Hungarian semiconductor materials metrology company Semilab has completed the acquisition of substantially all of the assets of SemiTest, a US based manufacturer of semiconductor metrology systems. The transaction was structured as a purchase of all assets related to SemiTest's Surface Charge Analyzer (SCA) and epitaxial growth metrology (Epimet) product lines for an undisclosed cash amount.
Austriamicrosystems Full Service Foundry business unit has produced a fully automotive qualified CMOS 50V high voltage process for its 0.35micron technology platform. The process is a modular extension of the 0.35micron CMOS licensed from TSMC permitting reuse of digital designs.
Oxford Instrument Plasma Technology (OIPT) has officially opened a new molecular beam epitaxy (MBE) production facility in East Grinstead, UK. Oxford Instruments acquired VG SemiconÕs MBE business from Thermo Electron Corporation in October 2003.
Business software developer SAP and chipmaker Infineon Technologies have jointly produced a radio frequency identification (RFID) platform to connect and manage RFID hardware and software from multiple vendors.
Silicon Genesis (SiGen) says that it has received a key US patent (No.6,790,747) in the area of fabricating strained silicon and silicon-on-insulator (SOI) substrates using a layer transfer process for use in next-generation high-speed and low-power semiconductor applications.
Toppan Printing has entered into a definitive agreement to acquire all of the outstanding shares of DuPont Photomasks for $27.00 in cash per share. The equity value of the transaction is $650mn (JPY71bn) on a diluted basis. Following completion of the transaction, DuPont Photomasks will become a wholly-owned subsidiary of Toppan to be named Toppan Photomasks. The subsidiary will remain headquartered in Round Rock, Texas.
Business software developer SAP and chipmaker Infineon Technologies have jointly produced a radio frequency identification (RFID) platform to connect and manage RFID hardware and software from multiple vendors. The platform is based on SAP’s NetWeaver and Infineon's RFID You-R OPEN (OPerating ENvironment) device integration platforms.
A number of STMicroelectronics senior executives have decided to retire at the same time as its president and CEO, Pasquale Pistorio. As previously announced, Pistorio will leave his current position at ST after the company's annual general meeting in 2005. The semiconductor manufacturer has also announced product-group, front-end manufacturing and technology-related R&D organisational changes "to increase market focus".
ASML Holding (ASML) announced that it has seen its order backlog for lithography systems increase during Q3 2004 in units and value. The company also says that Q3 2004 will result in a higher mix of 200mm systems than anticipated. New unit shipments and revenues for Q3 2004 will remain at similar levels to those of Q2 2004, according to ASML.
Nikon, ASML and Carl Zeiss SMT have agreed to a comprehensive settlement of legal proceedings and a cross-license of patents related to lithography equipment. A memorandum of understanding continues the previously announced stays on all patent disputes pending between Nikon, ASML and SMT in Asia and the USA.
A new IMEC programme will investigate the use of semiconducting wires, carbon nanotubes and spintronics in efforts to find alternatives to the current use of scaling to reduce device dimensions. Also under study will be the metrology and theoretical approaches needed as a backbone for implementation of the new nanotechnologies. The programme will also investigate disruptive technologies or new paradigms for semiconductor manufacturing processes.