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Wednesday 20th August 2003
Philips Electronics is licensing Memory Stick technology from Sony. Philips will use the technology in its Nexperia portfolio of programmable silicon on chip (SOC) and system solutions for multimedia applications.
Wednesday 20th August 2003
SIGMA-C has added liquid immersion process support to its SOLID-C 6.2 lithography simulation software. The German company began shipping SOLID-C 6.2 in July 2003.
Tuesday 19th August 2003
Infineon Technologies and United Epitaxy (UEC) of Taiwan are to set up a joint venture for the manufacturing and development of fibre optic components.
Tuesday 19th August 2003
STMicroelectronics is using WaferMasters' SAO-150AP stacked annealing oven at its AG-1 wafer fab in Agrate, Italy. The tool is being used on a volume spin on glass (SOG) process.
Tuesday 19th August 2003
Tecan Components says that it is experiencing "significant interest" in its electroformed parts for micro-applications.
Tuesday 19th August 2003
Oxford University's Isis organisation is seeking partners to commercialise research on filling carbon nanotubes with metals and metal compounds. The research comes from Oxford's Department of Inorganic Chemistry.
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Tuesday 19th August 2003
Hynix Semiconductor has completed development of its 1Gbit DDR2 memory chip. Sampling will begin in early 4Q 2003 with full-scale volume production coming on-line by early 2004 to coincide with the release of Intel's DDR2 supporting PC chipset.
Tuesday 19th August 2003
STMicroelectronics is using WaferMasters' SAO-150AP stacked annealing oven at its AG-1 wafer fab in Agrate, Italy. The tool is being used on a volume spin on glass (SOG) process.
Tuesday 19th August 2003
Hynix Semiconductor has completed development of its 1Gbit DDR2 memory chip. Sampling will begin in early 4Q 2003 with full-scale volume production coming on-line by early 2004 to coincide with the release of Intel's DDR2 supporting PC chipset. Hynix will use its Golden Chip 0.11micron process technology. A 512Mbit DDR2 chip will also be available.
Monday 18th August 2003
A new operation – Micro Engineering Marketing and Support (M.E.M.S) – has been established to sell maskless photolithography processes and systems in the UK and Ireland. Equipment and support services are also on offer.
Friday 15th August 2003
Infineon Technologies and United Epitaxy (UEC) of Taiwan are to set up a joint venture for the manufacturing and development of fibre optic components. The joint venture will be based within the existing facility of UEC at the Hsinchu Science-based Industrial Park in Taiwan. The new company will be established in October 2003.
Friday 15th August 2003
Oxford University’s Isis organisation is seeking partners to commercialise research on filling carbon nanotubes with metals and metal compounds. The research comes from Oxford's Department of Inorganic Chemistry.
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Tuesday 12th August 2003
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Monday 11th August 2003
Genus announced multiple orders for its StrataGem200 atomic layer deposition (ALD) tool from a major European DRAM manufacturer.
Friday 8th August 2003
Tecan Components says that it is experiencing "significant interest" in its electroformed parts for micro-applications.
Thursday 7th August 2003
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Thursday 7th August 2003
The Fraunhofer Institute for Interfacial Engineering and Biotechnology (IGB) has developed a new type of protein analysis chip based on silica-nanoparticles.
Thursday 7th August 2003
Chartered Semiconductor Manufacturing, IBM and Infineon Technologies have agreed joint 65nm semiconductor manufacturing process development.
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Thursday 7th August 2003
Contacting carbon nanotubes with palladium (Pd) greatly reduces or eliminates the barriers for current, according to researchers from Stanford and Purdue universities (Nature, August 7, 2003). The researchers have realised high-performance ballistic nanotube field-effect transistors with zero or slightly negative Schottky barriers.
Wednesday 6th August 2003
International SEMATECH (ISMT) and Exitech have agreed to jointly develop the world's first 13.5nm wavelength aerial image monitor tool for pattern and defect inspection of extreme ultraviolet (EUV) reticles. This first alpha tool built by Exitech will be used for EUV mask blank and defect inspection at the International SEMATECH North (ISMTN) NanoFab 1 EUV mask blank facility in Albany, New York. The tool is scheduled for delivery in Q3 2005
Wednesday 6th August 2003
Taiwan foundry UMC is to buy back Infineon’s equity share in the UMCi 300mm joint venture fab in Singapore. UMCi is the Singapore manufacturing venture formed in April 2001 by Infineon, UMC and Singapore’s Economic Development Board investment arm (EDBI). EDBI will retain its equity position.
Friday 1st August 2003
Friday 1st August 2003
Bookham is launching new cost cutting initiatives that include reallocating and reducing its R&D spending in recognition of slower market growth and pursuing restructuring efforts to reduce manufacturing overheads.
Wednesday 30th July 2003
Bookham Technology and BTI Photonic Systems have formed a technology, product and commercial association to deliver optimised optical subsystems. The aim is to speed introduction of advanced optical solutions based on Bookham's portfolio of erbium doped fibre amplifiers (EDFA) and optical add/drop multiplexers (OADM), together with BTI's Netstender family of intelligent link systems.

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