Metryx has announced that it has received orders from a major research consortium for its Mentor SF3 300 mm tool and Mentor OC23 200 mm tool. During the evaluation phase, the Mentor successfully identified previously undetected process trends, demonstrating the value mass metrology offers to the industry.
Eco-Snow Systems has formed a joint development program with Belgian nanoelectronics research centre IMEC to develop and study photoresist and particle removal processes using CO2-based cryogenic cleaning systems.
Advantest Corporation has announced that the Hsinchu District Court (Hsinchu City, Taiwan) granted a preliminary injunction against TechWing, Inc. following a petition filed by Advantest in February, 2006.
One year after shifting the objective of its lithography program to the 32nm half pitch node, IMEC reports progress on high-index 193nm immersion lithography, double-patterning schemes for 193nm water-based immersion lithography and extreme UV (EUV) lithography.
Total semiconductor shipments in Greater China—consisting of Mainland China, Hong Kong and Taiwan—totaled $66.3 billion in 2006, up 11.8 percent from $USD59.3 billion in 2005, according to iSuppli Corp.’s Greater China Competitive Landscaping Tool (CLT). ; As predicted last year, semiconductors shipped to China/Hong Kong increased to about $44.8 billion in 2006, up 15.8 percent from $38.6 billion in 2005.
memsstar Technology today announced that it is to enter into a strategic alliance with SAFC Hitech, a business segment within SAFC, a member of the Sigma-Aldrich Group, to supply fully qualified memsstar SPD (Surface Preparation and Deposition) systems with standard precursor chemical materials from SAFC Hitech for Surface Coatings on micro devices.
In the second quarter of 2007, the SEZ Group achieved preliminary net sales of 104.8 million Swiss Francs (CHF), slightly above expectations, and surpassed its sales target for the first six months with CHF 207.4 million.
Asyst Technologies, Inc. has announced that its next-generation Velocity HTC (High-Throughput Conveyor) automation system has been selected by a large Japanese memory manufacturer for installation at its newest fab.
Vistec Semiconductor Systems received multiple orders for its LDS3300 C macro inspection system from a leading logic manufacturer. The customer will use the systems in a 300 mm wafer fab for inspection and review of wafers in 65 nm production.
InterCrossIP Management LLC has signed exclusive, global license agreements with Uk based Ceimig and Simon Fraser University (SFU) in Canada for the commercialisation of a thin film deposition technology platform based on organometallic precursors.
A severe shortage of polysilicon used for solar cell production led to a stampede of startups trying to enter the market using thin film technology, according to the report ‘Opportunities in The Solar Cell Market For Thin Film Technology', recently published by The Information Network.
Tevet Process Control Technologies has announced that recent and fundamental changes in the semiconductor Chemical Vapour Deposition (CVD) market segment have abruptly created the demand for high speed, every-wafer integrated metrology.
More Moore, an integrated research project funded by the European Commission to promote the development of Extreme Ultra Violet Lithography (EUVL) in Europe, has solved some of the key challenges in the pioneering work of this future semiconductor manufacturing technology.
STMicroelectronics (ST) has announced the decision to deconsolidate its Flash memory business. In this move to further optimise asset utilisation and enhance performance ST will rationalise three of its manufacturing operations.