The supplier of specialised and custom wafer foundry services and a division of DALSA Corporation, announced the launch of the first phase of a 200mm MEMS (micro electro mechanical systems) manufacturing line at its semiconductor wafer foundry in Bromont, Quebec, Canada. The announcement closely follows several new MEMS supply contracts the Company has recently received for delivery of product in 2009 and for new product development.
Reactive NanoTechnologies, (RNT), announced that it has reached an agreement with GS PMC Korea, a supplier of technology based materials headquartered in Seoul, Korea. GS Korea PMC will manage the sale and distribution of NanoFoil products into a variety of applications including electronics assembly, solar, and sputter target bonding throughout Korea.
In a short statement 3M and the EV Group (EVG) have agreed to settle a patent infringement litigation brought by EVG against 3M in the U.S. District Court of the Southern District of New York relating to systems for temporary wafer bonding.