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Tuesday 28th September 2004
Dow Corning Corporation has signed a joint development contract with Scotland's Invint, a company specialising in conductive polymer interconnect technology.
Tuesday 28th September 2004
Meeting on 24 September, the EU Competitiveness Council adopted conclusions calling for continuity between the Sixth and Seventh Framework Programmes, but with initiatives to simplify procedures.
Monday 27th September 2004
A new disk technology is under development that could store up to 1TeraBytes (1000GBytes). Researchers at Imperial College London, working closely with colleagues at the University of Neuchatel, Switzerland, and the Aristotle University of Thessaloniki, Greece, estimate that the "Multiplexed Optical Data Storage" (MODS) disks would cost approximately the same to manufacture as an ordinary DVD.
Monday 27th September 2004
Infineon Technologies and Volkswagen have jointly developed a "Basic Telematics Unit" platform for wireless telecoms and location-based information services in motor vehicles. The co-operation aimed to build a platform for the price of an existing in-car telephone unit bringing advanced information services out of the luxury car and into the mass market. Volkswagen and Infineon intend marketing the platform as a manufacturer-independent solution. Differentiation will be provided by application software, the functions offered and the user interface.
Friday 24th September 2004
German high power semiconductor producer eupec has issued its first complete product family complying with the European Union guidelines on Restriction of the Use of Certain Hazardous Substances (RoHS, 2002/95/EG) and Waste Electrical and Electronic Equipment (WEEE, 2002/96/EG).
Friday 24th September 2004
Infineon Technologies has reached an agreement with the Antitrust division of the US Department of Justice (DoJ).
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Friday 24th September 2004
Hynix Semiconductor has been fined KRW2bn for accounting fraud. The company's former chief executive, Park Chong-Sup has been reported to prosecutors for further investigation.
Friday 24th September 2004
STMicroelectronics has announced that its Kirkop back-end semiconductor manufacturing facility in Malta has taken the initiative to use only biodiesel fuel for the diesel-powered vehicles in its transport fleet and for its boiler systems.
Friday 24th September 2004
Infineon has announced the formal opening of a new memory chip packaging facility in China.
Friday 24th September 2004
AMD today announced plans for the formation of a Greater China headquarters in Beijing.
Friday 24th September 2004
Photronics and SIGMA-C plan to combine their respective technologies to strengthen Photronics' Integrated Lithography Plane (ILP) initiative.
Friday 24th September 2004
Isonics reports on-schedule completion of the consolidation of its wafer manufacturing operations into its new Fab 2 facility, in Vancouver, Washington state.
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Friday 24th September 2004
Hynix plans to double its expenditure to KRW1.80tr ($1.57bn) to enable facility upgrades.
Friday 24th September 2004
VLSI Research saw the world semiconductor equipment book-to-bill ratio fall below 1.00 for the first time in a year.
Friday 24th September 2004
Philips Electronics has announced that effective January 1, 2005, Scott McGregor will, at his own request, relinquish his position as CEO of the Semiconductors division and leave the company to return to the USA.
Friday 24th September 2004
Ricoh will use UMC's L90 Standard Performance (SP) process device option with low-k dielectrics for next generation ASIC and image processor product lines.
Friday 24th September 2004
MKS Instruments announced that sales for its Q3 ending September 30, 2004, are expected to be below previous guidance for flat sequential growth due to lower than anticipated orders from the semiconductor capital equipment market along with some stretched out delivery requests and order push outs.
Friday 24th September 2004
Samsung Electronics claims the industry's first 60nm 8Gbit NAND Flash memory device data storage for low-density mobile hard disks in mobile appliances.
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Friday 24th September 2004
Agere Systems says that its engineers have found the right mix of packaging ingredients to enable the semiconductor industry to successfully implement lead-free packaging.
Friday 24th September 2004
The Fraunhofer Institute for Silicon Technology (ISIT), Siemens and Infineon announced proposed development of electronic biochip technology along with their nomination for the German Federal President's Deutscher Zukunftspreis technology and innovation award for work already carried out.
Friday 24th September 2004
UK company Applied Microengineering (AML) gave details of its planned use for its recent UK government Department of Trade and Industry (DTI) grant of GBP678,000 to the LOBEL project that will develop a new nano device production tool for micro polymer embossing and nano-imprint lithography (NIL) and surface activation for low-temperature wafer bonding (Bulletin 551, September 15, 2004).
Friday 24th September 2004
Samsung Electronics has developed a 2Mpixel CMOS image sensor (CIS) chip, claiming an industry first with the use of 0.13micron process technology.
Friday 24th September 2004
Infineon Technologies has licensed Axon Technologies' Programmable Metallization Cell (PMC) non-volatile memory technology.
Thursday 23rd September 2004
Novellus Systems Inc. has announced that its board of directors has approved an increase to Novellus' previously authorized stock repurchase program. The terms of the expanded program will permit Novellus to repurchase up to an aggregate of approximately $1.1 billion of its outstanding common stock through September 14, 2009. This represents an increase of $1 billion to the approximately $100 million remaining under the previously authorized program.

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