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Wednesday 9th June 2004
SUSS MicroTec claims installation of the world's first 300mm semiautomatic cryogenic probe system capable of DC testing down to 100femtoA at temperatures from 400K(127degreeC) down to 30K (-243degreeC) at a "leading semiconductor manufacturer".
Wednesday 9th June 2004
PVA TePla in Germany has signed an asset deal to acquire the Floatzone Equipment business unit from Haldor Topsoe based in Denmark.
Wednesday 9th June 2004
Cadence Design Systems and ASML MaskTools announced a multi-year, multi-million dollar software licensing and joint development agreement for advanced resolution enhancement technology (RET) software solutions.
Wednesday 9th June 2004
Silicon Services Consortium has moved into a new 4000m2 facility in Austin, Texas.
Wednesday 9th June 2004
1st Silicon of Malaysia has purchased Applied Materials' Centura SiNgen low-pressure chemical vapour deposition (LPCVD) and Centura Radiance rapid thermal processing (RTP) systems.
Wednesday 9th June 2004
The Information Network estimates that use of micro-electro-mechanical systems (MEMS) in microphones will grow from 1% of 1.2bn microphones sold in 2003 to 20% of 1.6bn units in 2006.
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Wednesday 9th June 2004
German mixed-signal specialist X-FAB Semiconductor has made available a 650V smart power technology (XD10H) based on a trench-isolated silicon-on-insulator (SOI) process.
Wednesday 9th June 2004
Motorola subsidiary Freescale Semiconductor has introduced four new high-performance general-purpose amplifiers (GPAs) designed for a broad range of Class A, small-signal, high linearity radio frequency (RF) applications.
Wednesday 9th June 2004
Motorola's Freescale Semiconductor subsidiary/spin-out preparation vehicle has joined the effort of European companies STMicroelectronics, Infineon Technologies and Philips to further lead-free electronics packaging.
Wednesday 9th June 2004
Delft Technical University's lab-on-chip development has achieved commercial success with US bio-technology company WaferGen planning to produce three micro laboratories on three different sensor chips developed from the Dutch research.
Wednesday 9th June 2004
A small-medium Israeli company has developed a technology to grow single carbon nanotubes (CNT), which allows embedding of the CNTs into chip or micro-electro-mechanical system (MEMS) structures.
Wednesday 9th June 2004
The SEMI and IEEE organisations have signed a memorandum of understanding to support each other's programmes to create nanotechnology and micro-electromechanical system (MEMS) standards.
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Wednesday 9th June 2004
Osram Opto Semiconductors has filed a complaint against Dominant Semiconductors with the US International Trade Commission (ITC). Dominant is a Malaysian manufacturer of light-emitting diodes (LEDs).
Tuesday 8th June 2004
SUSS MicroTec claims installation of the world's first 300mm semiautomatic cryogenic probe system capable of DC testing down to 100femtoA at temperatures from 400K(127degreeC) down to 30K (-243degreeC) at a “leading semiconductor manufacturer”.
Tuesday 8th June 2004
Osram Opto Semiconductors has filed a complaint against Dominant Semiconductors with the US International Trade Commission (ITC). Dominant is a Malaysian manufacturer of light-emitting diodes (LEDs).
Tuesday 8th June 2004
PVA TePla in Germany has signed an asset deal to acquire the Floatzone Equipment business unit from Haldor Topsoe based in Denmark. The seller is withdrawing from floatzone activities in order to concentrate on its core business.
Tuesday 8th June 2004
austriamicrosystems claims the world's smallest 10-bit multiple output magnetic rotary encoder IC, the AS5040. The system-on-chip integrates field sensing Hall elements, analogue front-end and digital signal processing in a single device.
Tuesday 8th June 2004
Cadence Design Systems and ASML MaskTools announced a multi-year, multi-million dollar software licensing and joint development agreement for advanced resolution enhancement technology (RET) software solutions. The two companies will work together to develop a tightly integrated design for manufacturability (DFM) flow.
Info
Tuesday 8th June 2004
A small-medium Israeli company has developed a technology to grow single carbon nanotubes (CNT), which allows embedding of the CNTs into chip or micro-electro-mechanical system (MEMS) structures.
Tuesday 8th June 2004
Delft Technical University’s lab-on-chip development has achieved commercial success with US bio-technology company WaferGen planning to produce three micro laboratories on three different sensor chips developed from the Dutch research. WaferGen will acquire licences for the patented design. In return for the licences, TU Delft will receive royalties and shares in the US company.
Tuesday 8th June 2004
International SEMATECH in the USA and Exitech in the UK have announced an agreement to develop the world's first ultra high numerical aperture (NA=1.3) 193nm wavelength immersion lithography tool. The MS 193I development tool will be used to speed the development of critical infrastructure for immersion lithography at SEMATECH's Immersion Technology Center in Austin, Texas.
Sunday 6th June 2004
Compound semi wafer producer EpiWorks has completed a collaborative research project to develop carbon-doped gallium arsenide antimonide (GaAsSb) production on a multi-wafer production reactor.
Friday 4th June 2004
German mixed-signal specialist X-FAB Semiconductor has made available a 650V smart power technology (XD10H) based on a trench-isolated silicon-on-insulator (SOI) process.
Friday 4th June 2004
MotorolaÕs Freescale Semiconductor subsidiary/spin-out preparation vehicle has joined the effort of European companies STMicroelectronics, Infineon Technologies and Philips to further lead-free electronics packaging. Formerly E3, the group is now called E4 (environmental 4) and focuses on accelerating the use of lead-free packages while stimulating further development of environmentally friendly package technologies.

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