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Wednesday 20th June 2007
Integrated Dynamics Engineering, Inc., (IDE) has opened a new, full-service office focused on controls for electron beam microscopes in Tokyo, Japan.;;
Wednesday 20th June 2007
Integrated Dynamics Engineering, Inc., (IDE) has opened a new, full-service office focused on controls for electron beam microscopes in Tokyo, Japan.;;
Wednesday 20th June 2007
Arteris, Inc has announced that it has completed its Series B round of investment, raising $8.1 million to help fund future growth.
Wednesday 20th June 2007
Tegal Corporation has announced it has received an order for an Endeavor AT PVD cluster tool from a preeminent maker of commercial MEMS accelerometers and inertial sensors.
Tuesday 19th June 2007
The Fraunhofer-Gesellschaft intends to set up 40 new working groups over the next three years with a scheme named, ‘Fraunhofer Attract'.
Monday 18th June 2007
Atos Origin has signed a three-year agreement with NXP Semiconductors to migrate and manage their existing large file transfer infrastructure to Axway's Synchrony Transfer software.
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Monday 18th June 2007
Since the IC market meltdown of 2001, the IC industry has registered an excellent five-year compound annual growth rate (CAGR) of 12%.
Monday 18th June 2007
The TRUMPF Group, Ditzingen, and JENOPTIK, Jena, intend to expand their cooperation, dating back to 2001, and set up a joint venture. ;;
Monday 18th June 2007
The Western European energy market, beleaguered by increasing oil prices, threats of climatic change and greater dependence on fuel imports, has turned to co-generation for a long-term solution to all these issues.
Monday 18th June 2007
Aeroflex and the Beijing StarPoint Telecommunication Software Company have announced an agreement to jointly develop the first, full TD-SCDMA protocol conformance test system.
Saturday 16th June 2007
IMEC has announced the expansion of its 3D packaging research program to fully exploit the potential of novel 3D technologies.
Friday 15th June 2007
Renesas Technology Corp. has announced the development of an extremely high-performance transistor technology with low-cost fabrication capability for microprocessors and SoC (system-on-a-chip) devices of the 45-nm (nanometre) generation and beyond.
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Friday 15th June 2007
Samsung Electronics Co. has announced the opening of one of the largest 300mm NAND flash memory wafer plants in Austin, Texas.
Friday 15th June 2007
Camstar Systems, Inc has announced that Renesas Technology Corp. has selected Camstar's InSite for seven of its fabrication (fab) and wafer testing sites located in Japan and Singapore.
Friday 15th June 2007
AMI Semiconductor and MagnaChip Semiconductor have announced that MagnaChip will manufacture AMI Semiconductor's 0.35-micron SmartPower technology and continue existing joint development of ULP technology.
Friday 15th June 2007
Tegal Corporation has announced that it has received an order for a Tegal AMS SMT AlN PVD tool from the University of Pennsylvania.
Friday 15th June 2007
Rudolph Technologies, Inc. has announced the receipt of orders for six of its NSX 105 automated macro defect inspection tools from a leading manufacturer of disk drives.
Thursday 14th June 2007
Sharp declines in average selling prices (ASPs) for microchips in several key market segments – microprocessors, DRAMs, and NAND flash – will contribute to slower growth in worldwide sales of semiconductors in 2007, according to the Semiconductor Industry Association (SIA).
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Thursday 14th June 2007
Silterra Malaysia and IMEC have announced that they have signed an agreement for a joint development project (JDP) to create a foundry-compatible 90-nm CMOS process technology with intention to further scale to 65-nm.
Wednesday 13th June 2007
The image sensor market reached $6 billion in 2006, a jump of over 30% over 2005, with sales expected to grow another 14% in 2007, according to a new market report from Strategies Unlimited.
Wednesday 13th June 2007
Tegal Corporation has announced it has received a multi-tool order for plasma etch system upgrades from a leading global manufacturer of hard disk drives.
Wednesday 13th June 2007
Infineon researchers have unveiled details of a new transistor architecture in Japan that removes many of the barriers to the production of smaller, more powerful electronic devices and circuits.
Wednesday 13th June 2007
NexTech Solutions has announced it recently received product acceptance for their ORION Reticle Inspection System from one of the world's largest semiconductor manufacturers.
Wednesday 13th June 2007
STMicroelectronics has unveiled details of its 45nm(0.045-micron) CMOS design platform for next-generation System-on-Chip (SoC) product development for low-power, wireless and portable consumer applications.

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