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Wednesday 26th November 2003
Japanese company Showa Denko (SDK) will open a resident representative's office in Moscow in January 2004 to make full use of R&D resources in Russia.
Wednesday 26th November 2003
Soisic, a semiconductor intellectual property (SIP) company specialising in silicon on insulator (SOI) designs, has completed series-B funding round of EUR12.5mn led by Atlas Venture. The round also included co-investments from KT Venture and all existing investors. These include CEA Valorisation SA, a subsidiary of the Commissariat a l'Energie Atomique (CEA), the French public technological research organisation and SOI wafer manufacturer Soitec.
Wednesday 26th November 2003
KLA-Tencor and Soitec have entered a joint programme to improve the quality, yield and cost of production of the silicon on insulator (SOI) wafers used in high-performance, low-power-consumption IC applications.
Wednesday 26th November 2003
Tokyo Electron (TEL) and ASML Holding agreed to enhance litho-cluster productivity and process performance through joint development programmes. Multiple tool exchanges in early 2004 will be used to facilitate customer demonstrations in Japan, the Netherlands and the USA. Litho-cluster describes the linking of coater/developer and lithography systems used in semiconductor manufacturing.
Wednesday 26th November 2003
Spanish researchers have created a new ultra-light transparent magnetic material (Applied Physics Letters, Vol.82, pp.4307-4309). The scientists come from the Universitat Autonoma de Barcelona (UAB), the Institut de Cienca de Materials de Barcelona (ICMAB-CSIC) and the Universidad de Zaragoza.
Wednesday 26th November 2003
The EUREKA project E! 2259 VSI has developed 3-D chips or vertical system integration (VSI). The contributors see benefits for chip cards (smartcards) to secure information or e-money against hackers.
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Wednesday 26th November 2003
ASM International has shipped a Levitor 4000 rapid thermal processing (RTP) system for 200mm wafers to a "leading device maker in Europe". The European customer will use the tool to develop implant anneals for 90nm processing and NiSi annealing applications in the 200-550C temperature range for future technology nodes.
Friday 21st November 2003
BTG has acquired the exclusive rights to commercialise Strain-Compensated Multiple Quantum Well vertical cavity surface emitting lasers (VCSELs) from the Cornell Research Foundation in New York state.
Thursday 20th November 2003
Japanese company Showa Denko (SDK) plans to market in early 2004 a hexafluoro-1,3-butadiene (C4F6) dry etching gas it has developed in Russia. C4F6 enables dry etching at a line width of as narrow as 90nm or less. SDK will import crude C4F6 produced in commercial quantities in Russia for purification at SDK's Kawasaki plant. SDK will then provide the quality assured product to the market.
Thursday 20th November 2003
International SEMATECH (ISMT) engineers have qualified a porous, ultra low-k material for dual damascene copper processing at 130nm feature sizes, on 300mm wafers, using 193nm lithography.
Thursday 20th November 2003
The United States comes 11th in a global index ranking information and communication and technology (ICT) access made by the International Telecommunication Union (ITU). The index includes assessments of infrastructure, affordability, population knowledge/education, quality of service and usage.
Thursday 20th November 2003
CSD Epitaxy delivered an EpiPro epitaxial processing production system to Polish company Cemat Silicon, a supplier of silicon epitaxial wafers. The delivery represents a repeat order by Cemat for the EpiPro 5000 system. CSD Epitaxy acquired the Gemini and EpiPro product lines from Mattson Technology earlier this year. CSD Epitaxy has manufacturing headquarters in California.
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Thursday 20th November 2003
AMD has broken ground on a 300mm manufacturing facility in Germany. AMD Fab 36 will be part of AMD Dresden Fab 36 LLC & Co. KG and will be located in Dresden next to AMD’s Fab 30, a 200mm production site. The 300mm facility is expected to be in volume production in 2006, employing 1000 people, mostly skilled engineers and technicians.
Thursday 20th November 2003
ON Semiconductor plans to consolidate more of its assembly and test operations at its site in Seremban, Malaysia, discontinuing back-end activities in Roznov, Czech Republic. The Rosnov tools will be moved to Seremban. ON Semiconductor plans to maintain its front-end manufacturing and design centre operations at Roznov, where it has significant ties to technical universities in the Czech Republic and Slovakia.
Thursday 20th November 2003
Researchers at the Sandia US national laboratory have developed record-breaking ultraviolet light emitting diodes (UV LEDs). Two separate devices have been produced that emit light at 290nm and 275nm. The 290nm device has an output power of 1.3mW in a continuous wave (CW) mode, while the shorter wavelength part produces 0.4mW.
Wednesday 19th November 2003
Europe’s ASML and Japan’s Dainippon Screen Manufacturing have agreed to jointly develop seamless litho-clustering methods. The term "litho-cluster" describes the linking of track and lithography systems. The companies plan to instal Dainippon Screen’s track systems in the ASML Development Laboratory in Veldhoven, the Netherlands.
Wednesday 19th November 2003
Tokyo Electron (TEL) and Clariant’s Japanese subsidiary have jointly developed surfactant rinse (FIRM) solutions and processes for the formation of ultra-fine patterns in semiconductor production. The processes are now ready for sale.
Wednesday 19th November 2003
IMEC’s 300mm fab construction project is the subject of a EUR46.8mn loan agreement with Fortis Bank. The European Investment Bank (EIB) supports the deal. The Flemish government previously advanced EUR37.2mn in November 2002.
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Wednesday 19th November 2003
BOC Edwards has secured the supply of all bulk gases, bulk & speciality gas distribution and chemical & slurry management systems for a "large semiconductor manufacturer's new wafer fabrication facility near Shanghai", China. The services include complete design, engineering, installation, start-up and commissioning, including sustained operations for the bulk gas pad.
Wednesday 19th November 2003
US foundry DALSA Semiconductor has selected EV Group as the strategic supplier for micro-electro-mechanical system (MEMS) wafer bonding and thick polymer lithography production equipment.
Thursday 13th November 2003
Two lithography exposure tool companies released comments on the prospects for immersion lithography, where water is planned to be used as an optical medium to extend 193nm resolution.
Thursday 13th November 2003
Concerns that UK industry is not responding effectively to new European environmental measures has led the UK government departments of Trade and Industry (DTI) and Environment, Food and Rural Affairs (DEFRA) to issue two new guidance documents to the chief executives of every UK company in the electrical/electronics sector.
Thursday 13th November 2003
Philips Electronics claims the industry's first complete plug-and-play Bluetooth solution in a single, low-cost chip package. The Bluetooth local wireless communication standard is aimed at applications such as mobile phones, headsets, car kits and PDAs.
Thursday 13th November 2003
Philips Electronics claims a breakthrough in LDMOS (laterally diffused metal oxide semiconductor) technology that its says can reduce the complexity and operating costs of 3G cellular base stations while at the same time enhancing their performance and reliability.

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