Attopsemi expands its I-fuse OTP portfolio on X-FAB’s 180nm Platform
X-FAB Silicon Foundries SE, the leading analog/mixed-signal and specialty foundry, and Attopsemi Technology, the innovative one-time programmable (OTP) IP solutions provider, have successfully demonstrated the latest version of Attopsemi’s I-fuse S3® OTP on X-FAB's XH018 technology platform. This achievement gives X-FAB customers greater flexibility in choosing the optimal OTP solution for their designs.
Following a previous announcement of the demonstration and availability of the I-fuse S3® OTP based on 3.3V devices, this new design uses 1.8V devices – thus reducing the footprint by a factor of four compared to the existing version. Both versions are available in different memory densities, ranging from 8 bits to 8K x 8 bits (64K bits).
The I-fuse S3® OTP (whereby S3 means “super-small and scalable”) is an innovation in peripheral design that complements the I-fuse® cell technology. By employing a novel array architecture, it achieves a compact form factor and scalability, closely following Moore’s Law for small to medium-sized OTP applications. This innovation is incorporated into X-FAB’s XH018, a powerful modular sensor and high-voltage EPI technology, supporting an extended temperature range from -40°C to 175°C. It features a modular 1.8V/3.3V ultra-low-noise process designed for automotive-grade, industrial, and medical applications.
“We are pleased with the performance of the XH018 platform” said Shine Chung, Chairman of Attopsemi. “The high reliability and high-temperature capability of this X-FAB process supports our unprecedented I-fuse® OTP performance. It is very encouraging to see that our collaboration has already triggered new projects with mutual customers in industrial and consumer areas, and that it is starting to support new opportunities in the medical sector as well. With the IP proven functional up to 150°C, it also has the potential to enable additional opportunities in automotive applications".
Nando Basile, Product Marketing Manager for Memory Solutions at X-FAB, added: “Expanding Attopsemi’s I-fuse® IP on our XH018 technology gives our customers more options to integrate and embed proven third-party IP into their designs. This helps optimize time-to-market while maintaining a cost-effective approach with no mask adders to the X-FAB core process. These solutions are a perfect fit for our NVM portfolio, complementing our automotive-focused OTP and multi-programmable solutions like Flash and NVRAM. We’re seeing growing interest in these solutions, especially in industrial, IoT, and medical applications where a small form factor is of paramount importance.”
