+44 (0)24 7671 8970
More publications     •     Advertise with us     •     Contact us
 
News Article

Toshiba Releases 16 Megapixel CMOS Image Sensor


Toshiba Corporation has announced the launch of "T4KC3", a 16 megapixel(MP) BSI CMOS image sensor.

In the mobile device market, manufacturers constantly target a small form factor; a thinner final product. Toshiba is meeting this need with a design method, already deployed in current products, that realizes smaller CMOS sensor chips and low-power circuits. That method has now resulted in the world's smallest class 16MP chip, which also realizes 30fps at full-resolution output with power consumption of 240mW or lower.

The functional range of the new sensor supports users in capturing beautiful images and movies. Phase-Detection Auto-Focus (PDAF), recently embedded in SLR cameras, achieves quick focusing that surpasses conventional auto-focusing, and makes it easier for mobile devices to capture high quality images and movies.

"T4KC3" also incorporates Toshiba's Bright Mode technology, which boosts image brightness up to four times and enables HD video capture at 240fps equivalent, and supports high dynamic range (HDR) to capture natural images of scenes with a high contrast ratio, ending the problem of over- and underexposed images.

Additionally the new sensor incorporates 16Kbit OTP, which can store lens shading correction data for four conditions at maximum, such as indoors and outdoors, daylight and sunset. Settings can be switched with a simple command.

Toshiba products allow smartphones and tablets to record high quality video at high frame rates, contribute to smaller form factors and extended imaging functions, while achieving reductions in module size, power consumption and part counts in the camera module, opening the way to the design of thinner mobile devices.

Sample shipments are scheduled to start in September this year.

Purdue, imec, Indiana announce partnership
Resilinc partners with SEMI on supply chain resilience
NIO and NXP collaborate on 4D imaging radar deployment
Panasonic Industry digitally transforms with Blue Yonder
Global semiconductor sales decrease 8.7%
MIT engineers “grow” atomically thin transistors on top of computer chips
Keysight joins TSMC Open Innovation Platform 3DFabric Alliance
Leti Innovation Days to explore microelectronics’ transformational role
Quantum expansion
indie launches 'breakthrough' 120 GHz radar transceiver
Wafer fab equipment - facing uncertain times?
Renesas expands focus on India
Neuralink selects Takano Wafer Particle Measurement System
Micron reveals committee members
Avoiding unscheduled downtime in with Preventive Vacuum Service
NFC chip market size to surpass US$ 7.6 billion
Fujifilm breaks ground on new €30 million European expansion
Fraunhofer IIS/EAS selects Achronix embedded FPGAs
Siemens announces certifications for TSMC’s latest processes
EU Chips Act triggers further €7.4bn investment
ASE recognised for excellence by Texas Instruments
Atomera signs license agreement with STMicroelectronics
Gartner forecasts worldwide semiconductor revenue to decline 11% in 2023
CHIPS for America outlines vision for the National Semiconductor Technology Center
TSMC showcases new technology developments
Alphawave Semi showcases 3nm connectivity solutions
Greene Tweed to open new facility in Korea
Infineon enables next-generation automotive E/E architectures
Global AFM market to reach $861.5 million
Cepton expands proprietary chipset
Semtech adds two industry veterans to board of directors
Specialty gas expansion
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: