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Friday 27th June 2003
Omron of Japan will begin selling its D6F MEMS flow sensor from July 1, 2003. This flow sensor is produced on proprietary micro-electro-mechanical system (MEMS) technology. The company claims that it has produced the world's smallest, supersensitive MEMS technology flow sensor elements realising a size reduction to 1/7th that of flow sensors in the same class.
Friday 27th June 2003
Praxair and the HC Starck affiliate of Bayer AG have formed an alliance to develop, manufacture and supply colloidal silica slurries for the semiconductor chemical mechanical planarisation (CMP) market. The slurries will be marketed and sold globally by Praxair Electronics.
Friday 27th June 2003
Mykrolis has signed a distribution agreement with Zurich-based Levitronix, a manufacturer of pump products for the semiconductor and medical markets.
Friday 27th June 2003
XenICs introduced its new infrared focal plane camera XEVA-USB. This camera has a near-infrared InGaAs imager with a resolution of 320x256pixels. The system is sensitive to radiation of wavelengths between 0.9mm and 1.7mm. This part of the spectrum is fully complementary to the sensitivity range of standard CCD cameras.
Friday 27th June 2003
Semiconductor equipment supplier SCP Global Technologies (SCP) has formally registered its newly-acquired European facility as SCP Germany GmbH. This brings the Pliezhausen facility in Germany into the corporation.
Friday 27th June 2003
Solar cell panel production is to be developed in Uppsala, Sweden, with the first products coming in five years’ time. An agreement between three major companies, two investment funds, and a spin-off company from the Uppsala University Angstrom Solar Centre will be the launch pad for the new development.
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Friday 27th June 2003
Ultratech says that it has successfully developed what it believes to be the IC industrys first laser thermal processing (LTP) technology. The company believes that this will allow manufacturers to scale down to the 20nm technology node. The new technology is the result of nearly nine years of intensive development. LTP uses laser heating, which can be focused at specific areas of the wafer, rather than across the wafer as happens in furnaces or with rapid thermal processing (RTP).
Friday 27th June 2003
Basan has opened basan UK. Basan is a European distributor of cleanroom products and equipment.
Friday 27th June 2003
Daw Technologies has announced the continuation of long-term maintenance services for the specialist cleanroom facilities at the Scottish Microelectronics Centre (SMC). Daw was chosen to build the centre three years ago and has been closely involved with all subsequent expansions.
Friday 27th June 2003
SUSS MicroTec announced new capabilities for cost-effective 1X full-field lithography (1XFFL) with a package of four new technologies. Known collectively as SupraYield, the enhancements provide a high-performance 1XFFL solution for advanced thick-resist applications, such as wafer-level packaging, MEMS and optoelectronics.
Friday 27th June 2003
Micronas introduced what it calls "ActivePackage" – aimed at ridding a headache car manufacturers worldwide have shared for many years. During the life cycle of a car, several of the original integrated circuits (IC) that are designed in when the car is launched become obsolete - forcing car manufacturers to carry out expensive redesigns.
Friday 27th June 2003
Surface Technology Systems (STS) unveiled its Pro family of plasma etch and deposition tools aimed at the transition from the "technology driven" era of micro-electro-mechanical system (MEMS) technology into volume production.
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Friday 27th June 2003
Schlumberger announced that certain of its subsidiaries have signed a definitive agreement with a partnership led by Francisco Partners and Shah Management for the sale of the NPTest business unit.
Friday 27th June 2003
Oxford University is looking for partners to help it commercialise a simple treatment technique for purifying crude samples of single and multi-walled carbon nanotubes (SW and MW-CNTs) to produce a clean, well dispersed product currently containing greater than 90% semiconducting CNTs.
Friday 27th June 2003
X-FAB Semiconductor Foundries announced an expansion of its MEMS product line to include surface micromachining technology for absolute pressure sensors. The technology enables integration of absolute pressure sensors with X-FAB's CMOS technologies. The sensors can also be implemented as discrete components.
Tuesday 24th June 2003
The Taiwanese government has approved funding to set up a new innovative R&D Center for intense production-oriented technology transfer in Taiwan.
Tuesday 24th June 2003
BTG is to co-operate with Atmel on developing a UHF RFID ISO 18000-6 type A chip.
Tuesday 24th June 2003
ST Assembly Test Services (STATS) has qualified a “total” system-in-package (SiP) solution for PBGA, stPBGA and LGA packages along with surface mount manufacturing capability.
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Tuesday 24th June 2003
ON Semiconductor has signed a multi-year, renewable agreement establishing Hynix as a volume supplier of CMOS manufacturing services.
Tuesday 24th June 2003
PDF Solutions has signed a definitive agreement to acquire IDS Software Systems based in California.
Tuesday 24th June 2003
The new Pro generation of equipment platforms from Surface Technology Systems drives down the cost-per-die for single wafer plasma processes across a wide range of applications. The platforms are available with the full compliment of STS' well-established plasma etch and deposition sources in loadlocked or cluster format. The Pro range delivers a compact footprint, with the latest generation of PLC-based control system providing enhanced communications, reliability and functionality coupled with faster and simpler maintenance operations. An improved user interface, conforming to SEMI E95 further improves the intuitive look and feel of the systems. For MEMS silicon micromachining applications etch rates of up to 20 microns/min are available, and for optical devices, sidewall smoothness of 20nm are reproducibly demonstrated. A new showerhead design for PECVD processes delivers exceptional deposition rates and uniformity. For example, for optical waveguide applications, 7800 angstroms/min for BPSG clad and 4500 angstroms/min for Ge-doped silica core layers. Greater yields, reduced cleaning and minimal consumable parts combine to reduce further the cost-per-die for both etch and deposition processes. For further information, click http://www.stsystems.com/latest_news/Pro_news5.html, or Email: [email protected] Surface Technology Systems plc, Newport, NP10 8UJ, UK tel. +44 1633 652400 www.stsystems.com.
Tuesday 24th June 2003
FOR A NUMBER OF YEARS THERE HAS BEEN INDUSTRY DISCUSSION ON THE MERITS OF SINGLE WAFER PROCESSING AS OPPOSED TO BATCH WAFER PROCESSING. ALTHOUGH THE BATTLE CONTINUES EARLY ANALYSIS SUGGEST SINGLE WAFER PROCESSING MAY BE FASTER OVERALL. HEINZ OYRER, DIRECTOR OF STRATEGIC MARKETING AT SEZ DISCUSSES THE BENEFITS OF THE NEW RANGE OF SINGLE WAFER CLEANERS TO COME FROM SEZ AND HOW THEY WILL UP THE ANTE FOR SINGLE WAFER PROCESSING.  
Saturday 21st June 2003
scott test
Saturday 21st June 2003
scott test

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