ASML Holding has announced that it has shipped its first TWINSCAN XT:1900i lithography system which it claims is capable of imaging features down to 36.5 nanometres (nm) on chips manufactured in volume. Production of the XT:1900i is now ramping up fast, as multiple orders have been placed and systems will be shipped before the end of this year to many device makers worldwide.
Memsstar Technology has announced that it is to enter into a strategic alliance with SAFC Hitech to supply fully qualified memsstar SPDTM (Surface ;Preparation and Deposition) systems with standard precursor chemical materials from SAFC Hitech for Surface Coatings on micro devices. ;
Silterra Malaysia has reviewed its new growth plan following the recent announcement of its 90nm and 65nm technology development plan with IMEC. The expansion plan is staged in three phases to accelerate the Company to a high rate of growth for the next few years.
MEMSCAP has announced that it has accepted a Purchase Order for a total amount of US$ 8.500.000, to manufacture a consumer product. This purchase order complements an initial one delivered over the first 2007 quarter for an amount of 0.3 million US dollars. ; ;
To integrate new materials and processes in its gate structure to make chips faster and more power-efficient thus enabling Moore's Law to continue, Applied Materials, Inc. has unveiled new technologies to help achieve this by way of a new processes for building high-k/metal gate (HK/MG) structures in high volume production.
The SAFC Hitech business segment within SAFC, a member of the Sigma-Aldrich Group has announced details of its new five-year chemical roadmap for Metalorganic Chemical Vapor Deposition (MOCVD) and Atomic Layer Deposition (ALD) processes on silicon semiconductor substrates.
Metryx has announced that it has received orders from a major research consortium for its Mentor SF3 300 mm tool and Mentor OC23 200 mm tool. During the evaluation phase, the Mentor successfully identified previously undetected process trends, demonstrating the value mass metrology offers to the industry.
Eco-Snow Systems has formed a joint development program with Belgian nanoelectronics research centre IMEC to develop and study photoresist and particle removal processes using CO2-based cryogenic cleaning systems.
Advantest Corporation has announced that the Hsinchu District Court (Hsinchu City, Taiwan) granted a preliminary injunction against TechWing, Inc. following a petition filed by Advantest in February, 2006.
One year after shifting the objective of its lithography program to the 32nm half pitch node, IMEC reports progress on high-index 193nm immersion lithography, double-patterning schemes for 193nm water-based immersion lithography and extreme UV (EUV) lithography.
Total semiconductor shipments in Greater China—consisting of Mainland China, Hong Kong and Taiwan—totaled $66.3 billion in 2006, up 11.8 percent from $USD59.3 billion in 2005, according to iSuppli Corp.’s Greater China Competitive Landscaping Tool (CLT). ; As predicted last year, semiconductors shipped to China/Hong Kong increased to about $44.8 billion in 2006, up 15.8 percent from $38.6 billion in 2005.
memsstar Technology today announced that it is to enter into a strategic alliance with SAFC Hitech, a business segment within SAFC, a member of the Sigma-Aldrich Group, to supply fully qualified memsstar SPD (Surface Preparation and Deposition) systems with standard precursor chemical materials from SAFC Hitech for Surface Coatings on micro devices.
In the second quarter of 2007, the SEZ Group achieved preliminary net sales of 104.8 million Swiss Francs (CHF), slightly above expectations, and surpassed its sales target for the first six months with CHF 207.4 million.
Asyst Technologies, Inc. has announced that its next-generation Velocity HTC (High-Throughput Conveyor) automation system has been selected by a large Japanese memory manufacturer for installation at its newest fab.
Vistec Semiconductor Systems received multiple orders for its LDS3300 C macro inspection system from a leading logic manufacturer. The customer will use the systems in a 300 mm wafer fab for inspection and review of wafers in 65 nm production.