It has been reported that amid some major changes taking place at the 45-nm node and beyond, Axcelis Technologies Inc. has decided to cease future product development in the rapid thermal processing (RTP) tool arena.
STMicroelectronics has introduced its new automotive-grade application processor with embedded GPS for navigation and telematics. The Cartesio processor perfectly couples with ST's GPS RF chip (STA5620), creating a unique offering that significantly reduces the form factor and bill-of-materials with no compromise in performance.
EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, has announced the successful installation of its fourth IQ Aligner System for packaging applications at a major semiconductor manufacturing facility in Austria.
The Microsystems Packaging Research Center (PRC) at the Georgia Institute of Technology in Atlanta and IMEC have invited interested parties from global industry to join their advanced research program on next-generation flip-chip and substrate technology.
Molecular Imprints, Inc. (MII) has announced that Toshiba Semiconductor Company, a global leader in the development and manufacturing of powerful semiconductor devices, has validated the use of MII's imprint lithography technology in developing 22-nm node CMOS devices.
A team of researchers at IBM Corporation has reported that they have measured the distribution of electrical charges in tubes of carbon measuring smaller than 2-nm in diameter, which is 50,000 times thinner than a human hair.
Researchers at SEMATECH and University College London (UCL) have identified a potential cause of a perplexing tendency of novel dielectric materials to capture electrons and holes, making the performance of advanced devices unstable.
Atmel Corporation and Advanced Semiconductor Technology Ltd. (AST), has announced a collaboration, based on Atmel’s CAP ARM based customisable microcontroller that allows their mutual clients to develop systems-on-chip.
Synova, a patent holder of water jet-guided laser technology, has announced that two major Chinese customers have placed orders for systems incorporating Synova's state-of-the-art Laser MicroJet(R) technology for semiconductor and micro-machining applications.
Broadcom Corporation , have announced a new single-chip HSPA (high-speed packet access) processor that integrates all of the key 3G (third generation) cellular and mobile technologies on an extremely low power, single 65 nanometer CMOS die.