Samsung Electronics claims the industry's first "CVD aluminium" 70nm DRAM process technology. The aluminium chemical vapour deposition (CVD) process technology forms conducting films by turning aluminium metal-organic source materials into particles through chemical reactions, depositing them on the wafer surface.
Advanced Interconnect Technologies (AIT) has fully qualified a complete green flip-chip small outline IC (FC-SOIC) narrow body package that meets OEM requirements for the MSL1 moisture and 260degreesC temperature packaging standards.
International Rectifier (IR) plans to invest $40mn to bring on-line 200mm facilities and double production capacity at its site in Newport, Wales. International Rectifier's planned investment of $40mn in IR-Newport will result in more than 120 additional jobs and the potential to quadruple the facility's production capability in the future.
European nanotech research centre IMEC and Praesagus have agreed to jointly develop Praesagus' physics-based modelling approach for pattern-based interconnect thickness variation. The scope of the technology will be expanded to include copper/low-k and three-dimensional modelling. The partnership will use IMEC's copper damascene, ultra low-k dielectric and 65nm expertise and experience.
Samsung Electronics claims the industry’s first “CVD aluminium” 70nm DRAM process technology. The aluminium chemical vapour deposition (CVD) process technology forms conducting films by turning aluminium metal-organic source materials into particles through chemical reactions, depositing them on the wafer surface.
UK R&D company Innos has invested GBP5mn to upgrade its photolithography capability, including the purchase of a JBX-9300FS electron-beam lithography system from JEOL UK. The new equipment, installed at InnosÕ 1000m2 clean room in Southampton is part of a strategy to provide a complete service to industry and academic institutions.
ASM International reports that a major Japanese consumer electronics manufacturer has bought its critical process equipment for 300mm/90nm production. Deliveries of ASM's Eagle-12 single-wafer plasma enhanced chemical vapour deposition (CVD) and Levitor 4300 rapid thermal processing (RTP) systems are scheduled to begin in Q4 2004.
Bookham Technology has entered into an agreement under which it will acquire Onetta, a provider of optical amplifier modules and subsystems for communications networks. The acquired company is based in Sunnyvale, California. Onetta designs and manufactures intelligent erbium doped fiber amplifiers (EDFA).
Surface Technology Systems (STS) and Jobin Yvon report successful completion of first phase tests on a system for in-situ process control of deep silicon etch applications in MEMS manufacturing. The companies claim a substantial impact on costs and enhanced yields compared to competing solutions.
RF product identification (RFID) supplier Checkpoint Systems and Philips Electronics have entered an alliance to jointly provide tags and readers combined with system integration services to retailers and consumer products companies.
STMicroelectronics, CEA-Leti and Aixtron have developed an advanced process technology for the creation of ultra-thin transistor-gate-insulation layers for low-power applications at the 65nm and 45nm CMOS transistor technology nodes.