Delft Technical University’s lab-on-chip development has achieved commercial success with US bio-technology company WaferGen planning to produce three micro laboratories on three different sensor chips developed from the Dutch research. WaferGen will acquire licences for the patented design. In return for the licences, TU Delft will receive royalties and shares in the US company.
International SEMATECH in the USA and Exitech in the UK have announced an agreement to develop the world's first ultra high numerical aperture (NA=1.3) 193nm wavelength immersion lithography tool. The MS 193I development tool will be used to speed the development of critical infrastructure for immersion lithography at SEMATECH's Immersion Technology Center in Austin, Texas.
MotorolaÕs Freescale Semiconductor subsidiary/spin-out preparation vehicle has joined the effort of European companies STMicroelectronics, Infineon Technologies and Philips to further lead-free electronics packaging. Formerly E3, the group is now called E4 (environmental 4) and focuses on accelerating the use of lead-free packages while stimulating further development of environmentally friendly package technologies.
eASIC has taped out its first structured ASIC array to be fabricated by a European integrated device manufacturer (IDM) partner on a 0.13micron process. The taped-out array called FA1 is the smallest member of the company's Structured eASIC product family. The initial parts will be used to characterise timing and power for the structured ASIC fabric and cell libraries.
Novellus Systems has agreed to acquire Peter Wolters, a manufacturer of high-precision machine manufacturing tools headquartered in Rendsburg, Germany. The deal brings a chemical mechanical planarisation (CMP) product line (particularly tungsten and dielectric) to add to NovellusÕ existing CMP technology for semiconductor manufacturing. The acquisition is expected to close in the beginning Q3 2004. Novellus acquired CMP tool producer SpeedFam-IPEC in 2002.
The German Federal Ministry for the Environment, Nature Conservation and Nuclear Safety (BMU) will fund a joint research project on organic solar cells by GermanyÕs Hahn-Meitner-Institute (HMI), chemicals supplier Covion Organic Semiconductors and Aixtron. Within this project AIXTRON will install an organic vapour phase deposition (OVPD) system at the HMI for the deposition of organic thin films.
Philips Electronics has appointed Rene Penning de Vries as senior vice president and chief technology officer (CTO) at PhilipsÕ semiconductor division. Penning de VriesÕ new role comes as part of the companyÕs preparation for Theo ClaasenÕs retirement scheduled for mid 2005. Claasen has been CTO at Philips Semiconductors since 1997.
EuropeÕs GALILEO radio navigation satellite system group launched its second call for proposals for research activities with an overall budget of EUR67mn. The aim is to support the development of applications and user receivers. The first call for proposals for GALILEO was made under the 6th Research Framework Programme (FP6) with eight large research activities beginning in 2003 and totalling EUR19mn.
International Rectifier (IR) plans to invest $40mn to bring on-line 200mm facilities and double production capacity at its site in Newport, Wales. International Rectifier's planned investment of $40mn in IR-Newport will result in more than 120 additional jobs and the potential to quadruple the facility's production capability in the future.
The German Federal Ministry for the Environment, Nature Conservation and Nuclear Safety (BMU) will fund a joint research project on organic solar cells by Germany's Hahn-Meitner-Institute (HMI), chemicals supplier Covion Organic Semiconductors and Aixtron.
UK R&D company Innos has invested GBP5mn to upgrade its photolithography capability, including the purchase of a JBX-9300FS electron-beam lithography system from JEOL UK. The new equipment, installed at Innos' 1000m2 clean room in Southampton is part of a strategy to provide a complete service to industry and academic institutions.
Samsung Electronics claims the industry's first "CVD aluminium" 70nm DRAM process technology. The aluminium chemical vapour deposition (CVD) process technology forms conducting films by turning aluminium metal-organic source materials into particles through chemical reactions, depositing them on the wafer surface.
Advanced Interconnect Technologies (AIT) has fully qualified a complete green flip-chip small outline IC (FC-SOIC) narrow body package that meets OEM requirements for the MSL1 moisture and 260degreesC temperature packaging standards.