GlobalFoundries and Silicon Labs expand partnership
This collaboration – the first of its kind to introduce this process technology in the United States – aims to accelerate the development and production of high-performance wireless solutions manufactured at GF’s advanced facility in Malta, New York, reinforcing U.S. semiconductor resilience.
As a part of the partnership, Silicon Labs wireless system-on-chips (SoCs) will be manufactured on GF’s new 40nm Ultra Low Power platform, introduced this fall at GF’s Global Technology Summit in Silicon Valley. Based on GF’s silicon proven 40nm platform and enhanced with embedded SuperFlash technology, the 40ULP-ESF3 platform combines ultra-low standby leakage devices, high endurance and integrated analog features, making it ideal for secure, battery-powered IoT edge applications that require always-on functionality, data security and energy-efficiency.
“We’re excited to deepen our strong partnership with GlobalFoundries to accelerate U.S.-based innovation in wireless connectivity,” said Matt Johnson, President and CEO, Silicon Labs. “This collaboration underscores our shared commitment to innovation and U.S. manufacturing leadership – addressing rising demand for our Series 2 products and strengthening global supply chain resilience to deliver competitive, secure and scalable wireless solutions for our customers.”
“Today’s announcement marks a significant milestone in our partnership with Silicon Labs, as we work together to deliver secure, reliable wireless connectivity and power-efficient solutions for the next generation of smart consumer and industrial devices,” said Tim Breen, CEO of GlobalFoundries. “Bringing this differentiated low power technology to our New York fab expands our ability to deliver power-efficient, essential chips and underscores our commitment to secure, onshore semiconductor manufacturing.”
The expanded partnership addresses the growing demand across consumer and industrial IoT applications for advanced wireless connectivity and reflects both companies’ commitment to strengthening U.S. semiconductor leadership and building a more resilient, geographically diverse supply chain.
Development is underway, with production ramping over the next several years.
