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Thursday 18th October 2007
It has been announced that Sony are to sell its advanced computer chip operations to Toshiba.
Thursday 18th October 2007
Robert Bosch GmbH has purchased an Omega fxP etch system from Aviza Technology, for deep silicon etch processes required in its MEMS device manufacturing.
Thursday 18th October 2007
It has been reported that amid some major changes taking place at the 45-nm node and beyond, Axcelis Technologies Inc. has decided to cease future product development in the rapid thermal processing (RTP) tool arena.
Thursday 18th October 2007
Hynix Semiconductor Inc. has announced that third-quarter profits fell a sharp 56% on a failure to achieve expected cost reductions and a slump in memory chip prices.
Thursday 18th October 2007
Renesas Technology Europe has announced an expansion to its successful SH708x-line-up with a version of the SH7083F Flash microcontroller in a compact 10x10mm and 1.4mm thickness BGA package.
Thursday 18th October 2007
STMicroelectronics has introduced its new automotive-grade application processor with embedded GPS for navigation and telematics. The Cartesio processor perfectly couples with ST's GPS RF chip (STA5620), creating a unique offering that significantly reduces the form factor and bill-of-materials with no compromise in performance.
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Thursday 18th October 2007
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Thursday 18th October 2007
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Wednesday 17th October 2007
According to United Press International, U.S. scientists have found an easy-to-produce semiconductor material can bend light in the opposite direction from all naturally occurring materials.
Wednesday 17th October 2007
It has been reported that automotive, telecom and power sectors will drive the growth rate of the semiconductor industry in India, despite the decline in the global growth rate.
Wednesday 17th October 2007
Shares of Sanyo Electric Co. have fallen in Tokyo after the electronics maker abandoned negotiations with Advantage Partners LLP over the sale of its semiconductor-making business.
Wednesday 17th October 2007
Intel Capital, Intel's global investment organisation, has announced that it is the sole investor in a US$11 million round of funding into Jordan Valley Semiconductors Ltd.
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Wednesday 17th October 2007
EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, has announced the successful installation of its fourth IQ Aligner System for packaging applications at a major semiconductor manufacturing facility in Austria.
Wednesday 17th October 2007
IMEC has reached an agreement with ASML to install an ASML EUV pre-production tool in IMEC's 300mm facility in 2010.
Wednesday 17th October 2007
The Microsystems Packaging Research Center (PRC) at the Georgia Institute of Technology in Atlanta and IMEC have invited interested parties from global industry to join their advanced research program on next-generation flip-chip and substrate technology.
Tuesday 16th October 2007
Molecular Imprints, Inc. (MII) has announced that Toshiba Semiconductor Company, a global leader in the development and manufacturing of powerful semiconductor devices, has validated the use of MII's imprint lithography technology in developing 22-nm node CMOS devices.
Tuesday 16th October 2007
IMEC has announced two separate steps forward on research aimed at pushing chip technology to 32-nm and below.
Tuesday 16th October 2007
Hitachi Global Storage Technologies could soon offer users 4-terabyte desktop drives.
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Tuesday 16th October 2007
A team of researchers at IBM Corporation has reported that they have measured the distribution of electrical charges in tubes of carbon measuring smaller than 2-nm in diameter, which is 50,000 times thinner than a human hair.
Monday 15th October 2007
Researchers at SEMATECH and University College London (UCL) have identified a potential cause of a perplexing tendency of novel dielectric materials to capture electrons and holes, making the performance of advanced devices unstable.
Monday 15th October 2007
Atmel Corporation and Advanced Semiconductor Technology Ltd. (AST), has announced a collaboration, based on Atmel’s CAP ARM based customisable microcontroller that allows their mutual clients to develop systems-on-chip.
Monday 15th October 2007
Synova, a patent holder of water jet-guided laser technology, has announced that two major Chinese customers have placed orders for systems incorporating Synova's state-of-the-art Laser MicroJet(R) technology for semiconductor and micro-machining applications.
Monday 15th October 2007
Broadcom Corporation , have announced a new single-chip HSPA (high-speed packet access) processor that integrates all of the key 3G (third generation) cellular and mobile technologies on an extremely low power, single 65 nanometer CMOS die.
Monday 15th October 2007
Rim Semiconductor Company, has announced that it has entered into an agreement to evaluate the next generation Cupria IPSL solution in the service network of Canby Telcom of Canby, Oregon.

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