+44 (0)24 7671 8970
More publications     •     Advertise with us     •     Contact us
 
Loading...
News Article

IMEC receives EU and Flemish investment

News

Research centre to receive 1.5 billion euros to prepare for a 1nm and sub-1nm clean room; plans to open Spanish R&D facility.

IMEC has signed a Letter of Intent with the Flemish Government to provide 750 million euros, matching the sum being provided by the EU as a European Chips Act-enabled subsidy. The investment will allow IMEC to expand its existing clean room facility, adding new semiconductor equipment and processes, to allow it to maintain and develop its leading position within the industry’s research and development sector.

Last week, IMEC hosted a visit of the EC President, Ursula von der Leyen, Alexander De Croo, the Prime Minister of Belgium, along with Flemish Minister President, Jan Jambon and Jo Brouns, Flemish Minister of Innovation.

Also attending IMEC was Peter Winninck, the ASML CEO. IMEC and ASML recently signed a Memorandum of Understanding signalling their intention to intensify their collaboration in the next phase of developing a state-of-the-art high-numerical aperture (High-NA) extreme ultraviolet (EUV) lithography pilot line at IMEC.

The EU and Flemish Government’s combined 1.5 billion euros investment signifies the desire of both the Flanders and wider European Union region to focus on chip technology investment – first recognised in Flanders, at least, as long ago as the 1980s.

In further news, Spain’s First Deputy Prime Minister and Minister of Economic Affairs and Digital Transformation, Nadia Calviño, has today revealed that IMEC is to open its second European research and development centre in Spain. IMEC and the Spanish Government have signed a Letter of Intent to this effect.

UK semiconductor strategy: A patent attorney’s perspective
Wafer cleaning market to reach US$ 17.2 billion
Solvay signs partnership agreement with Shengjian
ACM cleaning platform targets chiplets industry
Vietnam's thriving semiconductor industry fuels economic resilience
GSA celebrates women's innovation
The need for geofencing to help improve semiconductor IP security
All roads lead to Arizona
Time to celebrate and accelerate diversity, equity and inclusion
Cadence completes acquisition of PHY IP assets from Rambus
Wales joins the European Semiconductor Regional Alliance
Magnachip targets EV market
Greene Tweed: When it can’t fail
Advanced Packaging market Size to reach $66.9 billion by 2032
Inventec and Renesas to develop PoC for automotive gateways
Renesas commences Sequans tender offer
Tower Semiconductor and InnoLight partner
Flanders Semiconductors - a new hub in the heart of Europe
Ambiq wins Demo of the Year Award
Advanced packaging market nears US$90 billion
Intel Foundry Services and Tower Semiconductor reach US foundry agreement
MediaTek develops first chip using TSMC's 3nm Process
Advanced X-ray technology for advanced packaging
New developments in underlayers and their role in advancing EUV lithography
Advanced SAM validates integrity of electrostatic chucks
Purdue establishes permanent presence next to NSWC Crane
Bolstering semiconductor ecosystem at Texas A&M University
Semiconductor industry sees revenue increase for the first time since 2021
Bosch completes TSI Semiconductors acquisition
Semiconductor grants for undergraduate women
Sustainability rises up the automotive agenda
Lumibird completes Prima acquisitions
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: