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Monday 16th June 2003
IBM and Infineon Technologies have succeeded in integrating 128kbit magnetic memory (MRAM) components into a high-performance logic base.
Monday 16th June 2003
German company Lotus Systems won the European Semiconductor/Wacker Siltronic Start-up award for 2003.
Monday 16th June 2003
Advanced Control Research (ACR) is developing a new microchip system designed to give prosthetic arm users more movement and control from artificial limbs.
Monday 16th June 2003
A number of companies released details of contributions to the VLSI Symposium this week in Japan.
Monday 16th June 2003
Legeritys flagship proprietary HV7high-voltage process completed qualification after only 9 months for production at Chartered Semiconductor Manufacturing in Singapore.
Friday 13th June 2003
DEK and PacTech USA have formed a solder bump technology partnership. By combining PacTech’s electroless under bump metallisation (UBM) processing with DEK’s mass imaging systems to create solder bumps, users can implement a wafer-level, SMT-compatible flip chip assembly process.
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Friday 13th June 2003
UK distributor Anders Electronics will be marketing in Europe flexible, plastic, electronic character displays based on a development by Citala, an Israel-based display specialist.
Friday 13th June 2003
Toshiba has developed and verified the operability of a memory cell technology for embedded DRAM system LSIs on silicon-on-insulator (SOI) wafers, claimed as a world first. Toshiba aims to apply the new technology to mass production of system LSIs for broadband network applications in 2006. Toshiba has experimentally fabricated a 96kbit cell array. Full details of the new technology were presented at the VLSI Symposium in Kyoto, Japan.
Friday 13th June 2003
Toshiba has developed and verified the operability of a memory cell technology for embedded DRAM system LSIs on silicon-on-insulator (SOI) wafers, claimed as a world first. Toshiba aims to apply the new technology to mass production of system LSIs for broadband network applications in 2006. Toshiba has experimentally fabricated a 96kbit cell array. Full details of the new technology were presented at the VLSI Symposium in Kyoto, Japan.
Friday 13th June 2003
DEK and PacTech USA have formed a solder bump technology partnership. By combining PacTech’s electroless under bump metallisation (UBM) processing with DEK’s mass imaging systems to create solder bumps, users can implement a wafer-level, SMT-compatible flip chip assembly process.
Thursday 12th June 2003
Sony plans to start mass production of "Super Top Emission" active-matrix full-colour organic light emitting diode (OLED) display panels from spring 2004. First phase production is planned to reach 300,000 2" panels a month.
Thursday 12th June 2003
The US Semiconductor Industry Association (SIA) issued its 2003-2006 mid-year forecast. The organisation is expecting 10.3% growth this year ($154.9bn), 16.8% next year ($180.9bn), 5.8% in 2005 ($191.5bn) and 7.0% in 2006 ($204.9bn). Over the forecast period, the compound annual growth rate is put at 9.8%.
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Thursday 12th June 2003
The US Semiconductor Industry Association (SIA) issued its 2003-2006 mid-year forecast. The organisation is expecting 10.3% growth this year ($154.9bn), 16.8% next year ($180.9bn), 5.8% in 2005 ($191.5bn) and 7.0% in 2006 ($204.9bn). Over the forecast period, the compound annual growth rate is put at 9.8%.
Wednesday 11th June 2003
Trikon Technologies has shipped a Planar 300 dielectric CVD system to a leading DRAM manufacturer.
Wednesday 11th June 2003
German company Lotus Systems won the European Semiconductor/Wacker Siltronic Start-up award for 2003. European Semiconductor editor David Ridsdale presented the award to Lotus CEO Joachim Mink at the Semiconductor 2003 conference in Edinburgh, Scotland.
Wednesday 11th June 2003
Infineon Technologies and Clariant’s AZ Electronic Materials business have signed an agreement to jointly develop photoresists for 157nm lithography. The goal is to accelerate qualification of this technology for volume production.
Wednesday 11th June 2003
Infineon Technologies and Clariant’s AZ Electronic Materials business have signed an agreement to jointly develop photoresists for 157nm lithography. The goal is to accelerate qualification of this technology for volume production.
Tuesday 10th June 2003
IBM and Infineon Technologies have succeeded in integrating 128kbit magnetic memory (MRAM) components into a high-performance logic base. The companies hope to accelerate the commercialisation of MRAM possibly replacing some of todays memory technologies as early as 2005. MRAM could lead to instant on computers, allowing users to turn computers on and off as quickly as a light switch.
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Tuesday 10th June 2003
IBM and Infineon Technologies have succeeded in integrating 128kbit magnetic memory (MRAM) components into a high-performance logic base. The companies hope to accelerate the commercialisation of MRAM possibly replacing some of todays memory technologies as early as 2005. MRAM could lead to instant on computers, allowing users to turn computers on and off as quickly as a light switch.
Monday 9th June 2003
IBM Mainz, Germany
Monday 9th June 2003
Annual Semiconductor Industry Meeting
Monday 9th June 2003
IBM Mainz, Germany - Online Auction Closing 17th June 2003. Wafer Fab Tools & Inspection including Veeco Ion Beam Mill, Micrion Focused Ion Beam, RIE Tools, Agilent Hard Disk Drive Head Test, Plasma Asher, Mobile Dessicators, Stainless Steel Trollies, ESD Chairs, Optical and Electronic Inspection, For full sale details: click here
Monday 9th June 2003
The Centre for Integrated Circuit & Systems at Singapores Nanyang Technological University (NTU) has successfully designed and manufactured a 10GHz voltage control oscillator (VCO) on Singapore foundry Chartered Semiconductor Manufacturings 0.18micron RF CMOS semiconductor process.
Monday 9th June 2003
Mykrolis and Nor-Cal Products have entered into a limited strategic cross distribution alliance to provide complementary chamber critical measurement and control technology to the global semiconductor equipment industry.

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