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Thursday 31st August 2017
Thursday 31st August 2017
Cross-section of an experimental chip. In this greatly enlarged cross-section of an experimental chip, the bands of black and white reveal alternating layers of hafnium diselenide – an ultrathin semiconductor material – and the hafnium dioxide insulator. The cross-section matches an overlaid color schematic on the right. (Image credit: Michal Mleczko)
Wednesday 30th August 2017
NREL scientists suggest that application of UV illumination could improve the optical properties of semiconductor layers
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Wednesday 30th August 2017
Improvements to tiny body-on-a-chip devices could lead to next-generation pre-clinical testing of drug toxicity
Monday 28th August 2017
UC San Diego team grow crack-free 19-micron-thick layers of GaN on silicon
Thursday 24th August 2017
Chip makers appreciate what most consumers never knew: silicon’s virtues include the fact that it “rusts” in a way that insulates its tiny circuitry. Two new ultrathin materials share that trait and outdo silicon in other ways that make them promising materials for electronics of the future. By Andrew Myers
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Tuesday 22nd August 2017
First-of-its-kind SiC power modules for 3.3kV and 10kV applications developed with assistance from PowerAmerica
Monday 14th August 2017
Company to use R&D capacities to strengthen relationship in the development of micro-LED, silicon photonics, and other semiconductor optoelectronic components
Monday 14th August 2017
Latest research on HfSe2 and ZrSe2 suggest they are promising materials for electronics of the future
Tuesday 8th August 2017
Optical communications expected to lead market share over the next five years
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Thursday 3rd August 2017
EV Group Japan K.K. headquarters at Yokohama Business Park
Thursday 3rd August 2017
Single chip MEMS design enables integration of all LiDAR components with the exception of the lens
Thursday 3rd August 2017
Q2 2017 revenues reach $115.1 million compared to $75.3 million in Q2 2016
Tuesday 1st August 2017
Chip biometrics form one of the cornerstones of imec’s research into tight and lightweight hardware security that should help ensure the security and privacy of billions of future IoT devices.
Tuesday 1st August 2017
Company to establish new Nagano Works Chino Plant and hire 550 new employees

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