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Thursday 25th October 2007
Semiconductor equipment sales will improve in the fourth quarter of 2007 and exhibit small but positive growth through 2008 and 2009, according to The Information Network..
Thursday 25th October 2007
It has been reported that a new study by researchers at Rensselaer Polytechnic Institute (St. Troy, N.Y.) has found that blocks of Carbon nanotubes (CNTs) can be used to create effective and powerful pressure sensors.
Thursday 25th October 2007
Analog Devices Incorporated, a global leader in high-performance semiconductors for signal processing applications, announced the opening of its second development facility in Bangalore.
Thursday 25th October 2007
Aquest Systems, a developer of innovative automation solutions for the global semiconductor industry, has announced that the United States Patent and Trademark Office (USPTO) has issued a broad patent to protect Aquest's FabEX automated material handling system (AMHS). While most patents take more than three years to receive, this patent only took 18 months due to a special accelerated examination granted by the USPTO.
Wednesday 24th October 2007
AMD has made a significant change to its original plans to migrate Fab 30 in Dresden, Germany to 300mm wafer production and rename the facility Fab 38.
Wednesday 24th October 2007
Spotfire, a division of TIBCO Software Incorporated, has announced that Dialog Semiconductor is the latest high tech company to select the TIBCO Spotfire enterprise analytics platform.
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Wednesday 24th October 2007
Japan's Elpida Memory Incorporated and Taiwan's United Microelectronics Corporation (UMC) have formed a joint development program for copper low-k and phase-change random access memories (PRAMs).
Wednesday 24th October 2007
Spansion Incorporated, a pure-play provider of Flash memory solutions, has announced that it has intensified its focus in the China market by partnering with Semiconductor Manufacturing International Corporation.
Wednesday 24th October 2007
Aixtron AG of Aachen, Germany has said that it has received an order for multiple MOCVD reactors from Epistar of Hsinchu, Taiwan, one of the largest manufacturers of ultra-high-brightness (UHB) LEDs.;
Tuesday 23rd October 2007
The European Nanoelectronics Initiative Advisory Council (ENIAC) has put increased energy-efficiency of electronic equipment on its agenda as one of their major research targets.
Tuesday 23rd October 2007
NanoDynamics Incorporated has announced the recent formation of a joint venture with Shell Technology Ventures Fund 1 B.V. to develop new materials and products expected to improve exploration and production efforts in the international oil and gas industry.
Tuesday 23rd October 2007
Applied Materials has expanded its solutions for TFT-LCD flat panel display (FPD) manufacturing, with the launch of its AKT-PiVot 55KV PVD system for depositing metal and TCO materials on Gen 8.5 (5.5m2) glass substrates.
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Tuesday 23rd October 2007
Samsung Electronics Company Ltd., has announced that it has developed the world‘s first 64 Gigabit (Gb) multi level cell (MLC) NAND flash memory chip, using 30-nanometer (nm) class process technology.
Tuesday 23rd October 2007
Vitex Systems, Incorporated, a leading technology developer, licensor and engineering service provider for thin-film encapsulation and moisture barrier films, has announced that its equipment licensee, Advanced Neotech Systems (ANS) of Korea, has secured a purchase order for its Guardian thin-film encapsulation system from a major Japanese customer.
Tuesday 23rd October 2007
STATS ChipPAC Limited, an independent semiconductor test and advanced packaging service provider, has announced the grand opening of a second 371,000 square ft manufacturing facility in Shanghai, China.
Tuesday 23rd October 2007
Fueled by strong revenue growth, French-based Tronics Microsystems have announced it is the first pure-play contract manufacturer of advanced MEMS devices to achieve consistent profitability.
Monday 22nd October 2007
MEMSCAP, a provider of innovative solutions based on micro-electromechanical systems (MEMS) technology, has announced it earnings for quarter three, 2007.
Monday 22nd October 2007
SanDisk Corporation, have outlined plans currently being worked out with its long-standing manufacturing partner Toshiba for the construction and ramp of a new 300mm facility, dubbed Fab 5, for NAND flash production.
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Monday 22nd October 2007
LDK Solar Co., Ltd. announced that it has signed a three-year contract to supply multicrystalline solar wafers to Canadian Solar Inc.
Friday 19th October 2007
The Bosch Group has celebrated the completion of its new headquarters and expansion of its Technical Centre in Yongin, Gyeonggi with government officials, customers, other business partners and associates.
Friday 19th October 2007
Foundry, Semiconductor Manufacturing International Corporation (SMIC) and Magma Design Automation Incorporated, a provider of semiconductor design software, have jointly announced the availability of an enhanced low-power IC implementation reference flow for SMIC's 90-nanometer (nm) process featuring Magma's Blast Power, Blast Fusion, and Blast Create.
Friday 19th October 2007
The pressure for shorter times to market is pushing electronic equipment manufacturers to look beyond their trusted supply chain for quick delivery of components which are difficult to source. This has led to the growth of component counterfeiting. A recent report estimated the losses to customers falling victims of counterfeiters exceeded US$15 billion per annum.  
Thursday 18th October 2007
It has been announced that Sony are to sell its advanced computer chip operations to Toshiba.
Thursday 18th October 2007
Robert Bosch GmbH has purchased an Omega fxP etch system from Aviza Technology, for deep silicon etch processes required in its MEMS device manufacturing.

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