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Friday 14th September 2007
ROHM and HAAS delivers ultra-low defectivity CMP pad for advanced Copper barrier processes
Friday 14th September 2007
Samsung’s 60nm-class Processing for 2Gb DDR2 DRAM
Friday 14th September 2007
STMicroelectronics announces MCUs based on 0.13-micron
Friday 14th September 2007
MAPPER announce lithography breakthrough
Wednesday 12th September 2007
Rohm and Haas Purchases Coating Cluster from SUSS MicroTec
Wednesday 12th September 2007
ASML claim wafer per day record
Tuesday 11th September 2007
Aviza and Mosel Vitelic announce joint development
Tuesday 11th September 2007
ATMI Purchases technology from Intermolecular
Tuesday 11th September 2007
AMD gains more than expected
Monday 10th September 2007
Infineon scores large USA health contract
Monday 10th September 2007
Intel begins work on 300mm Chinese fab
Monday 10th September 2007
Team project achieves Microscopy breakthrough
Monday 10th September 2007
AMD reveals new server processor
Monday 10th September 2007
AMD introduces new CPU metric
Monday 10th September 2007
TSMC injunction against SMIC denied by USA court
Thursday 6th September 2007
Pattern generators order from Japanese client received
Thursday 6th September 2007
RF business sell off will make way for power semiconductor focus
Thursday 6th September 2007
New air separation plant will supply flat-panel-display factory in Korea
Wednesday 5th September 2007
A paper solution that could leave an imprint on the environment
Wednesday 5th September 2007
New 300mm wafer facility opening for NAND flash memory is fab for Japan
Wednesday 5th September 2007
Multiple abatement system purchase will aid solar cost reduction
Wednesday 5th September 2007
Contract will supply $1m of components to UK nano and microtech project
Wednesday 5th September 2007
Edge inspection tool selection will assist in wafer edge process control
Tuesday 4th September 2007
European semiconductor sales positive in July
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