Dainippon Screen's semiconductor equipment operation has received a license for patent rights from Philips Electronics concerning Marangoni wafer drying technology. The technique is to be used in the drying units to be installed on DNS batch cleaning systems.
BOC Edwards has completed installation of FabWorks32, a fabwide vacuum and exhaust management monitoring system, at the new 300mm Infineon chip manufacturing facility in Dresden, Germany. The network can be viewed across the Infineon LAN, allowing LAN users to view the system by accessing the internet browser on a PC. The state of some 1500 pumps can be viewed on the system.
BOC Edwards has established a joint development programme with the IMEC European research centre in Belgium. The programme focuses on the application of supercritical CO2 (scCO2) cleaning processes for the manufacture of next-generation semiconductor devices.
European companies Soitec and ASM International claim a major breakthrough in their joint development effort to combine the speed/performance benefits of strained silicon with the power/performance benefits of silicon-on-insulator (SOI) technology with "wafer level" strain.
European companies Soitec and ASM International claim a major breakthrough in their joint development effort to combine the speed/performance benefits of strained silicon with the power/performance benefits of silicon-on-insulator (SOI) technology with “wafer-level” strain.
Knights TechnologyÕs YieldManager software is to be installed into the next generation of AMDÕs Automated Precision Manufacturing technology suite, APM version 3.0. The process control system will be used at AMDÕs 300mm Fab 36 in Dresden, Germany.
AIXTRON is to take part in a project targeting the improvement of LED technology for solid state lighting. The three-year project will be conducted by the Laboratory of Semiconductor Optics, Stepanov Institute of Physics of the National Academy of Sciences of Belarus and is funded by the International Science & Technology Center in Russia (ISTC).