Business software developer SAP and chipmaker Infineon Technologies have jointly produced a radio frequency identification (RFID) platform to connect and manage RFID hardware and software from multiple vendors. The platform is based on SAP’s NetWeaver and Infineon's RFID You-R OPEN (OPerating ENvironment) device integration platforms.
A number of STMicroelectronics senior executives have decided to retire at the same time as its president and CEO, Pasquale Pistorio. As previously announced, Pistorio will leave his current position at ST after the company's annual general meeting in 2005. The semiconductor manufacturer has also announced product-group, front-end manufacturing and technology-related R&D organisational changes "to increase market focus".
ASML Holding (ASML) announced that it has seen its order backlog for lithography systems increase during Q3 2004 in units and value. The company also says that Q3 2004 will result in a higher mix of 200mm systems than anticipated. New unit shipments and revenues for Q3 2004 will remain at similar levels to those of Q2 2004, according to ASML.
Nikon, ASML and Carl Zeiss SMT have agreed to a comprehensive settlement of legal proceedings and a cross-license of patents related to lithography equipment. A memorandum of understanding continues the previously announced stays on all patent disputes pending between Nikon, ASML and SMT in Asia and the USA.
A new IMEC programme will investigate the use of semiconducting wires, carbon nanotubes and spintronics in efforts to find alternatives to the current use of scaling to reduce device dimensions. Also under study will be the metrology and theoretical approaches needed as a backbone for implementation of the new nanotechnologies. The programme will also investigate disruptive technologies or new paradigms for semiconductor manufacturing processes.
Wacker's Polysilicon division is to expand polysilicon production at its Burghausen site in Germany. Capacity will be ramped up in two stages - from 2006, annual production will rise by 500 metric tons and by another 1000 metric tons from 2007. After the expansion is complete, up to 6500 metric tons of polysilicon will be produced annually at Burghausen.
STMicroelectronics has introduced a new generation of its proprietary Vertical Intelligent Power (VIPower) family of technologies. Called M0-5, the new technology uses a patented control strategy that allows reduced chip and package sizes by an average of 40% while delivering the same power level as currently available devices, and at the same time increasing robustness. In addition to the novel control strategy, standby currents are pushed down from 12microA per chip to only 2microA per chip. ST sees the new technology as being particularly suitable for automotive applications.
The Ruhr-University of Bochum, Germany, has bought a development reactor containing the key components of AIXTRON's atomic vapour deposition (AVD) technology. The system will be used for research on new precursors for and physical properties of high-k dielectrics and advanced electrode thin films.
M+W Zander has been given the general contract for the construction of the new Infineon Technologies Memory Development Centre in Dresden, Germany. M+W Zander will be responsible for the design and construction. The sales volume of the order for M+W Zander will be EUR74mn. The clean room area is 2300m2. Construction commenced in the middle of 2004. The building should be weather-tight by the end of this year (December 2004).
Agere Systems announced plans to align its cost structure with current revenue expectations by reducing its workforce by 500 people across the business, including administrative functions, sales, marketing and product development.
German high power semiconductor producer eupec has issued its first complete product family complying with the European Union guidelines on Restriction of the Use of Certain Hazardous Substances (RoHS, 2002/95/EG) and Waste Electrical and Electronic Equipment (WEEE, 2002/96/EG).