The Export-Import Bank of the United States has approved a $652 million loan guarantee to help US companies export equipment and services for a planned new silicon wafer fabrication facility in Singapore.
After a couple of years of mixed fortunes Hynix Semiconductor has had two pieces of good news this week with the company moving up the list of global DRAM suppliers and now the announcement with STMicroelectronics of the signing of a joint-venture agreement to build a front-end memory-manufacturing facility in Wuxi City, Jiangsu Province, China.
Technology giant Honeywell has bought Mitsubishi Chemical America's 40 per cent stake in Arizona-based semiconductor chemicals manufacturer GEM Microelectronics for an undisclosed sum. The deal makes Honeywell the sole owner of GEM.
UK metrology company Bede has formed an alliance with Taiwan-based semiconductor equipment distributor Scientech with the aim of supplying advanced metrology tools to the huge Taiwanese and Chinese semiconductor market.
Morris Chang, chairman of leading semiconductor foundry Taiwan Semiconductor Manufacturing Co (TSMC), has admitted that the cost of updating the company's operations to 65nm manufacturing processes could reach $1 billion by 2005.
IntelÕs board of directors has elected Paul S Otellini, currently president and chief operating officer (COO), as its next CEO. Otellini will succeed Craig R Barrett. Barrett will succeed Andrew S Grove as chairman of the Intel board of directors.
BE Semiconductor Industries (Besi) and Datacon Technology will merge to form a leading global advanced IC packaging system supplier. Besi will take over all of Datacon's shares, in return for which shareholders will receive 90% cash as well as shares. The purchase price in euros was just below the three-figure millions - including net financial liabilities. The negotiations with Besi are in the final stages. The merger is likely to take place in January next year, once all antitrust and other formal matters have been clarified.
Researchers from Aachen will be awarded GermanyÕs Stifterverband (Donors Association for the Promotion of Humanities and Science) Science Prize for contributions to extreme ultraviolet (EUV) lithography. The technologists come from Fraunhofer ILT, the department of laser technology at the RWTH Aachen and two industrial companies, AIXUV and Philips Extreme UV. The prize will be awarded at the Fraunhofer-Gesellschaft organisationÕs annual general assembly and is made in recognition of close and fruitful co-operation between research and industry.
X-FAB Semiconductor Foundries has a new, patented positive intrinsic negative (PIN) diode module for its 0.6micron BiCMOS technology (XB06). The company says that this is the first time that it has been possible to integrate PIN diodes with CMOS and BiCMOS transistors on a single chip. The parameters of standard XB06 transistors are not influenced by the PIN diode integration.
BOC Edwards is building seven gas plant facilities to ensure bulk gas supply to nine new semiconductor and flat panel display fabs. The gas supply schemes, paving the way for these multiple supply contracts, are being developed as part of a $75mn investment with BOC's long-term joint venture partner, BOC Lienhwa Industrial Gases (BOCLH).
FSI International reports that "a leading European IC manufacturer" has purchased multiple ANTARES CX CryoKinetic cleaning systems after a successful demonstration of defect removal in an on-site evaluation program. The systems will be used on advanced devices for both front-end-of-line (FEOL) and back-end-of-line (BEOL) defect removal on planar and surface patterned structures.
ASML announced details of a fourth customer in the tough Japanese market. Matsushita Electric Industrial (MEI) has ordered ASMLÕs TWINSCAN lithography system for 300mm production. MEI manufactures consumer products under the Panasonic brand. The sale marks a milestone in ASML's expansion within the Japanese market, which traditionally has been dominated by local lithography companies, namely Nikon and Canon.
OSRAM Opto Semiconductors has developed new packaging technology for use in its infrared (IR) emitter diodes and detectors. The Molded Interconnect Device Light Emitting Diodes (MIDLEDs) surface-mount technology (SMT) devices have a construction that offers electrical contact pads on both the bottom and side of the package. This enables the same part to be either used as a top-facing (Z axis) or side-facing (X axis) solution, providing greater design flexibility.
STMicroelectronics claims a first with its introduction of a Megapixel mobile-camera chipset compliant with the Standard Mobile Imaging Architecture (SMIA). The new mobile-camera kit consists of a camera module (VS6650) and mobile imaging processor (STV0976). ST and Nokia released the SMIA spec in July 2004.