effective devices expected on market soon. The technology could be
used to convert glass buildings into big energy plants. Scientists
from the Massachusetts Institute of Technology (MIT) have developed a
way to coat substrates most effectively.
Cypress Semiconductor and Tower Semiconductor have announced the successful completion of Cypress’s first 0.18 micron stitched large format Contact Image Sensor (CIS) device. The plans state that the product will be manufactured using Tower Semiconductor’s latest generation of stitching technology at Tower’s Fab 2, in Israel.
The Economic Development Board Chairman, Applied Materials executives, and U.S. Ambassador Patricia Herbold have broken ground for the construction of a new Singapore operations facility that will serve Applied’s business activities throughout Asia. The facility is due for completion in late 2009.
and Haas Electronic Materials announced the recent opening of its new
$60 million immersion lithography facility to support its extensive
research and development of advanced 193 nanometre (nm) lithography
materials used in the manufacture of semiconductor devices. The
milestone was marked by an opening ceremony held on June 26 that was
attended by employees, vendors and representatives from the local