Asyst Technologies, Inc. announced that its 200mm products have been selected by multiple semiconductor fabs including EM Microelectronic of Switzerland, Shanghai Huahong NEC Electronics Co., (HHNEC) of China and additional semiconductor fabs in China and Russia.
Elite Semiconductor Memory Technology Inc., Taiwan (ESMT) and Cypress Semiconductor Corp. have announced a Technology Transfer Agreement under which ESMT will acquire Cypress's Pseudo Static Random Access Memory (PSRAM) product line.
Semiconductor Industry Association (SIA) President George Scalise has heralded a bipartisan agreement between the Administration and Members of Congress that will pave the way for progress on key trade opening agreements
IC Insights' May update to The McClean Report describes the big shakeup in the 1Q07 top 20 semiconductor supplier ranking. The first quarter inventory correction in the IC industry helped cause a great deal of movement up and down the list in 1Q07 as compared to the full-year 2006 rankings.
Brewer Science has joined the EMC-3D international consortium of equipment providers, materials companies and researchers to address complex integration of Thru-Silicon-Via (TSV) 3D chip interconnects.
According to a report by Strategy Analytics, the annual five year outlook for the Gallium Arsenide microelectronics industry, "GaAs Industry Forecast: 2006-2011," foretells that this market will enjoy a CAAGR of 12 percent, growing from $3 billion in 2006 to over $5 billion by 2011.
IBM has announced, what they claim to be as the first-ever application of a breakthrough self-assembling nanotechnology to conventional chip manufacturing, borrowing a process from nature to build the next generation computer chips.
Preliminary results indicate that the NOR-type flash memory market experienced a disappointing first quarter, with sales declining by a larger margin than can be attributed to the normal seasonal slowdown, according to iSuppli Corp.
HP has announced that it is beginning to reap returns from its 10-year investment in nanoscale electronics with the licensing of technology that could enable the fabrication of semiconductor chips significantly more powerful than those available today.
Semiconductor metrology equipment manufacturer Jordan Valley Semiconductors has announced they have sold, installed and qualified multiple units of their JVX 6200 system to leading memory manufacturers for wafer-level packaging applications.
ST Microelectronics has placed an order for an NIL R&D system to be used in their FTM / Advanced R&D – Post Silicon Technology (PST) unit for development purposes. Obducat has also produced stampers that are being used in this assessment project.