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Monday 7th July 2003
SUSS MicroTec announced new capabilities for cost-effective 1X full-field lithography (1XFFL) with a package of four new technologies. Known collectively as SupraYield, the enhancements provide a high-performance 1XFFL solution for advanced thick-resist applications, such as wafer-level packaging, MEMS and optoelectronics.
Monday 7th July 2003
Solar cell panel production is to be developed in Uppsala, Sweden, with the first products coming in five years’ time. An agreement between three major companies, two investment funds, and a spin-off company from the Uppsala University Angstrom Solar Centre will be the launch pad for the new development.
Monday 7th July 2003
XenICs introduced its new infrared focal plane camera XEVA-USB. This camera has a near-infrared InGaAs imager with a resolution of 320x256pixels. The system is sensitive to radiation of wavelengths between 0.9mm and 1.7mm. This part of the spectrum is fully complementary to the sensitivity range of standard CCD cameras.
Monday 7th July 2003
Surface Technology Systems (STS) unveiled its Pro family of plasma etch and deposition tools aimed at the transition from the "technology driven" era of micro-electro-mechanical system (MEMS) technology into volume production.
Monday 7th July 2003
Texas Instruments plans to be groundbreaking a new 300mm fab by the end of 2005 in Richardson, Texas.
Monday 7th July 2003
Unitive Semiconductor Taiwan (UST) has installed a 300mm line for electroplate bumping.
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Monday 7th July 2003
Cirrus Logic has agreed to sell its semiconductor test operation assets in Texas to ChipPAC.
Monday 7th July 2003
The German Federal Ministry of the Interior (BMI) and Infineon Technologies have signed a Memorandum of Understanding (MoU) concerning Information Technology (IT) security.
Monday 7th July 2003
EV Group (EVG) has shipped and successfully installed a 200mm hot embossing and nanoimprinting system at the CEA-LETI research centre in Grenoble, France.
Monday 7th July 2003
iSuppli believes that a supply/demand imbalance is on the cards for the semiconductor market before the end of the year as a result of most of the excess inventory being eliminated from the supply chain.
Monday 7th July 2003
STMicroelectronics claims the world's first volume production embedded Flash memory in an advanced 180nm CMOS technology. ST's 180nm embedded Flash technology offers the world's smallest cell size, with each Flash cell occupying just 0.37micron2.
Monday 7th July 2003
Motorola Labs announced results from its carbon nanotechnology research for use in flat panel displays and other applications.
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Monday 7th July 2003
Researchers at Infineon Technologies claim to have set a new world-speed record for silicon chips. The company’s Munich research labs has fabricated carbon-doped silicon germanium (SiGe:C) bipolar ICs that reach an operating frequency of more than 110GHz with minimum power consumption. By way of comparison, silicon-based processors in CMOS used in PCs run with top speeds of less than 4GHz.
Monday 7th July 2003
Solar cell panel production is to be developed in Uppsala, Sweden, with the first products coming in five years' time.
Monday 7th July 2003
Rite Track has bought the 8X and 9X track product lines from ASML. These products were inherited from ASML’s acquisition of Silicon Valley Group (SVG).
Monday 7th July 2003
Researchers from Karlsruhe (Sciencexpress, June 26, 2003) have developed a method to separate metallic from semiconducting single-walled carbon nanotubes (SWNTs).
Monday 7th July 2003
ThreeFive Photonics has filed a "suspension of payments" request in the Dutch courts. The company works to develop chip-based optoelectronic integration.
Monday 7th July 2003
Bookham Technology has entered into an agreement to acquire substantially all of the business and assets of Cierra Photonics, a company based in California, employing 39 people.
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Wednesday 2nd July 2003
Texas Instruments plans to be groundbreaking a new 300mm fab by the end of 2005 in Richardson, Texas. This will be the second 300mm TI plant, the first being DMOS 6 in Dallas in operation since 2001.
Wednesday 2nd July 2003
STMicroelectronics claims the world's first volume production embedded Flash memory in advanced 180nm CMOS technology. ST's 180nm embedded Flash technology offers the world's smallest cell size, with each Flash cell occupying just 0.37micron2.
Wednesday 2nd July 2003
Vitesse Semiconductor will work with BAE Systems and the University of Illinois Urbana Champain (UIUC) to develop advanced manufacturing processes and communication ICs using the sub-micron VIP-2 indium phosphide heterojunction bipolar transmitter (InP HBT) technology under a $6mn contract from the Defense Advanced Research Projects Agency (DARPA).
Wednesday 2nd July 2003
EV Group (EVG) has shipped and successfully installed a 200mm hot embossing and nanoimprinting system at the CEA-LETI research centre in Grenoble, France. The system will be used in collaboration between CEA-LETI and CNRS-LTM on micro- and nanotechnology research in the area of biochip and microfluidic devices.
Wednesday 2nd July 2003
Motorola Labs announced results from its carbon nanotechnology research for use in flat panel displays and other applications. The researchers have been developing what they call a "nano emissive display" (NED).
Wednesday 2nd July 2003
The German Federal Ministry of the Interior (BMI) and Infineon Technologies have signed a Memorandum of Understanding (MoU) concerning Information Technology (IT) security. The aim is to establish a sound technology basis for an enhanced security level in systems that are used in the civil service, in private companies and households.

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