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Friday 24th September 2004
Infineon Technologies has licensed Axon Technologies' Programmable Metallization Cell (PMC) non-volatile memory technology.
Thursday 23rd September 2004
Novellus Systems Inc. has announced that its board of directors has approved an increase to Novellus' previously authorized stock repurchase program. The terms of the expanded program will permit Novellus to repurchase up to an aggregate of approximately $1.1 billion of its outstanding common stock through September 14, 2009. This represents an increase of $1 billion to the approximately $100 million remaining under the previously authorized program.
Thursday 23rd September 2004
Asyst Technologies has announced today that it will team with IBM Global Services to provide a full range of manufacturing automation solutions for the worldwide semiconductor marketplace. The agreement will provide Asyst with a worldwide integration service that will enable them to enhance current technology and have a foot in the door for future growth in new industries.
Thursday 23rd September 2004
UK company Applied Microengineering (AML) gave details of its planned use for its recent UK government DTI grant of GBP678,000 to the LOBEL project that will develop a new nano device production tool for micro polymer embossing and nano-imprint lithography (NIL) and surface activation for low-temperature wafer bonding (Bulletin 551, September 15, 2004).
Thursday 23rd September 2004
Philips Electronics has announced that effective January 1, 2005, Scott McGregor will, at his own request, relinquish his position as CEO of the Semiconductors division and leave the company to return to the USA. McGregor has been in his current position since September 1, 2001.
Thursday 23rd September 2004
STMicroelectronics has announced that its Kirkop back-end semiconductor manufacturing facility in Malta has taken the initiative to use only biodiesel fuel for the diesel-powered vehicles in its transport fleet and for its boiler systems.
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Thursday 23rd September 2004
Infineon has announced the formal opening of a new memory chip packaging facility in China. Infineon Technologies Suzhou was opened in the presence of the Suzhou Party Secretary Wang Min. Work on constructing the new production facility has begun in October 2003, and volume production is planned to commence in early 2005. Once completed, the facility will have a maximum capacity of up to 1bn memory chips a year.
Thursday 23rd September 2004
Infineon Technologies has licensed Axon Technologies’ Programmable Metallization Cell (PMC) non-volatile memory technology. Infineon follows Micron Technology as the second major memory manufacturer to obtain a non-exclusive license for the memory and switching technology.
Tuesday 21st September 2004
According to a number of news reports from Asia, South Korea's Supreme Public Prosecutor's Office have announced they are investigating an accounting fraud of almost 2 trillion won ($1.7 billion) at Hynix Semiconductor that began in 1996 and ended in 1999. According to the reports the Prosecutor's Office said it was looking into whether funds were illegally diverted from the company's books to Hyundai affiliates.
Monday 20th September 2004
Agere Systems have announced from its UK office that its engineers have found the right mix of packaging ingredients to enable the semiconductor industry to successfully implement lead-free packaging. The company's states that research found a tin-nickel combination in semiconductor packaging mitigates "tin whisker" problem and improves long-term reliability of lead-free devices. To solve the problem, Agere added a layer of nickel between the layers of tin and copper and discovered that tin whisker growth was mitigated in that scenario.
Monday 20th September 2004
Asyst Technologies has announced today that it will team with IBM Global Services to provide a full range of manufacturing automation solutions for the worldwide semiconductor marketplace. The agreement will provide Asyst with a worldwide integration service that will enable them to enhance current technology and have a foot in the door for future growth in new industries.
Thursday 16th September 2004
Photronics and SIGMA-C plan to combine their respective technologies to strengthen Photronics' Integrated Lithography Plane (ILP) initiative. Photronics' aim is to provide design and mask integration support to semiconductor companies transitioning to the 65nm and 45nm technology nodes.
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Thursday 16th September 2004
Infineon Technologies has reached an agreement with the Antitrust Division of the US Department of Justice (DoJ). The DRAM producer plans to plead guilty to a single and limited charge related to the violation of US antitrust laws in connection with pricing.
Wednesday 15th September 2004
Fraunhofer Institute for Silicon Technology (ISIT), Siemens and Infineon announced proposed development of electronic biochip technology along with their nomination for the German Federal President's Deutscher Zukunftspreis technology and innovation award for work already carried out.
Wednesday 15th September 2004
The UK government has awarded funding to Trikon Technologies to develop "Broad Ion Beam Deposition" (BIBD) technology for 300mm magnetoresistive random access memory (MRAM) manufacture.
Wednesday 15th September 2004
IBM and SUSS MicroTec have signed an agreement to develop and commercialise IBM's next-generation, 100% lead-free semiconductor packaging technology called the Controlled Collapse Chip Connection New Process (C4NP).
Wednesday 15th September 2004
Canon and Toshiba have agreed to establish a joint venture in October 2004 for the development, production and marketing of next-generation flat-screen "surface-conduction electron-emitter display" (SED) panels.
Wednesday 15th September 2004
Bookham has successfully completed its change of domicile to the USA.
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Wednesday 15th September 2004
US DRAM producer Micron Technology has made a multi-year business agreement for ASML MaskTools to enhance the capability of Micron's lithography tools through resolution enhancement techniques (RETs).
Wednesday 15th September 2004
iSuppli has "trimmed" its IC forecast for 2005. The market researcher sees a slowing in world semiconductor revenue growth in H2 2004, with the main impact in Q4.
Wednesday 15th September 2004
FEI has released its first DualBeam mask repair system aimed at the 65nm node.
Wednesday 15th September 2004
A quantum mechanical 3D simulator for semiconductor devices has been created under the EU Nanotechnology Computer Aided Design (NANOTCAD) project.
Wednesday 15th September 2004
The European Solar Test Installation (ESTI) at the European Commission's Joint Research Centre has been awarded Accredited Calibration Laboratory status.
Wednesday 15th September 2004
Texas Instruments has designed inlay radio frequency identification (RFID) products for circular products such as CD/DVD disks.

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