Concerns that UK industry is not responding effectively to new European environmental measures has led the UK government departments of Trade and Industry (DTI) and Environment, Food and Rural Affairs (DEFRA) to issue two new guidance documents to the chief executives of every UK company in the electrical/electronics sector.
Philips Electronics claims the industry's first complete plug-and-play Bluetooth solution in a single, low-cost chip package. The Bluetooth local wireless communication standard is aimed at applications such as mobile phones, headsets, car kits and PDAs.
Philips Electronics claims a breakthrough in LDMOS (laterally diffused metal oxide semiconductor) technology that its says can reduce the complexity and operating costs of 3G cellular base stations while at the same time enhancing their performance and reliability.
EV Group (EVG) has successfully installed an EVG501 wafer bonding system and an EVG620 precision alignment system for double-side lithography at McGill University’s Nanotool Micromachining fab in Montreal, Quebec, Canada.
Researchers at Motorola's semiconductor labs have built a "Multiple Independent Gate Field Effect Transistor" (MIGFET). The device allows for one transistor to contain multiple independent gates. Motorola claims it as a "first-of-its-kind". The company believes that the transistor could provide a major boost to the continuing drive toward smaller, more powerful chips.
Intel says that it has identified new materials as high-k gate dielectric and gate metal to replace those used to manufacture chips for more than 30 years. Intel says that the new high-k material reduces leakage by more than 100 times over silicon dioxide.
TRONIC’S Microsystems, a developmer and producer of custom MEMS (Micro Electro Mechanical Systems) for high-end applications, today held the inauguration of its new state-of-the-art MEMS production facility in Crolles, France. The company is enhancing its production capacity of high performance, high value add custom MEMS products based on specialized thick silicon-on-insulator (SOI) micromachining processes.
Agere Systems has announced it has produced the fastest working high-speed serial interface circuits in 90 nm low-k technology. Agere's 90nm serialiser/deserialiser (SerDes) technology will enable speeds of 12 gigabits per second (Gbits/s), 20 percent faster than currently available technology.
IQE, an outsource supplier of advanced wafers to the semiconductor industry, has announced the successful completion of a Placing and Open offer, raising £18.75 million (£17.9 million net of expenses).
West Associates appointed Distributor for Qualiflow in UK & Ireland
Whatever you are doing with gases, West Associates probably has a gas handling product that would help.
After 12 successful years distributing:
· NuPure Point Of Use gas purifiers (sub ppb purity whether it is argon, arsine or ammonia)
· Firechek pneumatic shut-off valves (temperature triggered)
· Emergency Containment Systems gas cylinder containment vessels
· AXT VGF GaAs & InP wafers (2” – 150mm, Semi Insulating or Semi Conducting))
West Associates has now added Qualiflow to the stable, to offer:
· Mass Flow Controllers & Meters (digital & analogue)
· Liquid Flow Controllers
· Vapour Flow Controllers
· Bellows valves
· Diaphragm valves
Qualiflow’s own product range has extended significantly, following their merger with Jipelec and acquisition of a 33% share of Lintec, both leading manufacturers of liquid vaporization systems.
Liquid evaporation is thought to be a key technology in the manufacturing of the next generation of integrated circuits.
If you have a specific purifier need let us know the details here Purifier RFQ and we will send you the appropriate quotation & data sheet.
Otherwise, tell us what you are doing with gas and we’ll keep you updated with the relevant product news click here.
Tronic’s Microsystems and Sercel presented the results of a strategic partnership for the fabrication of a new generation of seismic sensors, or geophones, based on micro-electro-mechanical system (MEMS) technology. Tronic’s optimised and then industrialised a prototype that was jointly developed by Sercel and the French CEA Leti microelectronics laboratory. Tronic’s has already ensured the first series production of the seismic sensors and is now in volume production.
The Arizona State University (ASU) NanoFab has bought an EVG620 precision alignment system and EVG520HE Hot embossing and wafer bonding system from EV Group (EVG). ASU NanoFab is developing a southwest USA regional centre of excellence. A major research instrumentation award from the US National Science Foundation allows ASU to invest in equipment to enhance the university's capability to create biochips.
STMicroelectronics has made a joint development agreement with MobiDiag to create a complete system for genomic-based detection of infectious diseases based on a silicon micro-electro-mechanical systems (MEMS) biochip. The system will allow clinical diagnostics laboratories faster, cheaper, and more user-friendly access to genomic-based techniques for infectious disease detection.
The Auction of State-of-the-Art Optical and Semiconductor Fabrication Tools will include: Thermo VG Semicon V100 HU Molecular Beam Epitaxy System & Semiconductor Fabrication Tools
Auction Starts November 12, 2003 at 9:00 AM EET
Auction Ends November 12, 2003 at 11:00 PM EET
To participate in this auction log on to www.dovebid.com, register for an account, and start to bid. Once you set up an account, you’re ready to participate in any DoveBid Featured Online Auction! Prior to the auction, preview the assets online via digital photos and comprehensive descriptions. You can also inspect the assets in person in Tampere, Finland. When you find an item you want to bid on, enter your bid amount in the “bid box”, and then monitor your bid as others compete against you. Be sure to click the "refresh" button on your web browser often to keep the bid information on your screen updated. A timer displays how much time is remaining before the lot closes. And when the time runs out, the highest bidder wins! DoveBid sends an immediate email notification to all bidders who win assets.
Intel gave details of a strained silicon transistor that is being used in its next-generation 90nm process. The process is to be ramped this year at the company’s 300mm fabs in Hillsboro, Oregon, and Albuquerque, New Mexico. And next year (H1 2004), the process will come to Europe at Intel’s fab in Leixlip, Ireland.
A new method to completely remove SU-8 photoresist from micro structured components has been developed by a team of experts from the Institut fuer Mikrotechnik Mainz (IMM) and the M-O-T Mikro-und Oberflaechentechnik in Germany.