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Monday 3rd March 2014
The tool, equipped with an in-situ laser ellipsometer, will be used for nano research at the Xi`an Jiatong University in China 
Monday 3rd March 2014
Year-to-year global sales have increased by the largest margin in nearly three years with sales in the Americas up by 17.3 percent compared to last January
Friday 28th February 2014
The company's FilmPro software is used with Craic Technologies microspectrometers to measure the thickness of thin films of microspot areas in both reflectance and transmission
Friday 28th February 2014
The partnership will enable the developer community to rapidly create devices using CSR’s portfolio of connectivity and location solutions with the flexibility of ARM microcontroller
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Friday 28th February 2014
Air Products calls for collaboration to maintain semiconductor innovation 
Friday 28th February 2014
The company used CEA Leti's piezoresistive nanowire technology to create the chip. This, says Tronics,is a major step towards the industrialisation of 6DOF and 9DOF products 
Friday 28th February 2014
The subsidiary of Teledyne Technologies Incorporated will use the cash to develop MEMS infrared imaging in Canada 
Friday 28th February 2014
The device which is suited to  navigation, health and fitness applications comes in a compact 3.5mm x 3.5mm x 0.9mm package
Friday 28th February 2014
The device has 65 dB SNR with low-power mode for ‘AlwaysOn’ applications
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Thursday 27th February 2014
The firm is promoting the adoption of communication functions for wearable healthcare devices
Thursday 27th February 2014
 Increasing demand for productivity information has been driven by needs for better yields
Thursday 27th February 2014
Intel came on top again, Micron and Qualcomm showed the biggest R&D increases, while Broadcom had the highest R&D/sales ratio
Wednesday 26th February 2014
G450C has chosen Sokudo's immersion ArF lithography track to be added to Dainippon Screen’s 450mm tool set in New York
Wednesday 26th February 2014
The firm believes the performance and cost advantages of its fcCuBE technology drive customer adoption and key design wins in mobile, consumer and cloud computing
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Wednesday 26th February 2014
Elelectronic and optical properties on a single electronic chip could be a break­through in making the ideal computer a reality
Wednesday 26th February 2014
Revenues in the sector could go up by 11 percent thanks to safety issues
Tuesday 25th February 2014
Researchers are to detail a one step cleaning process for TSVs which include removing photoresist and polymer residues
Monday 24th February 2014
Aselta's data preparation solution for Mapper’s parallel electron beam writer optimises resolution, pattern fidelity and writing time

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