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Friday 15th June 2007
Samsung Electronics Co. has announced the opening of one of the largest 300mm NAND flash memory wafer plants in Austin, Texas.
Friday 15th June 2007
Camstar Systems, Inc has announced that Renesas Technology Corp. has selected Camstar's InSite for seven of its fabrication (fab) and wafer testing sites located in Japan and Singapore.
Friday 15th June 2007
AMI Semiconductor and MagnaChip Semiconductor have announced that MagnaChip will manufacture AMI Semiconductor's 0.35-micron SmartPower technology and continue existing joint development of ULP technology.
Friday 15th June 2007
Tegal Corporation has announced that it has received an order for a Tegal AMS SMT AlN PVD tool from the University of Pennsylvania.
Friday 15th June 2007
Rudolph Technologies, Inc. has announced the receipt of orders for six of its NSX 105 automated macro defect inspection tools from a leading manufacturer of disk drives.
Thursday 14th June 2007
Sharp declines in average selling prices (ASPs) for microchips in several key market segments – microprocessors, DRAMs, and NAND flash – will contribute to slower growth in worldwide sales of semiconductors in 2007, according to the Semiconductor Industry Association (SIA).
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Thursday 14th June 2007
Silterra Malaysia and IMEC have announced that they have signed an agreement for a joint development project (JDP) to create a foundry-compatible 90-nm CMOS process technology with intention to further scale to 65-nm.
Wednesday 13th June 2007
The image sensor market reached $6 billion in 2006, a jump of over 30% over 2005, with sales expected to grow another 14% in 2007, according to a new market report from Strategies Unlimited.
Wednesday 13th June 2007
Tegal Corporation has announced it has received a multi-tool order for plasma etch system upgrades from a leading global manufacturer of hard disk drives.
Wednesday 13th June 2007
Infineon researchers have unveiled details of a new transistor architecture in Japan that removes many of the barriers to the production of smaller, more powerful electronic devices and circuits.
Wednesday 13th June 2007
NexTech Solutions has announced it recently received product acceptance for their ORION Reticle Inspection System from one of the world's largest semiconductor manufacturers.
Wednesday 13th June 2007
STMicroelectronics has unveiled details of its 45nm(0.045-micron) CMOS design platform for next-generation System-on-Chip (SoC) product development for low-power, wireless and portable consumer applications.
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Tuesday 12th June 2007
Electronic component orders took a small dip in May, according to the four-to-five week average index compiled by the Electronic Components, Assemblies & Materials Association (ECA).
Monday 11th June 2007
Tronics Microsystems and Alcatel Micro Machining Systems have announced a joint development project (JDP) on DRIE for extreme-performance MEMS.
Monday 11th June 2007
In a move that will greatly broaden global access to its water jet-guided laser technology, Synova has revealed it has entered into a partnership with Disco Hi-Tec Europe. ;;
Monday 11th June 2007
Mentor Graphics Corporation has announced it has acquired Sierra Design Automation.
Friday 8th June 2007
Nanometrics Incorporated has announced that the company has completed the divestiture of its DiVA and Yosemite product lines.
Friday 8th June 2007
Signet Solar has announced plans to establish significant thin-film solar module manufacturing capabilities in India.
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Friday 8th June 2007
Tegal Corporation has announced it had received an order for an Endeavor AT PVD cluster tool from a top-tier MEMS foundry located in Europe.
Thursday 7th June 2007
After posting two consecutive years of strong growth, the semiconductor photomask market slowed in 2006, according to the report: Mask Making, Inspection, and Repair: Market Analysis and Strategic Issues, recently published by The Information Network.
Thursday 7th June 2007
Advanced Photonix, Inc has announced the completion of the company's new multi-million dollar, 5,000 square foot microfabrication facility for R&D and manufacturing of optoelectronic semiconductors.
Thursday 7th June 2007
Williams Advanced Materials (WAM) has announced expansion of its operations into Europe with the opening of a new precision cleaning and reconditioning services facility in the Czech Republic.
Thursday 7th June 2007
Tensilica, Inc., has announced that two Korean universities have licensed its Xtensa configurable processor.
Thursday 7th June 2007
UMC and ARM announced that a test chip built with ARM SOI (Silicon On Insulator) libraries was taped-out successfully on UMC's 65-nanometer (nm) SOI process.

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