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Wednesday 26th May 2004
STMicroelectronics, CEA-Leti and Aixtron have developed an advanced process technology for the creation of ultra-thin transistor-gate-insulation layers for low-power applications at the 65nm and 45nm CMOS transistor technology nodes.
Wednesday 26th May 2004
ST Assembly Test Services (STATS) has developed a "Chip Scale Module Package" (CSMP) thin-film technology, which involves the fabrication of passive devices such as resistors, capacitors, inductors, filters, baluns and interconnects directly onto a silicon substrate.
Wednesday 26th May 2004
ST Assembly Test Services (STATS) has expanded its integrated turnkey solutions with design-for-test (DFT) capabilities.
Wednesday 26th May 2004
Eastman Kodak has developed an "always on" plastic display.
Wednesday 26th May 2004
MOSAID Technologies has filed a proposed Stipulated Order of Dismissal for all infringement claims with respect to US patent No.6,067,272 covering a delay locked loop (DLL) circuit for use in synchronous DRAM.
Thursday 20th May 2004
Intel disclosed plans for an additional $2bn investment in its facilities in Ireland under an agreement with the Irish Development Authority (IDA). The deal includes grants and other potential incentives as Intel continues to invest in Ireland. The company's 2004 capital expenditure forecast range of $3.6-4.0bn will accommodate the spending for the early stages of the new project.
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Thursday 20th May 2004
Trikon Technologies reports that a number of DRAM manufacturers are evaluating its patented Flowfill and low-k Flowfill inter-metal dielectric gap-fill technologies for sub-90nm device production.
Wednesday 19th May 2004
UMC claims a significant performance enhancement on 45nm p-channel transistors through substrate engineering. UMC's engineers have implemented a new substrate crystalline orientation scheme to realise a transistor drive current increase of 30%, compared to devices fabricated on silicon substrates with conventional surface orientation. Performance gain is based on the same level of device leakage.
Wednesday 19th May 2004
AMD held the "topping-off" ceremony for its next-generation 300mm manufacturing facility, AMD Fab 36, in Dresden, Germany.
Wednesday 19th May 2004
Coventry University Enterprises is seeking industrial partners and licencees for silicon technologies developed at the UK university.
Wednesday 19th May 2004
austriamicrosystems has completed its Swiss stock exchange listing following its initial public offering (IPO).
Tuesday 18th May 2004
OSRAM Opto Semiconductors has been named the exclusive worldwide organic light-emitting diode (OLED) supplier for Cyclotec AMT, a supplier of medical technology.
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Tuesday 18th May 2004
European IC producer Micronas has agreed to acquire LINX Electronics, a US fabless semiconductor company that develops digital television solutions for improved reception of high-definition television (HDTV) signals.
Tuesday 18th May 2004
Coventry University Enterprises is seeking industrial partners and licencees for silicon technologies developed at the UK university.
Tuesday 18th May 2004
A small German company is seeking partners for a chip stacking technology for memory modules through the Wirtschaftsförderung Berlin International business development organisation.
Tuesday 18th May 2004
A new generation of programmable CMOS imaging chips is to be developed in a project led by University of Sheffield Professor Nigel Allinson. Among the hopes for the GBP4.5mn MI-3 project are the earlier detection of cancer, the instant analysis of medical screening tests and the ability for emergency and security services to work effectively in murky surroundings. Possible scientific applications are seen in studies of the fundamental interactions of matter, space exploration and cell biology.
Tuesday 18th May 2004
AMD held the “topping-off” ceremony for its next-generation 300mm manufacturing facility, AMD Fab 36, in Dresden, Germany. According to AMD chairman of the board, president and CEO Hector Ruiz, the facility “will help ensure we have the capacity required to meet our customers’ - and their customers’ - needs for pervasive 64bit computing solutions powered by AMD64 technology.”
Monday 17th May 2004
MEMSCAP released a pressure module transducer for high-end aeronautics applications. The TP 3100 micro-electro-mechanical system (MEMS) has received DO178B level B certification from Norway’s Civil Aviation Authority.
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Monday 17th May 2004
Oki Electric Industry is acquiring an Aixtron Tricent MOCVD tool for the commercial manufacturing of high-density FeRAM non-volatile memories. The tool will be used within the framework of a three-company agreement between Aixtron, Symetrix and Oki. The initial work will produce FeRAM devices in the density range 64k-16Mbit. Engineering samples are scheduled for release by Q4 2004.
Monday 17th May 2004
DuPont Photomasks has begun commercial production at its photomask facility in Dresden, Germany. The company claims it as the world’s most advanced such plant aiming at advanced photomask technologies for semiconductor devices with design rules of 65nm and below.
Monday 17th May 2004
Philips Electronics has developed a 13inch PolyLED TV prototype based on polymer OLED (organic light-emitting diode) technology. The equipment will be demonstrated at the Society for Information Display's International Symposium in the USA, May 23-28, 2004.
Tuesday 11th May 2004
QinetiQ of the UK and TRONIC’S Microsystems in France announced a collaboration agreement to provide customers with an enhanced technology transition roadmap from prototype to volume production of micro-electro-mechanical systems (MEMS).
Tuesday 11th May 2004
Unaxis Wafer Processing has partnered with the University of Central Florida (UCF) in advanced optics development. These R&D efforts will use a Unaxis SHUTTLELINE plasma etch system to fabricate complex micro-optical elements using wafer based manufacturing techniques.
Tuesday 11th May 2004
IQE Silicon Compounds has released a proprietary product with strained silicon at 20% Ge content. The company claims “best in class” for its material in terms of surface micro roughness (less than 1Angstrom on a 1micron2 field), low threading and low pile up dislocation densities, and germanium and thickness uniformity. Several wafer manufacturers and IDMs have made independent assessments, IQE reports.

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