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Wednesday 6th October 2004
Hungarian semiconductor materials metrology company Semilab has completed the acquisition of substantially all of the assets of SemiTest, a US based manufacturer of semiconductor metrology systems. The transaction was structured as a purchase of all assets related to SemiTest's Surface Charge Analyzer (SCA) and epitaxial growth metrology (Epimet) product lines for an undisclosed cash amount.
Wednesday 6th October 2004
Austriamicrosystems Full Service Foundry business unit has produced a fully automotive qualified CMOS 50V high voltage process for its 0.35micron technology platform. The process is a modular extension of the 0.35micron CMOS licensed from TSMC permitting reuse of digital designs.
Wednesday 6th October 2004
Oxford Instrument Plasma Technology (OIPT) has officially opened a new molecular beam epitaxy (MBE) production facility in East Grinstead, UK. Oxford Instruments acquired VG SemiconÕs MBE business from Thermo Electron Corporation in October 2003.
Wednesday 6th October 2004
BOC Edwards will supply fluorine gas to Hynix Semiconductor's 300mm semiconductor manufacturing facility in Ichon, South Korea.
Wednesday 6th October 2004
Toppan Printing has entered into a definitive agreement to acquire all of the outstanding shares of DuPont Photomasks for $27.00 in cash per share.
Wednesday 6th October 2004
Hungarian semiconductor materials metrology company Semilab has completed the acquisition of substantially all of the assets of SemiTest, a US based manufacturer of semiconductor metrology systems.
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Wednesday 6th October 2004
Austriamicrosystems' Full Service Foundry business unit has produced a fully automotive qualified CMOS 50V high voltage process for its 0.35micron technology platform.
Wednesday 6th October 2004
Business software developer SAP and chipmaker Infineon Technologies have jointly produced a radio frequency identification (RFID) platform to connect and manage RFID hardware and software from multiple vendors.
Wednesday 6th October 2004
A new IMEC programme will investigate the use of semiconducting wires, carbon nanotubes and spintronics in efforts to find alternatives to the current use of scaling to reduce device dimensions.
Wednesday 6th October 2004
M+W Zander has been given the general contract for the construction of the new Infineon Technologies Memory Development Centre in Dresden, Germany.
Wednesday 6th October 2004
The World Semiconductor Trade Statistics (WSTS) organisation puts IC sales for August 2004 at $18.205bn (three-month average), representing 34.2% year-on-year growth.
Wednesday 6th October 2004
NEC Electronics has launched NEC Semicon Package Solutions as a back-end production company specialising in leading edge IC assembly and test.
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Wednesday 6th October 2004
The Ruhr-University of Bochum, Germany, has bought a development reactor containing the key components of AIXTRON's atomic vapour deposition (AVD) technology.
Wednesday 6th October 2004
Peregrine Semiconductor claims the world's first flip-chip SP4T RF antenna switch for dualband GSM handset applications.
Wednesday 6th October 2004
Wacker's Polysilicon division is to expand polysilicon production at its Burghausen site in Germany.
Wednesday 6th October 2004
STMicroelectronics has introduced a new generation of its proprietary Vertical Intelligent Power (VIPower) family of technologies.
Wednesday 6th October 2004
Silicon Genesis (SiGen) says that it has received a key US patent (No.6,790,747) in the area of fabricating strained silicon and silicon-on-insulator (SOI) substrates using a layer transfer process for use in next-generation high-speed and low-power semiconductor applications.
Wednesday 6th October 2004
SEMI has published six new technical standards applicable to the semiconductor, flat panel display and MEMS manufacturing industries.
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Tuesday 5th October 2004
Toppan Printing has entered into a definitive agreement to acquire all of the outstanding shares of DuPont Photomasks for $27.00 in cash per share. The equity value of the transaction is $650mn (JPY71bn) on a diluted basis. Following completion of the transaction, DuPont Photomasks will become a wholly-owned subsidiary of Toppan to be named Toppan Photomasks. The subsidiary will remain headquartered in Round Rock, Texas.
Tuesday 5th October 2004
Business software developer SAP and chipmaker Infineon Technologies have jointly produced a radio frequency identification (RFID) platform to connect and manage RFID hardware and software from multiple vendors. The platform is based on SAP’s NetWeaver and Infineon's RFID You-R OPEN (OPerating ENvironment) device integration platforms.
Monday 4th October 2004
A number of STMicroelectronics senior executives have decided to retire at the same time as its president and CEO, Pasquale Pistorio. As previously announced, Pistorio will leave his current position at ST after the company's annual general meeting in 2005. The semiconductor manufacturer has also announced product-group, front-end manufacturing and technology-related R&D organisational changes "to increase market focus".
Monday 4th October 2004
ASML Holding (ASML) announced that it has seen its order backlog for lithography systems increase during Q3 2004 in units and value. The company also says that Q3 2004 will result in a higher mix of 200mm systems than anticipated. New unit shipments and revenues for Q3 2004 will remain at similar levels to those of Q2 2004, according to ASML.
Monday 4th October 2004
Nikon, ASML and Carl Zeiss SMT have agreed to a comprehensive settlement of legal proceedings and a cross-license of patents related to lithography equipment. A memorandum of understanding continues the previously announced stays on all patent disputes pending between Nikon, ASML and SMT in Asia and the USA.
Monday 4th October 2004
A new IMEC programme will investigate the use of semiconducting wires, carbon nanotubes and spintronics in efforts to find alternatives to the current use of scaling to reduce device dimensions. Also under study will be the metrology and theoretical approaches needed as a backbone for implementation of the new nanotechnologies. The programme will also investigate disruptive technologies or new paradigms for semiconductor manufacturing processes.

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