The new Pro generation of equipment platforms from Surface Technology
Systems drives down the cost-per-die for single wafer plasma processes
across a wide range of applications. The platforms are available with the
full compliment of STS' well-established plasma etch and deposition sources
in loadlocked or cluster format.
The Pro range delivers a compact footprint, with the latest generation of
PLC-based control system providing enhanced communications, reliability and
functionality coupled with faster and simpler maintenance operations. An
improved user interface, conforming to SEMI E95 further improves the
intuitive look and feel of the systems.
For MEMS silicon micromachining applications etch rates of up to 20
microns/min are available, and for optical devices, sidewall smoothness of
20nm are reproducibly demonstrated. A new showerhead design for PECVD
processes delivers exceptional deposition rates and uniformity. For
example, for optical waveguide applications, 7800 angstroms/min for BPSG
clad and 4500 angstroms/min for Ge-doped silica core layers. Greater
yields, reduced cleaning and minimal consumable parts combine to reduce
further the cost-per-die for both etch and deposition processes.
For further information, click
http://www.stsystems.com/latest_news/Pro_news5.html, or Email:
Surface Technology Systems plc,
tel. +44 1633 652400