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Thursday 26th June 2008
Oral ruling returns the proceedings to the Korean Patent Court with instructions to revisit the prior decision holding the claims of FormFactor's Korea Patent No. 252457 valid.
Thursday 26th June 2008
Carl Zeiss designates SCHOTT Lithotec as a Supply Chain Partner
Thursday 26th June 2008
The financial concerns affecting the semiconductor industry have hit Austrian company, SEZ, with at least 80 jobs to go at the company, mainly in the Austrian operations. EuroAsia Semiconductor spoke to Kurt Lackenbucher, Executive VP & Chief Operating Officer who confirmed that the job losses will go ahead.
Tuesday 24th June 2008
New specifications cover FPD, MEMS and semiconductor industries to address critical manufacturing challenges
Monday 23rd June 2008
Toppan Printing enters into new photomask process development agreement with IBM. New collaboration to include early establishment of 22nm photomask process
Monday 23rd June 2008
The two competitors merge to combine their strength in technical expertise and expand their product portfolio.
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Monday 23rd June 2008
BSK & TECH announces initial $1.8M 3D chip order with LCD panel supplier KDC
Friday 20th June 2008
The companies, using twisted direct silicon bonding, achieved higher hole mobility for future generation CMOS technology.
Friday 20th June 2008
A research team at the University of Michigan has developed a low power chip that dramatically uses less power than comparable chips on the market. At 30pW it uses about 30,000 less power in sleep mode.
Friday 20th June 2008
The newly commissioned plant of joint venture Siltronic Samsung Wafer Pte has started operation for its 300mm wafer production with a target of 300,000 wafers a month.
Friday 20th June 2008
Stanford University researchers, supported by the Semiconductor Research Corporation (SRC) overcome mispositioned carbon nanotubes to create logic circuits at wafer scale. Unruly CNTs are tamed, full wafer scale growth is demonstrated, viable commercial use in reach.
Thursday 19th June 2008
The design of a security application integrated chip using 65 nm technology will strengthen Dubai’s position on the international IC design map withthe contribution of the DSO
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Wednesday 18th June 2008
Mentor Graphics is reluctant to accept a $1.6 billion proposal from Cadence Design Systems even at a 30% premium offer.
Wednesday 18th June 2008
The research company reports progress on simplified high-k/metal gate process for the 32nm node
Wednesday 18th June 2008
Renewable Energy Corporation ASA (REC) has decided to invest close to NOK 13 billion in the first phase of an integrated manufacturing complex for production of wafers, cells and modules in Singapore
Tuesday 17th June 2008
Intel spins off solar energy technology; Intel Capital invests in SpectraWatt. Cogentrix Energy, PCG Clean Energy and Technology Fund, Solon AG also invest in SpectraWatt to deliver solar cells
Tuesday 17th June 2008
The company aims to expand into in Europe by creating an R&D base for their automotive modules
Tuesday 17th June 2008
First semiconductor based PET scanner demonstrates potential to aid in early diagnosis of disease.
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Tuesday 17th June 2008
The technique could ultimately provide the answer how light crosses gaps that do not permit conventional electromagnetic waves to pass
Tuesday 17th June 2008
US$ 3 million grant for universities in Texas  
Monday 16th June 2008
Research project on silicon photonic components launched in May 2008
Monday 16th June 2008
The NT$2 trillion revenue mark is estimated to be crossed in 2010 by Taiwan’s semiconductor industry
Friday 13th June 2008
The process, which shortens mask cycle time and controls cost, will be starting volume production in June
Friday 13th June 2008
The association and the organiser announced to collaborate on photovoltaic innovation on a global scale. New exposition will be held in conjunction with Intersolar 2009

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