Info
Info
News search:

< Page of 410 >

News


Friday 18th June 2004
This year's European Semiconductor/Siltronic Start-up Award has gone to Scottish developer of light emitting polymer display technology MicroEmissive Displays (MED).
Thursday 17th June 2004
SOPRA signed an exclusive license agreement for IMEC's patented ellipsometric porosimetry (EP) technology. IMEC's R&D EP tool was extensively benchmarked with other porosimetry technologies (e.g. PALS, SAXS, SANS) and excellent results were demonstrated.
Thursday 17th June 2004
STMicroelectronics claims "significant progress" in developing a replacement for Flash memory. Many companies are working on the phase-change memory (PCM) that potentially offers better performance than Flash. The most important feature of PCM is better potential for scaling to smaller feature sizes.
Thursday 17th June 2004
Micro-electromechanical system (MEMS) producer MEMSCAP has won a design in of its pressure module transducer for cockpit instruments made by Aerosonic. MEMSCAP will provide Aerosonic with its TP 3100 pressure module transducer that will be fully integrated into business and civil aircraft instruments.
Thursday 17th June 2004
STMicroelectronics claims "significant progress" in developing a replacement for Flash memory. Many companies are working on the phase-change memory (PCM) that potentially offers better performance than Flash.
Thursday 17th June 2004
Infineon Technologies formally opened the second module of its memory chip assembly, package and test facility in Portugal.
Info
Thursday 17th June 2004
Hynix Semiconductor has signed a business transfer agreement of its system IC division with System Semiconductor.
Thursday 17th June 2004
PVA TePla subsidiary Crystal Growing Systems has delivered its vertical gradient furnace (VGF) production plant to Freiberger Compound Materials.
Thursday 17th June 2004
Ultratech introduced the LSA100 laser spike anneal system - the first tool built on the company's new Unity Platform for laser and lithography applications.
Thursday 17th June 2004
ST Assembly Test Services (STATS) announced lead-free and "green" material options for its entire package portfolio.
Thursday 17th June 2004
NanoPierce Technologies signed an exclusive marketing agreement with German companies ExypnoTech GmbH and TagStar Systems.
Thursday 17th June 2004
Renesas Technology has decided to close its European manufacturing subsidiary Renesas Semiconductor Europe (Alsdorf) in Germany.
Info
Thursday 17th June 2004
SEMI reports semiconductor equipment billings at $9.14bn in Q1 2004, a 65% increase on Q1 2003. Bookings were $9.60bn, up 118%.
Thursday 17th June 2004
SOPRA signed an exclusive license agreement for IMEC's patented ellipsometric porosimetry (EP) technology.
Tuesday 15th June 2004
Infineon Technologies formally opened the second module of its memory chip assembly, package and test facility in Portugal. The company is investing a total of EUR230mn in the new module at the Vila do Condo site.
Tuesday 15th June 2004
NanoPierce Technologies signed an exclusive marketing agreement with German companies ExypnoTech GmbH and TagStar Systems.
Tuesday 15th June 2004
Intel has begun 300mm wafer processing at its Fab 24 in Leixlip, Ireland. In addition, the $2bn facility features Intel's leading 90nm process technology. Fab 24 is the company's fourth 300mm manufacturing facility and Intel's third fab to manufacture semiconductors with 90nm circuitry.
Monday 14th June 2004
The US Semiconductor Industry Association (SIA) has revised its predictions with a compound annual growth rate (CAGR) of 10.4% through to 2007.
Info
Monday 14th June 2004
Elpida Memory and its Hiroshima subsidiary have started construction on a second 300mm wafer fabrication facility.
Monday 14th June 2004
International Sematech will charter the semiconductor metrology systems division of Carl Zeiss SMT to design and develop a next-generation of the proprietary Aerial Image Measurement System (AIMS) for defect review of 193nm immersion lithography photomasks.
Monday 14th June 2004
Mitsubishi Electric will be using thermal accelerometers from MEMSIC in a handset design for Vodafone Japan.
Monday 14th June 2004
R&D spending in the semiconductor industry is set to reach a record high in 2004, according to European electronics analyst Future Horizons.
Monday 14th June 2004
Toshiba has launched the industry's first commercial system-on-chip (SoC) devices built on the X Architecture design based on the inclusion of diagonal chip interconnects alongside the more traditional right angle wiring.
Monday 14th June 2004
Cambridge University spin-off Cavendish Kinetics claims a major new technology that offers the lowest power and entry-cost embedded non-volatile memory (NVM) in the industry.

×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in:
 
X
Info
X
Info
{taasPodcastNotification}