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Wednesday 18th December 2013
The supplier of advanced wafer processing solutions for the global semiconductor industry has again been recognised for its achievements in manufacturing and skills investment
Wednesday 18th December 2013
Wednesday 18th December 2013
The firm's latest integrated digital radio chip targets smart devices and global markets
Wednesday 18th December 2013
The new chip used for the Z3740 has one of the smallest geometries in a mobile device today and incorporates a new transistor
Wednesday 18th December 2013
As part of an EU development programme, these devices will be suitable for use in pacemakers and other implantable medical devices, electric cars and highly efficient memories for computers and mobile devices
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Monday 16th December 2013
New gaming devices use a sophisticated system-on-chip device which produces heat. To sustain optimal performance through the service life of the gaming console, Honeywell has developed a new solution to this problem
Monday 16th December 2013
Monday 16th December 2013
The MEMS equipment maker has been honoured at one of the industry’s premier MEMS events
Friday 13th December 2013
Within the industry, mobile DRAM will account for 40 percent of DRAM revenue in 2014
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Friday 13th December 2013
KPMG's survey also finds broadening applications markets that may signal sn end to boom or bust cycles
Friday 13th December 2013
The company's combined CMOS-DMOS process reduces heat generation by 30 percent
Friday 13th December 2013
The Improved surface thermal conductance, reduced series resistance and better thermal cycling come with improved switching performance, a benefit for dies and modules
Friday 13th December 2013
The firm's device is ideal for applications designed for harsh environments
Friday 13th December 2013
The firm's WaferStorm thick-film remover selection by a major Asian foundry and US chip manufacturer validates the market shift towards single-wafer technology
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Thursday 12th December 2013
The Semiconductor Manufacturing Technology business group faced a declining market - particularly at the beginning of the reporting period, with a slight recovery being evident in the second half of the year
Thursday 12th December 2013
Although complete high-quality 2.5D (Silicon Interposer) and 3D silicon devices can be manufactured, the final packaging flows are lacking
Thursday 12th December 2013
TrendForce says capacity at the Wuxi fab in October and November was 30K and 70K wafers per month, respectively. A target capacity of 100K is set for December, and the plant is expected to return to fully loaded 130K wafers per month in January 2014

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