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Friday 27th August 2004
Technical University of Clausthal physicists have made progress in characterising the atomic structure of silicon/silicon dioxide interfaces (Physical Review Letters, Volume 93, No.9, on-line August 27, 2004). Using a nonlinear optical method, Dr Stefan Bergfeld, Bjoern Braunschweig and Professor Winfried Daum studied the change in bond structure of interfacial atoms during the oxidation of a (111)-oriented silicon surface. The scientists also observed the changes in bonding states after thermal oxidation.
Friday 27th August 2004
Japanese researchers claim to have reduced the number of dislocations in silicon carbide crystals by two to three orders of magnitude (Nature, August 26, 2004).
Friday 27th August 2004
Technical University of Clausthal physicists have made progress in characterising the atomic structure of silicon/silicon dioxide interfaces (Physical Review Letters, Volume 93, No.9, on-line August 27, 2004).
Friday 27th August 2004
Tokyo Electron (TEL) has agreed to make an equity investment in Molecular Imprints (MII) as a contributor to a Series B funding round.
Friday 27th August 2004
Eastman Kodak has made a definitive agreement to buy National Semiconductor's Imaging business.
Friday 27th August 2004
France's National Center for Scientific Research (CNRS) has ordered a GEN II molecular beam epitaxy (MBE) system from Veeco Instruments.
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Friday 27th August 2004
The US Semiconductor Industry Association (SIA) is seeking proposals from interested investigators for the conduct of an independent retrospective epidemiological study of US semiconductor wafer fabrication workers.
Friday 27th August 2004
UK R&D company Innos and the University of Southampton have jointly patented a new technique that enables the suppression of boron diffusion in silicon-germanium (SiGe) using fluorine implantation.
Friday 27th August 2004
FlipChip International says that it has demonstrated a 95micron pitch bumping technology for advanced semiconductor devices at its R&D laboratory in Arizona.
Friday 27th August 2004
A team of California Institute of Technology (Caltech) researchers reports a new method for coating single-walled carbon nanotubes (SWNTs) attached to atomic force microscope (AFM) tips with conformal fluorocarbon polymers formed in an inductively coupled plasma reactor (Nano Letters).
Friday 27th August 2004
SEMI produced its preliminary July 2004 book-to-bill ratio for North American semiconductor equipment producers.
Friday 27th August 2004
X-FAB Semiconductor Foundries, headquartered in Germany, reports all-time high quarterly sales at EUR36.0mn in Q2 2004.
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Thursday 26th August 2004
Japanese researchers claim to have reduced the number of dislocations in silicon carbide crystals by two to three orders of magnitude (Nature, August 26, 2004). "These substrates will promote the development of high-power SiC devices and reduce energy losses of the resulting electrical systems," the scientists write. Other applications for SiC are seen as high frequency and high temperature.
Wednesday 25th August 2004
The National Research Council of Canada's Industrial Materials Institute (NRC-IMI) joined the Nano Imprint Lithography (NIL) consortium that Austrian company EV Group (EVG) formed last year. The consortium is working to commercialise advanced NIL technologies.
Wednesday 25th August 2004
UK R&D company Innos and the University of Southampton have jointly patented a new technique that enables the suppression of boron diffusion in silicon-germanium (SiGe) using fluorine implantation. Research conducted at Innos' new facilities has shown that a properly optimised fluorine implant not only eliminates transient enhanced diffusion of boron, but also dramatically reduces normal boron thermal diffusion.
Monday 23rd August 2004
No surprises have emerged to prevent the introduction of 193i for 65nm half-pitch in 2007, according to International SEMATECHÕs international symposium on immersion and 157nm lithography. The outlook is also positive for its extension to 45nm half-pitch and possibly below. Potential solutions for achieving the latter include hyper-numerical aperture, improved lens design, high refractive-index fluids, high-index resists and lens material, double exposure, and related infrastructure.
Monday 23rd August 2004
The US Semiconductor Industry Association (SIA) is seeking proposals from interested investigators for the conduct of an independent retrospective epidemiological study of US semiconductor wafer fabrication workers. A request for proposals (RFP) has been made to public and private institutions - including universities, colleges, laboratories, and governmental agencies - to conduct the study. The principal focus of the study will be the assessment of cancer risk among workers employed in US semiconductor wafer fabrication facilities over a period of more than three decades, from the late 1960s to the present.
Thursday 19th August 2004
ASM International is setting up its first wafer processing equipment plant in Singapore this month. The plant will have 13,940m2 of total available floor area and 2787m2 of clean room facilities. The plant will have 50 employees by the end of the year, with this expected to rise to 200-300 new people within three years.
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Thursday 19th August 2004
Intense Photonics has gained additional funds to expand its design and volume fabrication of optoelectronic components and modules. A GBP5mn ($9.2mn) funding round was supported by all the company's financial investors - 3i, ACT Venture Capital, Alice Ventures, Cazenove Private Equity, FNI Venture Capital and TTP Ventures.
Thursday 19th August 2004
ASM International is setting up its first wafer processing equipment plant in Singapore this month.
Thursday 19th August 2004
Oki Electric Industry claims the world's thinnest ultra small tri-axis accelerometer module, the ML8950.
Thursday 19th August 2004
Intense Photonics has gained additional funds to expand its design and volume fabrication of optoelectronic components and modules.
Thursday 19th August 2004
Applied Materials has entered into a definitive agreement to acquire the operating subsidiaries and businesses of Metron Technology.
Thursday 19th August 2004
Freescale Semiconductor has become a "Promoter" for the ZigBee low cost, low power, low-data-rate wireless communications standard.

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