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Monday 19th January 2009
PricewaterhouseCoopers (PwC) releases report stating that companies must belt up before taking the road to collaboration but questions whethertechnology companies afford not to?
Wednesday 14th January 2009
Design & Reuse plan to publish 3rd party IP from TSMC on their website for general use and to maintain the information.
Wednesday 14th January 2009
Applied Materials Chairman James C. Morgan to become Chairman Emeritus at annual meeting
Wednesday 14th January 2009
FormFactor has announced a cost reduction plan in reaction to global financial events.
Wednesday 14th January 2009
Standards organisation ASTM International launches “Year of the Professor” campaign for 2009
Wednesday 14th January 2009
NanoDynamics establishes partnership agreement with Israeli-Based Gadot Lab Supplies for distribution of Nano-Metals
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Tuesday 13th January 2009
First software tool designed specifically to help solar cell manufacturers improve energy conversion efficiency and process yield.
Tuesday 13th January 2009
A joint development programme will employ S.E.T.'s high accuracy FC300 system to explore advanced 3D applications.
Friday 9th January 2009
ON Semiconductor Corporation announced that it is taking additional cost reduction measures.
Friday 9th January 2009
The company makes full-scale entry into solar photovoltaic systems business and establishes new, dedicated business organisation.
Friday 9th January 2009
Manufacturing companies run the risk of failure by cutting their marketing budgets, warns the head of a leading PR agency.
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Thursday 8th January 2009
The supplier of specialised and custom wafer foundry services and a division of DALSA Corporation, announced the launch of the first phase of a 200mm MEMS (micro electro mechanical systems) manufacturing line at its semiconductor wafer foundry in Bromont, Quebec, Canada. The announcement closely follows several new MEMS supply contracts the Company has recently received for delivery of product in 2009 and for new product development.
Thursday 8th January 2009
The conference gathers 150 industry leaders at ISS Europe 1-3 February 2009 in Dresden.
Thursday 8th January 2009
Retains Needham & Company to explore financial and strategic options
Thursday 8th January 2009
Reactive NanoTechnologies, (RNT), announced that it has reached an agreement with GS PMC Korea, a supplier of technology based materials headquartered in Seoul, Korea. GS Korea PMC will manage the sale and distribution of NanoFoil products into a variety of applications including electronics assembly, solar, and sputter target bonding throughout Korea.
Wednesday 7th January 2009
New investment enables commercial team expansion in US and Asia and new additions to product roadmap.
Wednesday 7th January 2009
The company proceeds to advance development of novel short wavelength light sources.
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Wednesday 7th January 2009
The company acquires Calcarb's rigid graphite felt for use in solar energy market.
Wednesday 7th January 2009
The memory chipmaker intends to restore compliance with NYSE minimum market capitalisation standard.
Wednesday 7th January 2009
The company announces appointment of Richard L. Clemmer as CEO and Frans van Houten resigns as president and CEO.
Wednesday 7th January 2009
Localised support to address increased demand for 3D IC process development in Asia Pacific region.
Tuesday 23rd December 2008
SiGe Semiconductor has announced a record-setting year of growth fro the company, with greater than 350 million units shipped since the company's inception.
Tuesday 23rd December 2008
In a short statement 3M and the EV Group (EVG) have agreed to settle a patent infringement litigation brought by EVG against 3M in the U.S. District Court of the Southern District of New York relating to systems for temporary wafer bonding.

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