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Monday 7th July 2003
Researchers from Karlsruhe (Sciencexpress, June 26, 2003) have developed a method to separate metallic from semiconducting single-walled carbon nanotubes (SWNTs).
Monday 7th July 2003
ThreeFive Photonics has filed a "suspension of payments" request in the Dutch courts. The company works to develop chip-based optoelectronic integration.
Monday 7th July 2003
Bookham Technology has entered into an agreement to acquire substantially all of the business and assets of Cierra Photonics, a company based in California, employing 39 people.
Wednesday 2nd July 2003
Texas Instruments plans to be groundbreaking a new 300mm fab by the end of 2005 in Richardson, Texas. This will be the second 300mm TI plant, the first being DMOS 6 in Dallas in operation since 2001.
Wednesday 2nd July 2003
STMicroelectronics claims the world's first volume production embedded Flash memory in advanced 180nm CMOS technology. ST's 180nm embedded Flash technology offers the world's smallest cell size, with each Flash cell occupying just 0.37micron2.
Wednesday 2nd July 2003
Vitesse Semiconductor will work with BAE Systems and the University of Illinois Urbana Champain (UIUC) to develop advanced manufacturing processes and communication ICs using the sub-micron VIP-2 indium phosphide heterojunction bipolar transmitter (InP HBT) technology under a $6mn contract from the Defense Advanced Research Projects Agency (DARPA).
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Wednesday 2nd July 2003
EV Group (EVG) has shipped and successfully installed a 200mm hot embossing and nanoimprinting system at the CEA-LETI research centre in Grenoble, France. The system will be used in collaboration between CEA-LETI and CNRS-LTM on micro- and nanotechnology research in the area of biochip and microfluidic devices.
Wednesday 2nd July 2003
Motorola Labs announced results from its carbon nanotechnology research for use in flat panel displays and other applications. The researchers have been developing what they call a "nano emissive display" (NED).
Wednesday 2nd July 2003
The German Federal Ministry of the Interior (BMI) and Infineon Technologies have signed a Memorandum of Understanding (MoU) concerning Information Technology (IT) security. The aim is to establish a sound technology basis for an enhanced security level in systems that are used in the civil service, in private companies and households.
Tuesday 1st July 2003
Keithley´s device, component, and circuit characterization solutions combine superior precision and accuracy with exceptional speed and ease of use. For semiconductor reliability testing, Keithley has integrated test solutions for wafer level reliability, accelerated stress, quality assurance, hot carrier degradation, time dependent dielectric breakdown and analysis, and many other general Test&Measurement and Data Acquisition applications, including: · High Performance Single-insertion RF and DC Test Solution · Fast and easy to use single to multi-channel Device Characterization incl. KTE, HCI, IC-CAP software · C-V Measurements · Ethernet-based Switch/Measure systems, SourceMeters, DMMs, Data Acquisition products Contact us for free application advice. Use expert advice from Keithley's team of test experts. For more information about any of our solutions or to discuss your application with one of our experts, call or send a fax or an e-mail to your local Keithley office: Belgium: phone 02-363 00 40, fax 02-362 00 64, e-mail [email protected] Finland: phone 09-53 06 65 60, fax 09-53 06 65 65, e-mail [email protected] France: phone 01-64 53 20 20, fax 01-60 11 77 26, e-mail
Monday 30th June 2003
Ultratech says that it has successfully developed what it believes to be the IC industry's first laser thermal processing (LTP) technology.
Monday 30th June 2003
STMicroelectronics was one of three silicon chip manufacturers to be named in BusinessWeek's "InfoTech 100" annual ranking of top technology companies.
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Monday 30th June 2003
Daw Technologies has announced the continuation of long-term maintenance services for the specialist cleanroom facilities at the Scottish Microelectronics Centre (SMC).
Monday 30th June 2003
Praxair and the HC Starck affiliate of Bayer AG have formed an alliance to develop, manufacture and supply colloidal silica slurries for the semiconductor chemical mechanical planarisation (CMP) market.
Monday 30th June 2003
Advantest plans to spin off its information technology department to establish a new, 100% subsidised subsidiary Advantest Information Systems on July 1, 2003.
Monday 30th June 2003
Semiconductor equipment supplier SCP Global Technologies (SCP) has formally registered its newly-acquired European facility as SCP Germany GmbH.
Monday 30th June 2003
"One of the worlds leading suppliers of office automation equipment" has ordered an Aspen ICP Strip system from Mattson Technology.
Monday 30th June 2003
AMD reduced it sales expectations for Q2, ending June 29, 2003.
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Monday 30th June 2003
The Fabless Semiconductor Association (FSA) announced today the results of its quarterly wafer pricing survey.
Monday 30th June 2003
Micronas introduced what it calls "ActivePackage" - aimed at ridding a headache car manufacturers worldwide have shared for many years.
Monday 30th June 2003
IBM has launched a web portal for chip designers and verification engineers that will provide access to select tools on an as-needed basis.
Friday 27th June 2003
Researchers from Karlruhe (Sciencexpress, June 26, 2003) have developed a method to separate metallic from semiconducting single-walled carbon nanotubes (SWNTs). The technique uses the different relative dielectic constants of the two types of tube with respect to the solvent.
Friday 27th June 2003
Researchers have made progress in producing n-type diamond with high conductivity (Nature Materials, July 2003). Diamond is an attractive material in terms of its electrical, optical thermal and chemical properties. However, creating n-type conduction in the material has been a major challenge. Phosphorus doping has only achieved properties that are unsatisfactory for most device applications.
Friday 27th June 2003
Omron of Japan will begin selling its D6F MEMS flow sensor from July 1, 2003. This flow sensor is produced on proprietary micro-electro-mechanical system (MEMS) technology. The company claims that it has produced the world's smallest, supersensitive MEMS technology flow sensor elements realising a size reduction to 1/7th that of flow sensors in the same class.

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