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Friday 28th May 2004
European nanotech research centre IMEC and Praesagus have agreed to jointly develop Praesagus' physics-based modelling approach for pattern-based interconnect thickness variation. The scope of the technology will be expanded to include copper/low-k and three-dimensional modelling. The partnership will use IMEC's copper damascene, ultra low-k dielectric and 65nm expertise and experience.
Friday 28th May 2004
Samsung Electronics claims the industry’s first “CVD aluminium” 70nm DRAM process technology. The aluminium chemical vapour deposition (CVD) process technology forms conducting films by turning aluminium metal-organic source materials into particles through chemical reactions, depositing them on the wafer surface.
Thursday 27th May 2004
UK R&D company Innos has invested GBP5mn to upgrade its photolithography capability, including the purchase of a JBX-9300FS electron-beam lithography system from JEOL UK. The new equipment, installed at InnosÕ 1000m2 clean room in Southampton is part of a strategy to provide a complete service to industry and academic institutions.
Thursday 27th May 2004
ASM International reports that a major Japanese consumer electronics manufacturer has bought its critical process equipment for 300mm/90nm production. Deliveries of ASM's Eagle-12 single-wafer plasma enhanced chemical vapour deposition (CVD) and Levitor 4300 rapid thermal processing (RTP) systems are scheduled to begin in Q4 2004.
Thursday 27th May 2004
UK fabless mixed-signal IC supplier Wolfson Microelectronics has contracted CSMC Technologies Corporation for foundry services from a 150mm fab facility in Wuxi, China.
Thursday 27th May 2004
AlcatelÕs Vacuum Technology division has rebranded its vacuum pumps, helium leak detectors and micro machining systems products under the new name Adixen.
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Thursday 27th May 2004
Bookham Technology has entered into an agreement under which it will acquire Onetta, a provider of optical amplifier modules and subsystems for communications networks. The acquired company is based in Sunnyvale, California. Onetta designs and manufactures intelligent erbium doped fiber amplifiers (EDFA).
Wednesday 26th May 2004
Surface Technology Systems (STS) and Jobin Yvon report successful completion of first phase tests on a system for in-situ process control of deep silicon etch applications in MEMS manufacturing. The companies claim a substantial impact on costs and enhanced yields compared to competing solutions.
Wednesday 26th May 2004
RF product identification (RFID) supplier Checkpoint Systems and Philips Electronics have entered an alliance to jointly provide tags and readers combined with system integration services to retailers and consumer products companies.
Wednesday 26th May 2004
STMicroelectronics, CEA-Leti and Aixtron have developed an advanced process technology for the creation of ultra-thin transistor-gate-insulation layers for low-power applications at the 65nm and 45nm CMOS transistor technology nodes.
Wednesday 26th May 2004
UMC claims a new engineering technique enhances silicon-on-insulator (SOI) transistor performance.
Wednesday 26th May 2004
Surface Technology Systems (STS) and Jobin Yvon report successful completion of first phase tests on a system for in-situ process control of deep silicon etch applications in MEMS manufacturing.
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Wednesday 26th May 2004
Intel disclosed plans for an additional $2bn investment in its facilities in Ireland under an agreement with the Irish Development Authority (IDA).
Wednesday 26th May 2004
Tokyo Electron is to restructure its US operations by creating a new holding company named Tokyo Electron US Holdings Inc.
Wednesday 26th May 2004
RF Micro Devices (RFMD) has completed the acquisition of Silicon Wave, a supplier of Bluetooth solutions for wireless personal area networks (WPANs).
Wednesday 26th May 2004
Intersil has selected AMI Semiconductor's mixed-signal process with electrically erasable (EE) memory and 20V capability as part of its second source requirements.
Wednesday 26th May 2004
Overheating is VLSI Research's fear, after reporting its April 2004 assessment.
Wednesday 26th May 2004
Applied Materials reports FQ2 2004 net sales at $2.02bn, an 82% increase from FQ2 2003's $1.1bn.
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Wednesday 26th May 2004
STMicroelectronics, CEA-Leti and Aixtron have developed an advanced process technology for the creation of ultra-thin transistor-gate-insulation layers for low-power applications at the 65nm and 45nm CMOS transistor technology nodes.
Wednesday 26th May 2004
ST Assembly Test Services (STATS) has developed a "Chip Scale Module Package" (CSMP) thin-film technology, which involves the fabrication of passive devices such as resistors, capacitors, inductors, filters, baluns and interconnects directly onto a silicon substrate.
Wednesday 26th May 2004
ST Assembly Test Services (STATS) has expanded its integrated turnkey solutions with design-for-test (DFT) capabilities.
Wednesday 26th May 2004
Eastman Kodak has developed an "always on" plastic display.
Wednesday 26th May 2004
MOSAID Technologies has filed a proposed Stipulated Order of Dismissal for all infringement claims with respect to US patent No.6,067,272 covering a delay locked loop (DLL) circuit for use in synchronous DRAM.
Thursday 20th May 2004
Intel disclosed plans for an additional $2bn investment in its facilities in Ireland under an agreement with the Irish Development Authority (IDA). The deal includes grants and other potential incentives as Intel continues to invest in Ireland. The company's 2004 capital expenditure forecast range of $3.6-4.0bn will accommodate the spending for the early stages of the new project.

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