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Friday 9th July 2004
LUMILEDS has made a long-term purchase order with AIXTRON for an anticipated epi system capacity ramp up within the coming four years.
Friday 9th July 2004
Gartner released capital expenditure and equipment revenue forecasts up to 2008.
Friday 9th July 2004
ITokyo Electron (TEL) is to collaborate with IMEC in research on 193nm immersion lithography.
Friday 9th July 2004
Tessera Technologies has signed an IC packaging licensing agreement with NEC Electronics.
Friday 9th July 2004
Infineon Technologies will be offering new chip card controllers for improved security of electronic identity cards and passports when the first global tests on electronic ID cards and passports commence later this year.
Friday 9th July 2004
Researchers from the Fraunhofer Institute for Applied Optics and Precision Engineering (IOF) have looked to the compound eyes insects to provide a model for thinner imaging devices.
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Friday 9th July 2004
A US district court (New Jersey) has imposed several sanctions against Samsung in its lawsuit with MOSAID Technologies.
Friday 9th July 2004
The United States and China have agreed on a resolution to their dispute at the World Trade Organization (WTO) regarding China's tax refund policy for ICs.
Friday 9th July 2004
GE Global Research Centre scientists have developed a carbon nanotube p-n junction diode based on electrostatic doping (Applied Physics Letters).
Wednesday 7th July 2004
Electronic component distributor Alpha Micro is suggesting that a fire at Philips' fab in Caen, France, opens up the chip market for "Europay, Mastercard and Visa" (EMV) and smart card point of sale (PoS) terminals to other IC suppliers such as TDK Semiconductor.
Wednesday 7th July 2004
IBM opened a European RFID Testing & Solution centre in La Gaude, France.
Wednesday 7th July 2004
AIXTRON and Genus are planning a 74:26 merger with the aim of creating one of the world's leading suppliers of advanced deposition equipment.
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Wednesday 7th July 2004
Nokia and STMicroelectronics are releasing a comprehensive specification for camera modules aimed at standardising this component in mobile devices.
Wednesday 7th July 2004
NEC Electronics has set up a wholly-owned subsidiary, NEC Fabserve to offer advanced services in the areas of prototyping, volume production and equipment maintenance.
Wednesday 7th July 2004
The UK's University of Leeds has bought a V80H molecular beam epitaxy (MBE) instrument from Oxford Instruments to supply complex heterostructure devices for terahertz optoelectronics research.
Wednesday 7th July 2004
The World Semiconductor Trade Statistics (WSTS) puts global IC sales in May 2004 at $17.318bn, a 36.9% increase on May 2003.
Wednesday 7th July 2004
Micron Technology plans to produce NAND Flash memory solutions targeting memory cards, USB devices and other mass storage applications.
Wednesday 7th July 2004
A paper studying the incidence of cancer at IBM fabs has sparked an author boycott of an Elsevier health journal.
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Wednesday 7th July 2004
The University of Surrey has appointed Filtronic's joint CEO Professor Christopher M Snowden, FREng, CEng, FIEE, FIEEE as vice-chancellor and chief executive with effect from July 1, 2005.
Tuesday 6th July 2004
The University of Surrey has appointed Filtronic's joint CEO Professor Christopher M Snowden, FREng, CEng, FIEE, FIEEE as vice-chancellor and chief executive with effect from July 1, 2005. Snowden succeeds Professor Patrick J Dowling, CBE, DL, FREng, FRS, who retires from office on June 30, 2005. Snowden has handed in his resignation to Filtronic, effective April 5, 2005.
Tuesday 6th July 2004
Electronic component distributor Alpha Micro is suggesting that a fire at Philips' fab in Caen, France, opens up the chip market for “Europay, Mastercard and Visa” (EMV) and smart card point of sale (PoS) terminals to other IC suppliers such as TDK Semiconductor.
Monday 5th July 2004
Nokia and STMicroelectronics are releasing a comprehensive specification for camera modules aimed at standardising this component in mobile devices. The Standard Mobile Imaging Architecture (SMIA) specification will cover all aspects of the modules, including electrical, mechanical and functional interfaces along with other key areas such as characterisation, optical performance and reliability.
Monday 5th July 2004
AIXTRON and Genus are planning a 74:26 merger with the aim of creating one of the world's leading suppliers of advanced deposition equipment. AIXTRON leads the metal-organic chemical vapour deposition (MOCVD) market in the compound semiconductor sector (ultra-high brightness light emitting diodes, high frequency chips and lasers). Genus supplies atomic layer deposition (ALD) technology with application in advanced semiconductor and hard disk drive production.
Monday 5th July 2004
The UK's University of Leeds has bought a V80H molecular beam epitaxy (MBE) instrument from Oxford Instruments to supply complex heterostructure devices for terahertz optoelectronics research. The tool will be used in a recently completed 160m2 photonics laboratory in the School of Electronic and Electrical Engineering.

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