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Monday 16th August 2004
Applied Materials and ASM have entered into a settlement agreement, dismissing litigation between the companies involving mutual allegations of patent infringement.
Monday 16th August 2004
The Information Network sees the copper interconnect processing market increasing 63% to $1.5bn this year.
Monday 16th August 2004
Siltronic cut its Q2 2004 losses before interest and tax to EUR9.9mn from Q2 2003's EUR14.4mn (adjusted for discontinued polysilicon business).
Friday 13th August 2004
Only Greece has so far passed national legislation giving effect to two electronic waste directives of the European Union (EU). This is despite the schedule that all EU member states were due to have legislated by Friday August 13, 2004.
Friday 13th August 2004
Dow Corning says that it is ready for two new European Union environmental laws affecting the global electronics industry. The announcement comes despite the fact that the majority of EU member states failed to meet the deadline (Friday July 13, 2004) for enacting the EU Waste Electrical and Electronic Equipment (WEEE) and the Restriction of Use of Certain Hazardous Substances (RoHS) directives. These cover electronic equipment waste and ban the use of lead, mercury, cadmium and other hazardous materials in electronics manufacturing.
Friday 13th August 2004
Too many UK universities are failing to capitalise on the rewards to be gained from creating entrepreneurial spin-out companies, according to Nottingham University Business School research. While universities are increasingly keen to create spin-out companies, far too few of these become successful businesses.
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Thursday 12th August 2004
STMicroelectronics has developed dual-interface (contact and contactless) secure ICs for biometric records and personal information with possible application to ePassports under the International Civil Aviation Organisation (ICAO) programme.
Thursday 12th August 2004
The WWiSE high-speed wireless networking consortium intends to submit a complete joint proposal to IEEE 802.11 Task Group N (TGn). The aim is to develop a next-generation Wi-Fi standard capable of sustaining data throughput in excess of 100Mbits/sec (Mbps). WWiSE is based on Multiple Input, Multiple Output Orthogonal Frequency Division Multiplexing (MIMO-OFDM). Companies within the WWiSE consortium that contributed to the proposal are Airgo Networks, Bermai, Broadcom, Conexant Systems, STMicroelectronics and Texas Instruments.
Wednesday 11th August 2004
Silicon Genesis (SiGen) has successfully developed wafer-level uniaxial strained substrates.
Wednesday 11th August 2004
France's CEA Leti (Laboratory of electronics and information technologies) has signed a joint development research programme (JDP) for new front end of line (FEOL) CMOS gate stack process technology with Tokyo Electron (TEL).
Wednesday 11th August 2004
Cypress Semiconductor has closed its $100mn acquisition of FillFactory, a Belgium-based spin-off from the European IMEC research centre (Bulletin 538, June 23, 2004).
Wednesday 11th August 2004
Infineon Technologies is to transfer its 0.09micron DRAM trench technology and 300mm production expertise to Winbond Electronics in Taiwan, expanding on existing DRAM co-operation between the companies.
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Wednesday 11th August 2004
Cree plans to expand its manufacturing and R&D operations in North Carolina with initial expansion activity beginning in the autumn of 2004.
Wednesday 11th August 2004
ZiLOG has entered into an agreement to sell all the wafer manufacturing equipment and related assets used at its Mod II facility in Idaho to STMicroelectronics for $6,000,000.
Wednesday 11th August 2004
The Information Network is sticking with a 2004 semiconductor sales forecast of $211.7bn - a 27% increase - but warns of a "growing disconnect between the semiconductor and the semiconductor equipment market".
Wednesday 11th August 2004
BOC's semiconductor industry division, BOC Edwards (BOCE), increased its Q3 2004 turnover (GBP215.0mn) by 33% over Q3 2003.
Wednesday 11th August 2004
Intel says that it has reach two significant milestones in the development of extreme-ultraviolet (EUV) lithography (13.5nm).
Wednesday 11th August 2004
Seiko Epson and NGK Insulators have jointly developed what is claimed as the smallest gyro-sensor of its kind in the world based on quartz crystal technology.
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Wednesday 11th August 2004
Sharp has developed two solar powered lighting systems - an illuminating solar panel and a solar street light.
Wednesday 11th August 2004
ASML Holding's supervisory board intends to appoint Eric Meurice as president and CEO of the company, effective October 1, 2004, subject to notification of a shareholder general meeting to be scheduled on August 26, 2004.
Wednesday 11th August 2004
Rudolph Technologies and August Technology have fully settled commercial litigation between the companies filed on September 23, 2003.
Tuesday 10th August 2004
France's CEA Leti (Laboratory of electronics and information technologies) has signed a joint development research programme (JDP) for new front end of line (FEOL) CMOS gate stack process technology with Tokyo Electron (TEL).
Tuesday 10th August 2004
Silicon Genesis (SiGen) has successfully developed wafer-level uniaxial strained substrates. Until now, only local transistor-level uniaxial strain has been available. The company has called the wafer-level technique "Next-Generation Strain" (NGS).
Monday 9th August 2004
Infineon Technologies is to transfer its 0.09micron DRAM trench technology and 300mm production expertise to Winbond Electronics in Taiwan, expanding on existing DRAM co-operation between the companies.

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