Loading...
News Article

ASML and imec sign strategic partnership agreement

News

ASML Holding N.V. and imec have signed a new strategic partnership agreement, focusing on research and sustainability.

The agreement has a duration of five years and aims to deliver valuable solutions in two areas by bringing together ASML’s and imec’s respective knowledge and expertise. First, to develop solutions that advance the semiconductor industry and second, to develop initiatives focused on sustainable innovation.

The collaboration incorporates ASML’s whole product portfolio, with a focus on developing high-end nodes, using ASML systems including 0.55 NA EUV, 0.33 NA EUV, DUV immersion, YieldStar optical metrology and HMI single- and multi-beam technologies. These tools will be installed in imec’s state-of-the-art pilot line and incorporated in the EU- and Flemish-funded NanoIC pilot line, providing the most advanced infrastructure for sub-2nm R&D to the international semiconductor ecosystem. Focus areas for R&D will also include silicon photonics, memory and advanced packaging, offering full stack innovation for future semiconductor-based AI applications in diverse markets.

A new area in the collaboration consists of a significant contribution to fund innovative ideas and activities in imec’s research funnel that bring environmental and societal benefits.

ASML’s president and CEO Christophe Fouquet comments: “This agreement marks the next step in the longstanding co-operation between ASML and imec. It signals our joint ambitions to develop solutions for the semiconductor industry and fits our strategy of investing in technology and innovation that will benefit society at large.”

“We are excited to continue our longstanding unique partnership with ASML, offering the industry access to the most advanced patterning solutions for over 30 years,” states Luc Van den hove, President and CEO at imec, “The inclusion of ASML’s full product portfolio will allow us to expand and further mature the capabilities of our pilot line, providing the entire semiconductor ecosystem with the most advanced R&D to tackle the challenges of AI-driven technological advancements. Since imec has a strong focus on sustainable innovation, having this explicitly included in our partnership is a great addition.”

The ASML investment in the partnership is complemented with funding made available by the Chips Joint Undertaking and the Flemish government (for the realization of the EU Chips Act NanoIC pilot line), and by the Dutch government (as an Important Project of Common European Interest).

The acquisition and operation of the NanoIC pilot line are jointly funded by the Chips Joint Undertaking, through the European Union’s Digital Europe (101183266) and Horizon Europe programs (101183277), as well as by the participating states Belgium (Flanders), France, Germany, Finland, Ireland and Romania. For more information, visit nanoic-project.eu.

Making 0.55 NA technology available at imec was part of the Next Gen-7A project (IPCEI22201) funded by the Dutch government as an Important Project for Common European Interest (IPCEI). For more information, visit IPCEI ME/CT.

Avoiding unscheduled downtimes in semicon fabs with preventive vacuum service
Nu Quantum partners with the University of Sussex, Cisco, and Infineon
NVIDIA continues to dominate global semiconductor sector
Aeluma to showcase sensor and silicon photonic solutions
Advancing European sovereignty in HPC with RISC-V
The rise of chiplets and simplified interconnectivity
Critical Manufacturing to show at APEX 2025
ASML and imec sign strategic partnership agreement
Renesas extends mid-class AI processor line-up
Renesas and Altium introduce Renesas 365, Powered by Altium
Infineon brings RISC-V to the automotive industry
Baya Systems 'revolutionises' AI scale-up and scale-out
onsemi to acquire Allegro MicroSystems
TASMIT launches Glass Substrate Inspection System
The quest for room-temperature superconductors
Agile Analog delivers anti-tamper solution to fabless company in Taiwan
VTT and IQM launch first 50-qubit quantum computer developed in Europe
Partnership discussions for six UK tech firms initiated in South Korea
Water usage in semiconductor manufacturing to double by 2035
Saras Micro Devices participates in CHIPS National Advanced Packaging Manufacturing Program initiatives
Terecircuits becomes National Semiconductor Technology Center member
Beyond silicon
Marvell demonstrates leading 2nm silicon for accelerated infrastructure
ACM Research announces China qualification
Making sure that AI and High Bandwidth Memory stack up
TSMC invest $100 billion in U.S.
Attopsemi expands its I-fuse OTP portfolio on X-FAB’s 180nm Platform
sureCore collaborates with KU Leuven
Myriota and Nordic Semiconductor partner
Premier electronics packaging conference celebrates 75 years of serving the industry
Analog Devices wins up to $105 million in Federal CHIPS funding
GlobalFoundries and MIT collaborate
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
x
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: