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Thursday 25th July 2013
The ultra-slim mobile memory chips will enable thinner and more sophisticated top-of-the-range smartphones
Thursday 25th July 2013
The tiny 2mm x 2mm precision orientation sensor combo enhances freedom to optimise system performance and create smaller form factors in products such as smartphones
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Wednesday 24th July 2013
MEMS is still following vigorous growth, urging manufacturers to consider consumer applications in their strategies
Wednesday 24th July 2013
Leveraging on the success of its 300mm tool, the Ultratech laser spike annealing system will be used for 450mm manufacturing
Wednesday 24th July 2013
Using a new technology, very high-quality materials and devices, such as processing semiconductors over large areas, can be accomplished with an instrument slightly larger than a printer
Wednesday 24th July 2013
The new NSX metrology series includes application-specific configurations to address unique metrology requirements for wafer level packaging, 2.5D and 3DIC
Tuesday 23rd July 2013
The systems will be used in the fabrication of high performance electronic and optical devices including transistors
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Tuesday 23rd July 2013
These sectors now account for 78 percent of the firm's revenue
Tuesday 23rd July 2013
The developed technology puts a thin-film coating of STi’s titanium oxide-based composite metal compound on the glass substrate used in PV modules. 
Tuesday 23rd July 2013
Depending on the metric used, either Samsung or Apple will be the top chip spender for 2013

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