an innovative "chip-sandwich" technique that involves face-to-face interconnection to design chip card ICs for use in mobile communications.
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Wednesday 3rd November 2004
UK automatic test equipment supplier (ATE) Acuid has been awarded a second funding grant from the Scottish Executive.
Wednesday 3rd November 2004
DuPont Photomasks is installing a leading-edge photomask production line at its advanced production facility in Round Rock, Texas.
Wednesday 3rd November 2004
Mattson Technology has completed the acquisition of Vortek Industries, a developer of millisecond flash annealing technology based in Vancouver, Canada (Bulletin 539, July 1, 2004).
Wednesday 3rd November 2004
SEZ Group announced its first 300mm production win in Korea.
Wednesday 3rd November 2004
The World Semiconductor Trade Statistics (WSTS) organisation issued forecasts for 2004-2006. World IC sales are expected to flatten in the next two years with growth of 1.2% in 2005 and 3.0% in 2006.
Wednesday 3rd November 2004
ASM International is claiming a breakthrough pore-sealing process for next generation integration of porous low-k insulator materials in copper interconnect on semiconductor chips.
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Wednesday 3rd November 2004
Cornell University researchers have achieved all-optical switching in silicon using relatively low pulse energies (Nature October 28, 2004).
Wednesday 3rd November 2004
The European Nanobusiness Association (ENA) has launched a career centre for European jobs in nanotechnology.
Wednesday 3rd November 2004
The European Nanobusiness Association (ENA) has launched a career centre for European jobs in nanotechnology.
Tuesday 2nd November 2004
UK automatic test equipment supplier (ATE) Acuid has been awarded a second funding grant from the Scottish Executive. Up to GBP500,000 ($800,000) will be provided to Acuid to develop a high speed pin driver ASIC under Scotland's SPUR PLUS scheme. The funding is to extend the test performance of the company's latest bT144 ATE system up to 2.667Gbits/sec (Gbps), enabling coverage of the existing double data rate (DDR 1 and DDR 2) dynamic random access memory (DRAM) technology and the impending DDR 3 format. Infineon has recently selected the bT144 for its Engineering Test department.
Monday 1st November 2004
ASML is to install a full-field EUV pre-production tool at IMEC's 300mm research facility in late 2005 to prepare for a IMEC Industrial Affiliation Program on EUV lithography to begin in early 2006. The focus will be on the 32nm node and beyond to ensure that EUV technology is ready when the transition from 193nm immersion lithography takes place.
Monday 1st November 2004
ASM International is claiming a breakthrough pore-sealing process for next generation integration of porous low-k insulator materials in copper interconnect on semiconductor chips.

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