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Monday 30th June 2003
AMD reduced it sales expectations for Q2, ending June 29, 2003.
Monday 30th June 2003
The Fabless Semiconductor Association (FSA) announced today the results of its quarterly wafer pricing survey.
Monday 30th June 2003
Micronas introduced what it calls "ActivePackage" - aimed at ridding a headache car manufacturers worldwide have shared for many years.
Monday 30th June 2003
IBM has launched a web portal for chip designers and verification engineers that will provide access to select tools on an as-needed basis.
Friday 27th June 2003
Researchers from Karlruhe (Sciencexpress, June 26, 2003) have developed a method to separate metallic from semiconducting single-walled carbon nanotubes (SWNTs). The technique uses the different relative dielectic constants of the two types of tube with respect to the solvent.
Friday 27th June 2003
Researchers have made progress in producing n-type diamond with high conductivity (Nature Materials, July 2003). Diamond is an attractive material in terms of its electrical, optical thermal and chemical properties. However, creating n-type conduction in the material has been a major challenge. Phosphorus doping has only achieved properties that are unsatisfactory for most device applications.
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Friday 27th June 2003
Omron of Japan will begin selling its D6F MEMS flow sensor from July 1, 2003. This flow sensor is produced on proprietary micro-electro-mechanical system (MEMS) technology. The company claims that it has produced the world's smallest, supersensitive MEMS technology flow sensor elements realising a size reduction to 1/7th that of flow sensors in the same class.
Friday 27th June 2003
Praxair and the HC Starck affiliate of Bayer AG have formed an alliance to develop, manufacture and supply colloidal silica slurries for the semiconductor chemical mechanical planarisation (CMP) market. The slurries will be marketed and sold globally by Praxair Electronics.
Friday 27th June 2003
Mykrolis has signed a distribution agreement with Zurich-based Levitronix, a manufacturer of pump products for the semiconductor and medical markets.
Friday 27th June 2003
XenICs introduced its new infrared focal plane camera XEVA-USB. This camera has a near-infrared InGaAs imager with a resolution of 320x256pixels. The system is sensitive to radiation of wavelengths between 0.9mm and 1.7mm. This part of the spectrum is fully complementary to the sensitivity range of standard CCD cameras.
Friday 27th June 2003
Semiconductor equipment supplier SCP Global Technologies (SCP) has formally registered its newly-acquired European facility as SCP Germany GmbH. This brings the Pliezhausen facility in Germany into the corporation.
Friday 27th June 2003
Solar cell panel production is to be developed in Uppsala, Sweden, with the first products coming in five years’ time. An agreement between three major companies, two investment funds, and a spin-off company from the Uppsala University Angstrom Solar Centre will be the launch pad for the new development.
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Friday 27th June 2003
Ultratech says that it has successfully developed what it believes to be the IC industrys first laser thermal processing (LTP) technology. The company believes that this will allow manufacturers to scale down to the 20nm technology node. The new technology is the result of nearly nine years of intensive development. LTP uses laser heating, which can be focused at specific areas of the wafer, rather than across the wafer as happens in furnaces or with rapid thermal processing (RTP).
Friday 27th June 2003
Basan has opened basan UK. Basan is a European distributor of cleanroom products and equipment.
Friday 27th June 2003
Daw Technologies has announced the continuation of long-term maintenance services for the specialist cleanroom facilities at the Scottish Microelectronics Centre (SMC). Daw was chosen to build the centre three years ago and has been closely involved with all subsequent expansions.
Friday 27th June 2003
SUSS MicroTec announced new capabilities for cost-effective 1X full-field lithography (1XFFL) with a package of four new technologies. Known collectively as SupraYield, the enhancements provide a high-performance 1XFFL solution for advanced thick-resist applications, such as wafer-level packaging, MEMS and optoelectronics.
Friday 27th June 2003
Micronas introduced what it calls "ActivePackage" – aimed at ridding a headache car manufacturers worldwide have shared for many years. During the life cycle of a car, several of the original integrated circuits (IC) that are designed in when the car is launched become obsolete - forcing car manufacturers to carry out expensive redesigns.
Friday 27th June 2003
Surface Technology Systems (STS) unveiled its Pro family of plasma etch and deposition tools aimed at the transition from the "technology driven" era of micro-electro-mechanical system (MEMS) technology into volume production.
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Friday 27th June 2003
Schlumberger announced that certain of its subsidiaries have signed a definitive agreement with a partnership led by Francisco Partners and Shah Management for the sale of the NPTest business unit.
Friday 27th June 2003
Oxford University is looking for partners to help it commercialise a simple treatment technique for purifying crude samples of single and multi-walled carbon nanotubes (SW and MW-CNTs) to produce a clean, well dispersed product currently containing greater than 90% semiconducting CNTs.
Friday 27th June 2003
X-FAB Semiconductor Foundries announced an expansion of its MEMS product line to include surface micromachining technology for absolute pressure sensors. The technology enables integration of absolute pressure sensors with X-FAB's CMOS technologies. The sensors can also be implemented as discrete components.
Tuesday 24th June 2003
The Taiwanese government has approved funding to set up a new innovative R&D Center for intense production-oriented technology transfer in Taiwan.
Tuesday 24th June 2003
BTG is to co-operate with Atmel on developing a UHF RFID ISO 18000-6 type A chip.
Tuesday 24th June 2003
ST Assembly Test Services (STATS) has qualified a “total” system-in-package (SiP) solution for PBGA, stPBGA and LGA packages along with surface mount manufacturing capability.

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