Infineon Technologies formally opened the second module of its memory chip assembly, package and test facility in Portugal. The company is investing a total of EUR230mn in the new module at the Vila do Condo site.
Intel has begun 300mm wafer processing at its Fab 24 in Leixlip, Ireland. In addition, the $2bn facility features Intel's leading 90nm process technology. Fab 24 is the company's fourth 300mm manufacturing facility and Intel's third fab to manufacture semiconductors with 90nm circuitry.
International Sematech will charter the semiconductor metrology systems division of Carl Zeiss SMT to design and develop a next-generation of the proprietary Aerial Image Measurement System (AIMS) for defect review of 193nm immersion lithography photomasks.
Toshiba has launched the industry's first commercial system-on-chip (SoC) devices built on the X Architecture design based on the inclusion of diagonal chip interconnects alongside the more traditional right angle wiring.
ICOS Vision Systems in Belgium has acquired the wafer inspection business of Siemens. Under the terms of the agreement, ICOS acquired for EUR6.25mn cash the rights to all of Siemens' two dimensional (2D) wafer inspection technology as well as related assets. The acquisition was closed on June 8, 2004.
austriamicrosystems expanded its 0.35micron foundry technology portfolio with an advanced CMOS opto process. The image sensor technology offers high optical sensitivity and very low dark currents, the company says. The company believes the product could be used in digital video cameras.