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Tuesday 20th November 2018
Thursday 15th November 2018
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Tuesday 13th November 2018
Monday 12th November 2018
Siltectra's Cold Split technology will be used to double the number of chips per SiC wafer.
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Friday 2nd November 2018
By Mark Firth is Technical Director of Ichor Systems
Tuesday 30th October 2018
New two-story, 27,000 square foot construction to accommodate administrative functions
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Wednesday 24th October 2018
Wednesday 24th October 2018
Platform will allow FBH to automate a number of III-V plating-related processes on a single tool
Wednesday 24th October 2018
Working with an expert can help to optimize essential drying variables such as level of cleanliness, drying speed, and adjustments for product geometry

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