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Wednesday 21st August 2013
The main reason for a delay in filing was down to the company reviewing the timing of the recognition of revenue and related expenses on the sale of some of its products
Tuesday 20th August 2013
The firm's recent advances in embedded wafer level packaging technology reduce bottom package height to less than 0.3mm for an overall PoP stack height of just 0.8mm
Monday 19th August 2013
A decline in foundry bookings was offset by growth in memory and logic orders and higher bookings in the Display Group and Applied Global Services in the last quarter. The company has also taken on a new CEO
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Wednesday 14th August 2013
Stifling the microprocessor market, it looks like PCs are on the way out
Wednesday 14th August 2013
The partnership is targeted at finding breakthrough solutions for semiconductor wafer level and interconnect packaging technologies
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Tuesday 13th August 2013
The foundry has been honoured for its overall performance in quality, cost savings initiatives and customer support
Tuesday 13th August 2013
The new Samsung SSD for enterprise applications offers nearly 1 terabyte of storage with extremely high reliability
Monday 12th August 2013
A new sensor incorporating gallium nitride and zinc oxide nanowires could provide an artificial sense of touch and be used in MEMS systems
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Thursday 8th August 2013
Plansee to present their ultra-pure coating materials at Touch Taiwan
Wednesday 7th August 2013
Breakthrough probing results, achieved with CM300 probe system, enable 3D IC market progress

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