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Friday 27th August 2004
FlipChip International says that it has demonstrated a 95micron pitch bumping technology for advanced semiconductor devices at its R&D laboratory in Arizona.
Friday 27th August 2004
A team of California Institute of Technology (Caltech) researchers reports a new method for coating single-walled carbon nanotubes (SWNTs) attached to atomic force microscope (AFM) tips with conformal fluorocarbon polymers formed in an inductively coupled plasma reactor (Nano Letters).
Friday 27th August 2004
SEMI produced its preliminary July 2004 book-to-bill ratio for North American semiconductor equipment producers.
Friday 27th August 2004
X-FAB Semiconductor Foundries, headquartered in Germany, reports all-time high quarterly sales at EUR36.0mn in Q2 2004.
Thursday 26th August 2004
Japanese researchers claim to have reduced the number of dislocations in silicon carbide crystals by two to three orders of magnitude (Nature, August 26, 2004). "These substrates will promote the development of high-power SiC devices and reduce energy losses of the resulting electrical systems," the scientists write. Other applications for SiC are seen as high frequency and high temperature.
Wednesday 25th August 2004
The National Research Council of Canada's Industrial Materials Institute (NRC-IMI) joined the Nano Imprint Lithography (NIL) consortium that Austrian company EV Group (EVG) formed last year. The consortium is working to commercialise advanced NIL technologies.
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Wednesday 25th August 2004
UK R&D company Innos and the University of Southampton have jointly patented a new technique that enables the suppression of boron diffusion in silicon-germanium (SiGe) using fluorine implantation. Research conducted at Innos' new facilities has shown that a properly optimised fluorine implant not only eliminates transient enhanced diffusion of boron, but also dramatically reduces normal boron thermal diffusion.
Monday 23rd August 2004
No surprises have emerged to prevent the introduction of 193i for 65nm half-pitch in 2007, according to International SEMATECHÕs international symposium on immersion and 157nm lithography. The outlook is also positive for its extension to 45nm half-pitch and possibly below. Potential solutions for achieving the latter include hyper-numerical aperture, improved lens design, high refractive-index fluids, high-index resists and lens material, double exposure, and related infrastructure.
Monday 23rd August 2004
The US Semiconductor Industry Association (SIA) is seeking proposals from interested investigators for the conduct of an independent retrospective epidemiological study of US semiconductor wafer fabrication workers. A request for proposals (RFP) has been made to public and private institutions - including universities, colleges, laboratories, and governmental agencies - to conduct the study. The principal focus of the study will be the assessment of cancer risk among workers employed in US semiconductor wafer fabrication facilities over a period of more than three decades, from the late 1960s to the present.
Thursday 19th August 2004
ASM International is setting up its first wafer processing equipment plant in Singapore this month. The plant will have 13,940m2 of total available floor area and 2787m2 of clean room facilities. The plant will have 50 employees by the end of the year, with this expected to rise to 200-300 new people within three years.
Thursday 19th August 2004
Intense Photonics has gained additional funds to expand its design and volume fabrication of optoelectronic components and modules. A GBP5mn ($9.2mn) funding round was supported by all the company's financial investors - 3i, ACT Venture Capital, Alice Ventures, Cazenove Private Equity, FNI Venture Capital and TTP Ventures.
Thursday 19th August 2004
ASM International is setting up its first wafer processing equipment plant in Singapore this month.
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Thursday 19th August 2004
Oki Electric Industry claims the world's thinnest ultra small tri-axis accelerometer module, the ML8950.
Thursday 19th August 2004
Intense Photonics has gained additional funds to expand its design and volume fabrication of optoelectronic components and modules.
Thursday 19th August 2004
Applied Materials has entered into a definitive agreement to acquire the operating subsidiaries and businesses of Metron Technology.
Thursday 19th August 2004
Freescale Semiconductor has become a "Promoter" for the ZigBee low cost, low power, low-data-rate wireless communications standard.
Thursday 19th August 2004
Taiwanese light emitting diodes (LED) manufacturer South Epitaxy (SEC) has awarded a contract for a moisture-free ammonia (NH3) bulk gas delivery system to Praxair Chemax Semiconductor Materials, a joint venture between Praxair and China Petrochemical Development Corporation.
Thursday 19th August 2004
Peregrine Semiconductor announced a new 0.25micron UltraCMOS silicon-on-sapphire process technology for its foundry service.
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Thursday 19th August 2004
Mitsubishi Electric is to expand annual production capacity of photovoltaic (PV) cells and modules at its Nakatsugawa and Kyoto facilities from 90MW to 135MW by April 2005.
Thursday 19th August 2004
National Semiconductor was granted 221 US patents in its fiscal year 2004 - the most it has received in a single year since its founding in 1959.
Thursday 19th August 2004
VLSI Research reports its estimates for semiconductor equipment quarterly billings and bookings for 2004.
Thursday 19th August 2004
Applied Materials reports FQ3 net sales (to August 1, 2004) at $2.24bn, up 104% on FQ3 2003's $1.09bn.
Wednesday 18th August 2004
Oki Electric Industry claims the world's thinnest ultra small tri-axis accelerometer module, the ML8950. The 1.4mm thick micro-electromechanical system (MEMS) chip sensor has been integrated with the control IC to create a device in a package. In addition to detecting the tri-axis (X, Y and Z) acceleration (+/-3g), the accelerometer module can also detect inclination and impact shock as well as measure the degree of inclination and vibration. The signal is output in a digital format.
Tuesday 17th August 2004
Applied Materials has entered into a definitive agreement to acquire the operating subsidiaries and businesses of Metron Technology. Metron provides semiconductor equipment distribution and outsourcing. Applied will pay $85mn for all outstanding shares and equity equivalents of Metron's worldwide operating subsidiaries and substantially all of its other assets, while also assuming certain liabilities.

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