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Thursday 15th July 2004
Dainippon Screen's semiconductor equipment operation has received a license for patent rights from Philips Electronics concerning Marangoni wafer drying technology. The technique is to be used in the drying units to be installed on DNS batch cleaning systems.
Thursday 15th July 2004
The European Commission has agreed further state aid in favour of Infineon's chip production site in Vila do Conde (Grande Porto), Portugal.
Thursday 15th July 2004
Atmel has extended its Dresden design centre in Germany by adding 32 new highly skilled engineers to the 12 designers who have been part of the Atmel team for the last three years.
Thursday 15th July 2004
Chartered Semiconductor Manufacturing has formed a collaborative network with four incubation and services centres in China to nurture the growth of local IC design start-ups.
Thursday 15th July 2004
Tokyo Electron (TEL), has selected Rudolph Technologies as a supplier for next- generation integrated macrodefect inspection solutions.
Thursday 15th July 2004
UK IC producer Zetex Semiconductors has achieved corporate registration as an ISO/TS16949:2002 certified company.
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Thursday 15th July 2004
The Meryll Lynch investment bank has cut its forecast for semiconductor revenue growth in 2005 from 16% to 6%.
Thursday 15th July 2004
Philips reports its Q2 2004 semiconductor sales at EUR1.418bn, a nominal 27% (comparable 28%) increase on Q2 2003.
Thursday 15th July 2004
STMicroelectronics has completed its 'Small Page' NAND Flash memory roadmap with the introduction of 256Mbit and 128Mbit devices built on an advanced 120nm technology.
Thursday 15th July 2004
Dainippon Screen's semiconductor equipment operation has received a license for patent rights from Philips Electronics concerning Marangoni wafer drying technology.
Wednesday 14th July 2004
BOC Edwards has completed installation of FabWorks32, a fabwide vacuum and exhaust management monitoring system, at the new 300mm Infineon chip manufacturing facility in Dresden, Germany. The network can be viewed across the Infineon LAN, allowing LAN users to view the system by accessing the internet browser on a PC. The state of some 1500 pumps can be viewed on the system.
Wednesday 14th July 2004
BOC Edwards has established a joint development programme with the IMEC European research centre in Belgium. The programme focuses on the application of supercritical CO2 (scCO2) cleaning processes for the manufacture of next-generation semiconductor devices.
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Wednesday 14th July 2004
European companies Soitec and ASM International claim a major breakthrough in their joint development effort to combine the speed/performance benefits of strained silicon with the power/performance benefits of silicon-on-insulator (SOI) technology with "wafer level" strain.
Wednesday 14th July 2004
Tower Semiconductor expects to ramp production of 0.13micron technology node in Fab 2, Israel, early next year.
Wednesday 14th July 2004
Texas Instruments (TI) and Japan's NTT DoCoMo have made a joint agreement to develop a multi-mode UMTS (W-CDMA/GSM/GPRS) chipset to serve the Japanese, US and global 3G handset market.
Wednesday 14th July 2004
Semitool believes that it has won a key ruling in a patent infringement lawsuit filed against Novellus Systems in June 2001.
Wednesday 14th July 2004
SEMI's semiconductor manufacturer consensus expectation is for 63% growth to revenues this year.
Wednesday 14th July 2004
BOC Edwards has completed installation of FabWorks32, a fabwide vacuum and exhaust management monitoring system, at the new 300mm Infineon chip manufacturing facility in Dresden, Germany.
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Wednesday 14th July 2004
IMEC has launched an industrial affiliation programme (IIAP) on embedded RAM concepts for second and higher levels of on-chip cache memory.
Wednesday 14th July 2004
IMEC has developed a miniature 1cm3 3-dimensional stacked system-in-a-cube (SiC) for wireless bioelectronic communications systems.
Wednesday 14th July 2004
Mitsubishi Electric has developed a 2Mpixel CCD camera module which is a mere 7.42mm thick, making it the industry's thinnest - at least on May 30, 2004.
Tuesday 13th July 2004
European companies Soitec and ASM International claim a major breakthrough in their joint development effort to combine the speed/performance benefits of strained silicon with the power/performance benefits of silicon-on-insulator (SOI) technology with “wafer-level” strain.
Monday 12th July 2004
Knights TechnologyÕs YieldManager software is to be installed into the next generation of AMDÕs Automated Precision Manufacturing technology suite, APM version 3.0. The process control system will be used at AMDÕs 300mm Fab 36 in Dresden, Germany.
Monday 12th July 2004
AIXTRON is to take part in a project targeting the improvement of LED technology for solid state lighting. The three-year project will be conducted by the Laboratory of Semiconductor Optics, Stepanov Institute of Physics of the National Academy of Sciences of Belarus and is funded by the International Science & Technology Center in Russia (ISTC).

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