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Thursday 29th July 2004
Fab construction company M+W Zander has received a EUR20.75mn follow-up order for expanding Siltronic's Freiberg Fab 300-2 crystal growing and wafer production facility. Siltronic will be able expand its production from 75,000 to 150,000 wafers a month. Installation of process equipment will start as early as November 2004. Hook-up installation is planned by March 2006.
Wednesday 28th July 2004
Renesas Technology is to use Robert Bosch's FlexRay communication controller intellectual property (IP) in a microcontroller for automotive communication applications. The first device to be developed will be based on the high-performance M32C family core. Renesas also plans to use FlexRay in its SuperH (SH-2) and M32R families to target power train and adaptive cruise control (ACC) applications.
Wednesday 28th July 2004
The US National Aeronautics and Space Administration (NASA) has selected Philips Electronics advanced MIFARE DESFire contactless chip technology to enable secure smart card access to its facilities. The smart cards will be deployed to agency employees and contractors for immediate identity authentication. Philips says that its MIFARE DESFire V0.6 is the first chip solution currently compliant with the US Government Smart Card Interoperability Specification (GSC-IS).
Wednesday 28th July 2004
EV Group (EVG) has shipped an EVG850 production bonder to a new US customer, Umicore Semiconductor Processing (USP) in Massachusetts. The EVG850 features EV Group's low-temperature, plasma-bonding technology.
Monday 26th July 2004
UK etch tool company Surface Technology Systems (STS) has received an order to supply TSMC with a cassette to cassette high-rate ASEHRM plasma etch system.
Monday 26th July 2004
An initial public offering of 121,621,622 shares is being made in Motorola's Freescale Semiconductor subsidiary.
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Monday 26th July 2004
Austriamicrosystems says that it is the first to adopt the Fabless Semiconductor Association (FSA) mixed-signal/RF Process Design Kit (PDK) guidelines for its foundry customers.
Monday 26th July 2004
Amkor Technology has signed definitive agreements to acquire Unitive, based in North Carolina, and to obtain a majority interest of 60% in Taiwan-based Unitive Semiconductor Taiwan Corporation (UST), a joint venture between Unitive and various Taiwanese investors.
Monday 26th July 2004
Lam Research says that it will cease investment in CMP systems development.
Monday 26th July 2004
Under the heading "Response from IBM", Science magazine (July 16, 2004) has published a letter criticising an earlier article on the company's fab cancer litigation ("Beset by lawsuits, IBM blocks a study that used its data", May 14, 2004).
Monday 26th July 2004
UK IC producer Zetex Semiconductors has bought Escend Technologies' design-win management enterprise software for semiconductor and electronic component manufacturers.
Monday 26th July 2004
Semico Research forecasts that IC revenues will grow 33.8% to $222.6bn this year.
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Monday 26th July 2004
Tegal has been granted two US patents for nano layer deposition (NLD) of conformal thin films for barrier, copper seed and high-k dielectric applications (Nos. 6,689,220 and 6,756,318).
Monday 26th July 2004
STMicroelectronics reports Q2 2004 net revenues at $2.172bn, a 27.6% increase on Q2 2003's $1.702bn.
Monday 26th July 2004
Nitronex is offering GaN-on-silicon epitaxial wafers produced on its SIGANTIC process.
Monday 26th July 2004
A weapons fire control system (FCS) being developed by Norwegian company Vinghog is to use eMagin's SVGA+ active matrix organic light emitting diode (OLED)-on-silicon microdisplay.
Monday 26th July 2004
Researchers at the University of Erlangen in Germany hope to open "a broad vista of possible semiconductor applications for diamond" using a new doping method (Nature, July 22, 2004).
Thursday 22nd July 2004
Researchers at the University of Erlangen in Germany hope to open “a broad vista of possible semiconductor applications for diamond” using a new doping method (Nature, July 22, 2004). Rather than introduce chemical impurities, the scientists evaporate C60 molecules (“Bucky balls”) onto a hydrogen-terminated diamond surface, inducing a subsurface hole accumulation and a significant rise in two-dimensional conductivity.
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Thursday 22nd July 2004
Tegal has been granted two US patents for nano layer deposition (NLD) of conformal thin films for barrier, copper seed and high-k dielectric applications (Nos. 6,689,220 and 6,756,318). Applications are seen in advanced microprocessor and memory device production.
Thursday 22nd July 2004
UK IC producer Zetex Semiconductors has bought Escend Technologies' design-win management enterprise software for semiconductor and electronic component manufacturers. Zetex supplies analogue semiconductors for signal processing and power management. The software is designed to help achieve growing revenues, improved global tracking of business opportunities and customer support during the design-in cycle.
Thursday 22nd July 2004
UK etch tool company Surface Technology Systems (STS) has received an order to supply TSMC with a cassette to cassette high-rate ASEHRM plasma etch system. The system will be installed into an existing 150mm line at TSMC Fab 2 in Hsinchu, Taiwan. STS sees the sale as being an early indication that TSMC is looking to micro-electromechanical system (MEMS) production as a likely future market sector.
Monday 19th July 2004
Under the heading "Response from IBM", Science magazine (July 16, 2004) has published a letter criticising an earlier article on the company's fab cancer litigation ("Beset by lawsuits, IBM blocks a study that used its data", May 14, 2004). The letter comes from Scott R Brooks of IBM's Systems and Technology group.
Thursday 15th July 2004
Atmel has extended its Dresden design centre in Germany by adding 32 new highly skilled engineers to the 12 designers who have been part of the Atmel team for the last three years. Atmel has also increased the size of its location and is building up a new laboratory.
Thursday 15th July 2004
The European Commission has agreed further state aid in favour of Infineon's chip production site in Vila do Conde (Grande Porto), Portugal.

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