News Article
SEMI and SMT inspection solutions at NEPCON Japan 2025
Test Research, Inc. (TRI) will join NEPCON Japan 2025, held at Tokyo Big Sight from January 22 – 24, 2025.
TRI will showcase the latest back-end inspection solutions, TR7007Q SII-S and TR7700Q SII-S. The TR7007Q SII-S can inspect Mini-LED, C4 bumps (~100 μm Ø), and 008004 paste inspection applications. The AI-powered 3D SEMI AOI, TR7700Q SII-S, can inspect die, wire diameters of up to 15 μm (0.6 mil), SiP, underfill, bumps, and more. Also presenting at NEPCON Japan will be the High-Speed Multi-Camera 3D AOI, TR7500QE Plus, the world-class High-Speed 3D CT AXI TR7600 SIII for multiple industry applications and the modular board tester, TR5001E SII.
