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Friday 30th May 2014
Thursday 29th May 2014
Effective etching of semiconductor wafers is dependent on fluoride usage. This can be assessed by the system's dual-channel transmitter which monitors both fluoride and pH for reliable accuracy
Thursday 29th May 2014
The system adds desmear and etchback capabilities and increased capacity of up to 30 panels per cycle
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Thursday 29th May 2014
This new development will address the NAND Flash market which Gartner anticipates will reach a massive US $44.6 billion in 2017
Thursday 29th May 2014
The Endura Ventura PVD system will allow high aspect ratio TSV structures for copper interconnects and is claimed to reduce cost of ownership by up to 50 percent
Thursday 29th May 2014
The move to 300mm strengthens the major customer’s position in the rapidly growing CMOS image sensor market
Wednesday 28th May 2014
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Wednesday 28th May 2014
The company supplies SAS with sputtering targets as the source of metal to form the wiring in its semiconductor microchips   
Wednesday 28th May 2014
The custom gas system performs automatic gas cylinder switchover and is suited to low flow applications or reactors operating in a limited space
Wednesday 28th May 2014
The production management system will be based on that utilised for semiconductor device production
Wednesday 28th May 2014
The new encapsulated process is claimed to deliver increased durability for mobile devices
Wednesday 28th May 2014
The market for MEMS & Sensors for mobile phones and tablets will expand from $2.85 billion in 2013 to around $6.4 billion in 2019
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Tuesday 27th May 2014
The device, which performs video format conversion, supports high-resolution, real-time monitor displays like head-mounted products
Tuesday 27th May 2014
A weak Japanese yen has slashed the overall dollar sales growth in 2013 in these markets
Tuesday 27th May 2014
The momentum was driven by mainly memory, foundry, and back-end spending
Tuesday 27th May 2014
The thermal interface standard will facilitate integration into multi-vendor EDA tool flows used in the design of either 2D die or 3D-ICs
Tuesday 27th May 2014
The mutual decision sees CFO Wolfgang Breme leaving the group

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