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Tuesday 5th July 2011
Better than amorphous-silicon performance claimed with printable option
Monday 4th July 2011
STATS ChipPAC appoints Pasquale Pistorio as Director
Sunday 3rd July 2011
Semiconductor wet chemicals fall short of 2008 levels
Friday 1st July 2011
Semiconductor industry leaders across the value chain discuss and react to the KETs final report
Friday 1st July 2011
New spinout seeks to develop next generation of semiconductors
Wednesday 29th June 2011
Electronic gases market recover to 2008 levels
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Tuesday 28th June 2011
Renesas Electronics to close the Renesas Eastern Japan semiconductor’s Tokyo device division
Tuesday 28th June 2011
Key Enabling Technologies to spur Europe's technological leadership
Tuesday 28th June 2011
CMP slurry set to grow 15% in 2011 as IC demand continues 
Monday 27th June 2011
Bridgepoint backs acquisition of SPP Process Technology Systems (SPTS)
Monday 27th June 2011
DDR3 modules to remain leading DRAM technology in 2011
Saturday 25th June 2011
European semiconductor industry leading indicator up in April
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Saturday 25th June 2011
Semiconductor Sales in Q3 2012 cited as key point
Tuesday 21st June 2011
First-ever Integration of In-line Metrology with Temporary Bonding/Debonding 
Friday 17th June 2011
CMP consumables market rebounds sharply
Thursday 16th June 2011
Applied Materials introduces tungsten planarization technology to enable advanced chip designs
Tuesday 14th June 2011
Metryx announces participation in joint European SEAL Project
Tuesday 14th June 2011
IHS tips China’s fabless market to double by 2015
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Thursday 9th June 2011
Temporary bonding equipment market will see 5x growth in value 2011-2016
Wednesday 8th June 2011
Apple becomes world’s largest OEM semiconductor buyer in 2010
Wednesday 8th June 2011
Manufacturing facility to meet expanding demand for on-site fluorine systems
Tuesday 7th June 2011
System designed specifically for processes that use through silicon vias (TSV) to connect multiple die in a single package
Tuesday 7th June 2011
Technology to Reduce Power Consumption in Digital Products 
Friday 3rd June 2011
Collaboration aims to commercialise SiC-on-silicon as a viable semiconductor material for LED, power and MEMS devices.

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