SOPRA signed an exclusive license agreement for IMEC's patented ellipsometric porosimetry (EP) technology. IMEC's R&D EP tool was extensively benchmarked with other porosimetry technologies (e.g. PALS, SAXS, SANS) and excellent results were demonstrated.
STMicroelectronics claims "significant progress" in developing a replacement for Flash memory. Many companies are working on the phase-change memory (PCM) that potentially offers better performance than Flash. The most important feature of PCM is better potential for scaling to smaller feature sizes.
Micro-electromechanical system (MEMS) producer MEMSCAP has won a design in of its pressure module transducer for cockpit instruments made by Aerosonic. MEMSCAP will provide Aerosonic with its TP 3100 pressure module transducer that will be fully integrated into business and civil aircraft instruments.
STMicroelectronics claims "significant progress" in developing a replacement for Flash memory. Many companies are working on the phase-change memory (PCM) that potentially offers better performance than Flash.
Infineon Technologies formally opened the second module of its memory chip assembly, package and test facility in Portugal. The company is investing a total of EUR230mn in the new module at the Vila do Condo site.
Intel has begun 300mm wafer processing at its Fab 24 in Leixlip, Ireland. In addition, the $2bn facility features Intel's leading 90nm process technology. Fab 24 is the company's fourth 300mm manufacturing facility and Intel's third fab to manufacture semiconductors with 90nm circuitry.
International Sematech will charter the semiconductor metrology systems division of Carl Zeiss SMT to design and develop a next-generation of the proprietary Aerial Image Measurement System (AIMS) for defect review of 193nm immersion lithography photomasks.
Toshiba has launched the industry's first commercial system-on-chip (SoC) devices built on the X Architecture design based on the inclusion of diagonal chip interconnects alongside the more traditional right angle wiring.