Loading...
News Article

Advancing semiconductor research

News

Laser Thermal's SSTR-F, steady state thermoreflectance in fiber tool will be installed within the shared metrology laboratory at Louisiana Tech's Institute for Micromanufacturing.

Laser Thermal has won a recent contract with Louisiana Tech University for the acquisition of its SSTR-F tool. This advanced technology will be deployed in collaboration with the University's Institute for Micromanufacturing (IfM) to drive cutting-edge research in semiconductor technologies. The SSTR-F tool is a key component in modernizing and enhancing the infrastructure and research capabilities at IfM. It is expected to play a crucial role in supporting the University’s mission to advance fundamental and applied research while fostering collaboration with corporate, government, and academic partners.

This acquisition was made possible through funding from the National Institute of Standards and Technology (NIST). The project aims to advance research in microtechnology, nanotechnology, and semiconductor technologies while strengthening workforce development and industrial partnerships within the domestic microelectronics manufacturing sector.

Dr. Arden Moore, Associate Professor, Director of the Institute for Micromanufacturing, and Interim Associate Dean of Research at Louisiana Tech, emphasized the tool's significance, stating: "The Laser Thermal tool aligns perfectly with our goals. Its unique high-throughput, industry-friendly design and non-destructive testing capabilities make it an invaluable resource for semiconductor research and industrial collaborations. The tool will be housed in the shared metrology laboratory at IfM, where it will be accessible to students, faculty, and external industrial users. With training provided by technical staff, it will support projects ranging from thermal management in electronics to defect detection and the characterization of innovative materials and structures."

The IfM is poised to address critical economic and national security challenges posed by a shortage of domestically produced, trusted semiconductor technologies. By leveraging its established resources, Louisiana Tech seeks to strategically expand its research, education, and workforce development activities. This initiative aims to reclaim domestic expertise, workforce, and manufacturing capacity in microdevices while driving economic growth in Louisiana through the creation of high-tech jobs and diversification of the local economy.

Advancing semiconductor research
Ansys collaborates with Sony Semiconductor Solutions
Nordic Semiconductor to showcase Thingy:91 X cellular IoT prototyping platform at CES 2025
Ansys power next-generation mobility technology at CES 2025
Infineon and Flex showcase zone controller design platform for SDVs
POET Technologies signs agreement with Globetronics in Malaysia
Synopsys and SiMa.ai form strategic collaboration
Repeat orders for QUADRA high-throughput metrology system
Sivers Semiconductors and Ayar Labs expand their partnership
Lam Research introduces collaborative robot
PlayNitride selects Veeco’s Lumina MOCVD system
Marvell introduces 'breakthrough' custom HBM compute architecture
Chiplet Summit features latest chip design technology
Silicon photonics: accelerating growth in the race for high-speed optical interconnects
CCD-in-CMOS technology enables ultra-fast burst mode imaging
2025 6G A look forward
Critical Manufacturing climbs Deloitte’s Technology Fast 50
Semiconductors: The most important thing you probably know the least about
Imec and partners unveil SWIR sensor with lead-free quantum dot photodiodes
Lattice introduces small and mid-range FPGA offerings
SEMI and SMT inspection solutions at NEPCON Japan 2025
Nordic Semiconductor and Kigen demonstrate Remote SIM Provisioning for Massive IoT
Spirent collaborates with Siemens
Quobly forges strategic collaboration with STMicroelectronics
New standards in pressure measurement systems for the semiconductor industry
IBM delivers optics breakthrough
Semiconductor equipment sales to reach $139 Billion in 2026
Marvell introduces 1.6 Tbps LPO Chipset
ACM research strengthens Atomic Layer Deposition portfolio
CEA-Leti demonstrates embedded FeRAM platform compatible with 22nm FD-SOI node
Lattice introduces small and mid-range FPGA offerings
Solace unlocks full potential of event-driven integration
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
x
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: