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Friday 26th September 2008
The company announces signing and closing of definite agreements with its lenders in a bid to reduce a $250 million debt and restructure the balance sheet. The agreement will increase the shareholders' equity, improve cash flow and finances.
Friday 26th September 2008
The company has been named exclusive US reseller of IT innovation semiconductor and solar equipment automation software and is also named service partner to integrate and deploy equipment automation software for 200mm and 300mm semiconductor equipment as well as solar manufacturing equipment.
Thursday 25th September 2008
Equipped with its ESD design portfolio, Sarnoff Europe announced that it has joined the TSMC Design Centrer Alliance (DCA). The DCA Programme helps align IC companies and TSMC qualified providers.
Thursday 25th September 2008
SPIE Photomask will explore issues of the deep sub wavelength era at a photomask technology symposium.
Thursday 25th September 2008
New NanoMarkets report states that OLED lighting markets will reach $4.5 billion by 2013.
Thursday 25th September 2008
The semiconductor company's expertise applied to US government programme to develop carbon electronics for RF applications (CERA).
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Wednesday 24th September 2008
Negotiations with the new potential shareholders are proceeding. Closing of the deal expected in the near future.
Wednesday 24th September 2008
The commission announces its 72nd member country.
Wednesday 24th September 2008
The company has updated its financial targets following the delay of raw material deliveries from its suppliers due to the effects of Hurricane Ike.
Tuesday 23rd September 2008
Latest round of funding primes Altair's global expansion and future developments in mobile WiMAX, LTE and XGP chip technologies.
Tuesday 23rd September 2008
Both companies agree to molecular beam epitaxy (MBE) business transfer.
Monday 22nd September 2008
The company delivers virtual models of automotive powertrain management microcontrollers. The latest virtualisation tools are designed to help automotive developers manage escalating software complexity.
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Monday 22nd September 2008
Thomas Weber, head of corporate communications, leaves Infineon and Ralph Driever takes over as new head of the department.
Thursday 18th September 2008
Both companies joined to strengthen their manufacturing, technology and geographical position.
Thursday 18th September 2008
The bonder division of Vermont based SUSS MicroTec now holds ISO certification.
Wednesday 17th September 2008
The company licenses implant and metal thickness metrology technology from Applied Materials.
Wednesday 17th September 2008
The consortium, focused on accelerating silicon on insulator (SOI) innovation into broad markets, announced the availability of the first chapters of its SOI implementation guide.
Wednesday 17th September 2008
The company clearly states that rumours will be ignored.
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Wednesday 17th September 2008
The company announces that it restructures and shed jobs.
Wednesday 17th September 2008
The company signs definitive agreement to purchase Intoto. Transaction advances embedded multicore software development.
Wednesday 17th September 2008
The company opens commercial plastic electronics manufacturing factory in Dresden, Germany.
Tuesday 16th September 2008
The cuts will be taking place within the next three years as Hewlett-Packard (HP) plans to create greater opportunities while streamlining costs integrating recently acquired Electronic Data Systems (EDS).
Monday 15th September 2008
Engineers from the University of Utah have developed a new method that cuts waste in making most efficien solar cells.
Monday 15th September 2008
Vishay announces acquisition of a specialty capacitor product line from Kemet.

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