Loading...
News Article

Onto Innovation and LPKF set to accelerate mass production of glass core substrates

News

LPKF joins Onto Innovation’s Packaging Applications Center of Excellence (PACE).

LPKF Laser & Electronics SE has joined Onto Innovation's Packaging Applications Center of Excellence (PACE) in 2024. PACE aims to develop seamless process integration and a secure supply chain to accelerate mass production of panel-level packages based on glass cores. These have become essential in the semiconductor architecture to meet the needs of demanding end applications like high-performance computing (HPC), artificial intelligence (AI), cloud computing and machine/deep learning. LPKF’s LIDE technology excels in microprocessing defect-free through glass vias (TGV) for advanced glass substrates. Onto Innovation’s Firefly® system provides an automated inspection and metrology solution for advanced IC substrates and panel level packaging.


In a further step to enable process and supply chain readiness for high-volume manufacturing of advanced glass substrates and glass interposers, Onto and LPKF are combining their strengths by installing Onto’s state-of-the-art Firefly system into the cleanroom facility at Vitrion, LPKF‘s Center of Excellence for glass processing in Hannover, Germany in the second quarter this year. This collaboration will enable high throughput quality control of glass substrates and glass interposers, thereby reinforcing the industry’s move toward efficient, high-yield production.


“Our collaboration within PACE has already delivered excellent results,” says Dr. Roman Ostholt, Managing Director LIDE at LPKF. “Glass offers the potential to drastically reduce the cost of interposers without sacrificing chip quality. The installation of Onto’s Firefly system marks the next step in this partnership and further strengthens our joint commitment to providing a high-volume manufacturing solution for advanced packaging applications.”


“Onto Innovation is honored to collaborate with industry leaders like LPKF for innovations on glass panels,” says Mike Rosa, chief marketing officer and senior vice president, strategy at Onto Innovation. “The integration of our Firefly system for TGV process control at Vitrion marks a significant milestone in advancing the quality and reliability of glass substrates and interposers. Together, we are dedicated to driving forward these advanced packaging applications.”

Onto Innovation and LPKF set to accelerate mass production of glass core substrates
Quantum sensors: from lab to chip through semiconductor fabs
SONOTEC attends European CMP and WET Users Group Meeting in Leuven, Belgium
iPronics unveils World’s silicon photonics optical circuit switch
Marvell demonstrates silicon photonics light engine
Baden-Württemberg attracts imec to lead development of chiplet-based technology
Europe’s semiconductor industry focuses on sustainable growth
Arteris opens new Engineering Hub in Poland
SONOTEC attends European CMP and WET Users Group Meeting in Leuven, Belgium
High-accuracy packaging in panel level packaging
ImageIR 6300: Cooled Thermographic Camera for Continuous Industrial Operation
PhotonDelta and Silicon Catalyst form strategic collaboration
Sarcina Technology launches AI platform
xMEMS introduces Lassen
Delivering high efficiency and power density
FTD solutions forms partnership with CEA-Leti
X-FAB, SMART Photonics and Epiphany Design demonstrate InP-on-Silicon design flow
Plasmatreat opens new office for the Benelux region
Collaborative EU Project set to deliver breakthrough in Space Imaging Sensing
3D Stacking technology advances Embedded AI in Image Sensor development
Beebolt launches AI-powered assistant to simplify global trade for SMEs
Device enables direct communication among multiple quantum processors
High temperature relay permits denser board designs
£9 million funding boost to bring key semiconductor manufacturing capability to Scotland
Imec and ZEISS intensify collaboration
Infineon and RT-Labs integrate six key industrial communication protocols
SAFE-T product family transforms contamination control
PCIM Asia Shanghai 2025: Bringing together the Asian power electronics community
Qatar Airways Cargo ‘revolutionises‘ semiconductor transport
Thermo Fisher Scientific introduces the Vulcan Automated Lab
Emerson partnership bolsters UT expertise in semiconductors and AI
Intel appoints Lip-Bu Tan as Chief Executive Officer
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
x
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: