SUSS MicroTec announced new capabilities for cost-effective 1X full-field lithography (1XFFL) with a package of four new technologies. Known collectively as SupraYield, the enhancements provide a high-performance 1XFFL solution for advanced thick-resist applications, such as wafer-level packaging, MEMS and optoelectronics.
Solar cell panel production is to be developed in Uppsala, Sweden, with the first products coming in five years’ time. An agreement between three major companies, two investment funds, and a spin-off company from the Uppsala University Angstrom Solar Centre will be the launch pad for the new development.
XenICs introduced its new infrared focal plane camera XEVA-USB. This camera has a near-infrared InGaAs imager with a resolution of 320x256pixels. The system is sensitive to radiation of wavelengths between 0.9mm and 1.7mm. This part of the spectrum is fully complementary to the sensitivity range of standard CCD cameras.
Surface Technology Systems (STS) unveiled its Pro family of plasma etch and deposition tools aimed at the transition from the "technology driven" era of micro-electro-mechanical system (MEMS) technology into volume production.
iSuppli believes that a supply/demand imbalance is on the cards for the
semiconductor market before the end of the year as a result of most of the
excess inventory being eliminated from the supply chain.
STMicroelectronics claims the world's first volume production embedded Flash
memory in an advanced 180nm CMOS technology. ST's 180nm embedded Flash
technology offers the world's smallest cell size, with each Flash cell
occupying just 0.37micron2.
Researchers at Infineon Technologies claim to have set a new world-speed record for silicon chips. The company’s Munich research labs has fabricated carbon-doped silicon germanium (SiGe:C) bipolar ICs that reach an operating frequency of more than 110GHz with minimum power consumption. By way of comparison, silicon-based processors in CMOS used in PCs run with top speeds of less than 4GHz.
STMicroelectronics claims the world's first volume production embedded Flash memory in advanced 180nm CMOS technology. ST's 180nm embedded Flash technology offers the world's smallest cell size, with each Flash cell occupying just 0.37micron2.
Vitesse Semiconductor will work with BAE Systems and the University of Illinois Urbana Champain (UIUC) to develop advanced manufacturing processes and communication ICs using the sub-micron VIP-2 indium phosphide heterojunction bipolar transmitter (InP HBT) technology under a $6mn contract from the Defense Advanced Research Projects Agency (DARPA).
EV Group (EVG) has shipped and successfully installed a 200mm hot embossing and nanoimprinting system at the CEA-LETI research centre in Grenoble, France. The system will be used in collaboration between CEA-LETI and CNRS-LTM on micro- and nanotechnology research in the area of biochip and microfluidic devices.
Motorola Labs announced results from its carbon nanotechnology research for use in flat panel displays and other applications. The researchers have been developing what they call a "nano emissive display" (NED).
The German Federal Ministry of the Interior (BMI) and Infineon Technologies have signed a Memorandum of Understanding (MoU) concerning Information Technology (IT) security. The aim is to establish a sound technology basis for an enhanced security level in systems that are used in the civil service, in private companies and households.