Improved Productivity and Reliability for Thin Memory Chips

DISCO, a semiconductor manufacturing equipment manufacturer, has developed DDS2320, a fully automatic die separator capable of processing ∅300 mm wafers that contributes to improved throughput and reliability in memory production.

This equipment will be exhibited at SEMICON Japan 2019 (December 11 to 13, Tokyo Big Sight).

Memory demand is expected to increase with the development of IoT, AI, and ADT. As a result, productivity improvement in memory chip manufacturing and improvement of post-processing device reliability will be required more than in the past.

While DISCO had previously introduced the die separator* DDS2300 to the market, DD2320 has been newly developed to meet these emergent needs.

* Die separator: Equipment used to singulate die from workpieces attached to dicing tape. First, die attach film, which is used to mount and laminate thin die, or a wafer with an internal SD layer formed after laser stealth dicing is attached to the tape. Then, the die are singulated by expanding the tape.

Efficient production of thin die is now possible due to the adoption of a newly developed expansion unit.